![289-PRS17001-12 289-PRS17001-12](https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/937/289-PRS17001-12.jpg)
289-PRS17001-12 Aries Electronics
![10004-pga-zif-test-and-burn-in-socket.pdf](/images/adobe-acrobat.png)
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна без ПДВ |
---|---|
1+ | 8533.08 грн |
10+ | 7540.67 грн |
25+ | 7250.6 грн |
50+ | 6577.61 грн |
Відгуки про товар
Написати відгук
Технічний опис 289-PRS17001-12 Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: PGA, ZIF (ZIP), Operating Temperature: -65°C ~ 125°C, Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.