HD6417751F167IV Renesas Electronics America Inc
Виробник: Renesas Electronics America Inc
Description: IC MCU 32BIT ROMLESS 256HQFP
Packaging: Tray
Package / Case: 256-BFQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 167MHz
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: SH-4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.6V ~ 2V
Connectivity: EBI/EMI, FIFO, SCI, SmartCard
Peripherals: DMA, POR, WDT
Supplier Device Package: 256-HQFP (28x28)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256HQFP
Packaging: Tray
Package / Case: 256-BFQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 167MHz
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: SH-4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.6V ~ 2V
Connectivity: EBI/EMI, FIFO, SCI, SmartCard
Peripherals: DMA, POR, WDT
Supplier Device Package: 256-HQFP (28x28)
Number of I/O: 39
DigiKey Programmable: Not Verified
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Технічний опис HD6417751F167IV Renesas Electronics America Inc
Description: IC MCU 32BIT ROMLESS 256HQFP, Packaging: Tray, Package / Case: 256-BFQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 167MHz, RAM Size: 24K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Program Memory Type: ROMless, Core Processor: SH-4, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.6V ~ 2V, Connectivity: EBI/EMI, FIFO, SCI, SmartCard, Peripherals: DMA, POR, WDT, Supplier Device Package: 256-HQFP (28x28), Number of I/O: 39, DigiKey Programmable: Not Verified.