FEMC008GSTE9-T13-16 Flexxon Pte Ltd
Виробник: Flexxon Pte Ltd
Description: XTRA III EMMC 5.1 8GB MLC DIAMON
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (MLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 100-FBGA (14x18)
Memory Interface: eMMC_5.1
Memory Organization: 8G x 8
Description: XTRA III EMMC 5.1 8GB MLC DIAMON
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Memory Size: 64Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NAND (MLC)
Clock Frequency: 200 MHz
Memory Format: FLASH
Supplier Device Package: 100-FBGA (14x18)
Memory Interface: eMMC_5.1
Memory Organization: 8G x 8
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис FEMC008GSTE9-T13-16 Flexxon Pte Ltd
Description: XTRA III EMMC 5.1 8GB MLC DIAMON, Packaging: Tray, Package / Case: 100-LBGA, Mounting Type: Surface Mount, Memory Size: 64Gbit, Memory Type: Non-Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 2.7V ~ 3.6V, Technology: FLASH - NAND (MLC), Clock Frequency: 200 MHz, Memory Format: FLASH, Supplier Device Package: 100-FBGA (14x18), Memory Interface: eMMC_5.1, Memory Organization: 8G x 8.