MB90673PF-G-269-BND-B Infineon Technologies
Виробник: Infineon Technologies
Description: IC MCU 16BIT 48KB MROM 80PQFP
Packaging: Tray
Package / Case: 80-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-16L
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, UART/USART
Peripherals: POR, WDT
Supplier Device Package: 80-QFP (14x20)
Part Status: Obsolete
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB MROM 80PQFP
Packaging: Tray
Package / Case: 80-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-16L
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, UART/USART
Peripherals: POR, WDT
Supplier Device Package: 80-QFP (14x20)
Part Status: Obsolete
Number of I/O: 65
DigiKey Programmable: Not Verified
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Технічний опис MB90673PF-G-269-BND-B Infineon Technologies
Description: IC MCU 16BIT 48KB MROM 80PQFP, Packaging: Tray, Package / Case: 80-BQFP, Mounting Type: Surface Mount, Speed: 16MHz, Program Memory Size: 48KB (48K x 8), RAM Size: 2K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Program Memory Type: Mask ROM, Core Processor: F²MC-16L, Data Converters: A/D 8x8/10b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: EBI/EMI, SCI, UART/USART, Peripherals: POR, WDT, Supplier Device Package: 80-QFP (14x20), Part Status: Obsolete, Number of I/O: 65, DigiKey Programmable: Not Verified.