EVSF100-25 CR Technology
Виробник: CR Technology
Description: Thermal Pad (EverTherm)
Packaging: Sheet
Color: White
Thickness: 0.0394" (1.000mm)
Type: Gap Filler Pad, Sheet
Thermal Resistivity: 0.9°C/W
Usage: Thermally Conductive
Outline: 200.00mm x 300.00mm
Thermal Conductivity: 1.5W/m-K
Part Status: Active
Description: Thermal Pad (EverTherm)
Packaging: Sheet
Color: White
Thickness: 0.0394" (1.000mm)
Type: Gap Filler Pad, Sheet
Thermal Resistivity: 0.9°C/W
Usage: Thermally Conductive
Outline: 200.00mm x 300.00mm
Thermal Conductivity: 1.5W/m-K
Part Status: Active
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 3890.62 грн |
5+ | 3371.88 грн |
10+ | 2997.22 грн |
25+ | 2461.18 грн |
50+ | 2109.58 грн |
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Технічний опис EVSF100-25 CR Technology
Description: Thermal Pad (EverTherm), Packaging: Sheet, Color: White, Thickness: 0.0394" (1.000mm), Type: Gap Filler Pad, Sheet, Thermal Resistivity: 0.9°C/W, Usage: Thermally Conductive, Outline: 200.00mm x 300.00mm, Thermal Conductivity: 1.5W/m-K, Part Status: Active.