Виробник: Nexperia USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Current - Quiescent (Iq): 1 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 90 MHz
Input Capacitance: 1.5 pF
Supplier Device Package: 5-TSSOP
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1

Виробник: Nexperia
Flip-Flops 74AHC1G79GW/SOT353/UMT5

Виробник: Nexperia USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Current - Quiescent (Iq): 1 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 90 MHz
Input Capacitance: 1.5 pF
Supplier Device Package: 5-TSSOP
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1

Виробник: 3M
Description: CONN HEADER VERT 10POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.5A
Mounting Type: Through Hole
Number of Positions: 10
Number of Rows: 2
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.145" (3.68mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.480" (12.19mm)
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.235" (5.97mm)

Виробник: EDAC
D-Sub High Density Connectors D SUB PLUG RA HD .350 FP

Виробник: EDAC Inc.
Description: CONN D-SUB HD PLUG 15P R/A SLDR
Features: Board Lock, Grounding Indents, Shielded
Packaging: Bulk
Connector Type: Plug, Male Pins
Contact Finish: Gold
Current Rating (Amps): 5A
Mounting Type: Panel Mount, Through Hole, Right Angle
Number of Positions: 15
Number of Rows: 3
Contact Type: Signal
Flange Feature: Housing/Shell (4-40)
Termination: Solder
Connector Style: D-Sub, High Density
Contact Finish Thickness: FLASH
Material Flammability Rating: UL94 V-0
Shell Material, Finish: Steel, Nickel Plated
Shell Size, Connector Layout: 1 (DE, E) High Density
Backset Spacing: 0.350" (8.89mm)

Виробник: NEXPERIA
Flip Flop D-Type Pos-Edge 1-Element 5-Pin TSSOP T/R

Виробник: Nexperia USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Current - Quiescent (Iq): 1 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 90 MHz
Input Capacitance: 1.5 pF
Supplier Device Package: 5-TSSOP
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1

Виробник: NXP Semiconductors
Flip Flop D-Type Pos-Edge 1-Element 5-Pin TSSOP

Виробник: 3M Electronic Solutions Division
Headers & Wire Housings 10P PIN STRIP HEADER STRAIGHT, GOLD, 2ROW