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2-640361-4 TE Connectivity

DDEController?Action=srchrtrv&DocNm=640361&DocType=Customer+Drawing&DocLang=English Виробник: TE Connectivity
26403614-TEC Standard DIP sockets
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Технічний опис 2-640361-4 TE Connectivity

Description: CONN IC DIP SOCKET 24POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 15.0µin (0.38µm), Contact Material - Post: Beryllium Copper.

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2-640361-4 2-640361-4 Виробник : TE Connectivity AMP Connectors DDEController?Action=srchrtrv&DocNm=640361&DocType=Customer+Drawing&DocLang=English Description: CONN IC DIP SOCKET 24POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15.0µin (0.38µm)
Contact Material - Post: Beryllium Copper
товар відсутній