LPC18S50FET256551 NXP USA Inc.
Виробник: NXP USA Inc.Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Part Status: Active
Number of I/O: 164
DigiKey Programmable: Not Verified
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Технічний опис LPC18S50FET256551 NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256LBGA, Packaging: Bulk, Package / Case: 256-LBGA, Mounting Type: Surface Mount, Speed: 180MHz, RAM Size: 200K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 8x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT, Supplier Device Package: 256-LBGA (17x17), Part Status: Active, Number of I/O: 164, DigiKey Programmable: Not Verified.