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70-0102-0510 Kester Solder
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Description: SOLDERPASTE NO CLEAN 63/37 500GM
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
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Технічний опис 70-0102-0510 Kester Solder
Description: SOLDERPASTE NO CLEAN 63/37 500GM, Packaging: Jar, Composition: Sn63Pb37 (63/37), Type: Solder Paste, Melting Point: 361°F (183°C), Form: Jar, 17.64 oz (500g), Mesh Type: 3, Process: Leaded, Flux Type: No-Clean, Part Status: Active, Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C), Shelf Life Start: Date of Manufacture, Shelf Life: 6 Months.