IPC0199 Chip Quik Inc.
Виробник: Chip Quik Inc.
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
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Технічний опис IPC0199 Chip Quik Inc.
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5, Packaging: Bulk, Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm), Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: BGA.