IPC0208-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
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Технічний опис IPC0208-S Chip Quik Inc.
Description: POWERQSOP-16 (0.635 MM PITCH 4.9, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.025" (0.64mm), Type: PowerQSOP, Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm), Number of Positions: 16.