15-80-0223 Molex
Виробник: Molex
Headers & Wire Housings 2.54mm Pitch C-Grid Header Through Hole without Peg Dual Row Vertical Shrouded High Temperature 22 Circuits 0.38um Gold (Au) Selective Plating Tin (Sn) PC Tail Plating
Headers & Wire Housings 2.54mm Pitch C-Grid Header Through Hole without Peg Dual Row Vertical Shrouded High Temperature 22 Circuits 0.38um Gold (Au) Selective Plating Tin (Sn) PC Tail Plating
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Технічний опис 15-80-0223 Molex
Headers & Wire Housings 2.54mm Pitch C-Grid Header Through Hole without Peg Dual Row Vertical Shrouded High Temperature 22 Circuits 0.38um Gold (Au) Selective Plating Tin (Sn) PC Tail Plating.