IPC0205 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
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Технічний опис IPC0205 Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0., Packaging: Bulk, Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm), Material: FR4 Epoxy Glass, Number of Positions: 12, Pitch: 0.031" (0.80mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: LGA, Part Status: Active.