MT29F2T08EMLEEJ4-R:E TR Micron Technology Inc.
Виробник: Micron Technology Inc.
Description: TLC 2T 256GX8 VBGA QDP
Packaging: Tape & Reel (TR)
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.6V ~ 3.6V
Technology: FLASH - NAND (TLC)
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
Description: TLC 2T 256GX8 VBGA QDP
Packaging: Tape & Reel (TR)
Package / Case: 132-VBGA
Mounting Type: Surface Mount
Memory Size: 2Tbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.6V ~ 3.6V
Technology: FLASH - NAND (TLC)
Memory Format: FLASH
Supplier Device Package: 132-VBGA (12x18)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 256G x 8
DigiKey Programmable: Not Verified
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Технічний опис MT29F2T08EMLEEJ4-R:E TR Micron Technology Inc.
Description: TLC 2T 256GX8 VBGA QDP, Packaging: Tape & Reel (TR), Package / Case: 132-VBGA, Mounting Type: Surface Mount, Memory Size: 2Tbit, Memory Type: Non-Volatile, Operating Temperature: 0°C ~ 70°C, Voltage - Supply: 2.6V ~ 3.6V, Technology: FLASH - NAND (TLC), Memory Format: FLASH, Supplier Device Package: 132-VBGA (12x18), Part Status: Active, Memory Interface: Parallel, Memory Organization: 256G x 8, DigiKey Programmable: Not Verified.