IPC0200 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTSSOP
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTSSOP
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Технічний опис IPC0200 Chip Quik Inc.
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER, Packaging: Bulk, Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm), Material: FR4 Epoxy Glass, Number of Positions: 56, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: HTSSOP.