MC9S12D64CPVE,557 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
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Технічний опис MC9S12D64CPVE,557 NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP, Packaging: Tray, Package / Case: 112-LQFP, Mounting Type: Surface Mount, Speed: 25MHz, Program Memory Size: 64KB (64K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 1K x 8, Core Processor: HCS12, Data Converters: A/D 16x10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V, Connectivity: CANbus, I²C, SCI, SPI, Peripherals: PWM, WDT, Supplier Device Package: 112-LQFP (20x20), Part Status: Active, Number of I/O: 91.