IRG4CC50UB Infineon Technologies
Виробник: Infineon TechnologiesDescription: IGBT DIE
Packaging: Box
Package / Case: Die
Mounting Type: Through Hole
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 10A
Supplier Device Package: Die
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 600 V
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Технічний опис IRG4CC50UB Infineon Technologies
Description: IGBT DIE, Packaging: Box, Package / Case: Die, Mounting Type: Through Hole, Input Type: Standard, Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 10A, Supplier Device Package: Die, Current - Collector (Ic) (Max): 55 A, Voltage - Collector Emitter Breakdown (Max): 600 V.