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70-5022-0910 Kester Solder
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Description: SOLDER PASTE WP616 500GM JAR
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
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Технічний опис 70-5022-0910 Kester Solder
Description: SOLDER PASTE WP616 500GM JAR, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Form: Jar, 17.64 oz (500g), Mesh Type: 4, Process: Lead Free, Flux Type: Water Soluble, Part Status: Active, Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.