HSS15-B20-P40 CUI Devices
Виробник: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 23.
Packaging: Box
Material: Aluminum Alloy
Length: 1.500" (38.10mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.921" (23.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 5.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 8.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.16°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
на замовлення 4813 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 49.36 грн |
| 10+ | 45.26 грн |
| 25+ | 43.02 грн |
| 50+ | 39.31 грн |
| 100+ | 38.77 грн |
| 250+ | 37.4 грн |
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Технічний опис HSS15-B20-P40 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 23., Packaging: Box, Material: Aluminum Alloy, Length: 1.500" (38.10mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.921" (23.40mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 5.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 8.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.16°C/W, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.