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BGA0030 Chip Quik Inc.
![BGA0030.pdf](/images/adobe-acrobat.png)
Description: BGA-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 2983.43 грн |
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Технічний опис BGA0030 Chip Quik Inc.
Description: BGA-36 TO DIP-36 SMT ADAPTER (0., Packaging: Bulk, Size / Dimension: 0.700" L x 1.800" W (17.78mm x 45.72mm), Material: FR4 Epoxy Glass, Number of Positions: 36, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: BGA.