CY9AFB42NABGL-GK9E1 Infineon Technologies
Виробник: Infineon Technologies
Description: IC MCU 32BIT 160KB FLASH 112FBGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I²C, UART/USART, USB
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 160KB FLASH 112FBGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I²C, UART/USART, USB
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Part Status: Active
Number of I/O: 83
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Технічний опис CY9AFB42NABGL-GK9E1 Infineon Technologies
Description: IC MCU 32BIT 160KB FLASH 112FBGA, Packaging: Tray, Package / Case: 112-LFBGA, Mounting Type: Surface Mount, Speed: 40MHz, Program Memory Size: 160KB (160K x 8), RAM Size: 16K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 24x12b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Connectivity: CSIO, EBI/EMI, I²C, UART/USART, USB, Peripherals: DMA, LCD, LVD, POR, PWM, WDT, Supplier Device Package: 112-PFBGA (10x10), Part Status: Active, Number of I/O: 83.