BD9596MWV-E2 Rohm Semiconductor
Виробник: Rohm Semiconductor
Description: PMIC, INTEL CHIP
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 3.5V ~ 5.5V
Applications: Power Management - Communications, Storage, Embedded Computing & High Density Multi-Rail Systems
Supplier Device Package: UQFN88MV0100
Description: PMIC, INTEL CHIP
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 3.5V ~ 5.5V
Applications: Power Management - Communications, Storage, Embedded Computing & High Density Multi-Rail Systems
Supplier Device Package: UQFN88MV0100
товар відсутній
Відгуки про товар
Написати відгук
Технічний опис BD9596MWV-E2 Rohm Semiconductor
Description: PMIC, INTEL CHIP, Packaging: Tape & Reel (TR), Package / Case: 88-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 95°C, Voltage - Supply: 3.5V ~ 5.5V, Applications: Power Management - Communications, Storage, Embedded Computing & High Density Multi-Rail Systems, Supplier Device Package: UQFN88MV0100.