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70-0605-0911 Kester Solder
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Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
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Технічний опис 70-0605-0911 Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM, Packaging: Bulk, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Type: Solder Paste, Melting Point: 423 ~ 424°F (217 ~ 218°C), Form: Cartridge, 21.16 oz (600g), Mesh Type: 4, Process: Lead Free, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C), Shelf Life Start: Date of Manufacture, Shelf Life: 4 Months.