IPC0200-S Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Number of Positions: 56
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Number of Positions: 56
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Технічний опис IPC0200-S Chip Quik Inc.
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: HTSSOP, Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm), Number of Positions: 56.