Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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510-83-100-15-001101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 100 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-100-15-101101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 100 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-101-11-001101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 101 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-101-13-001101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 101 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-101-13-061101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 101 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-101-15-101101 | Preci-Dip |
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510-83-107-12-051101 | Preci-Dip |
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510-83-108-12-051101 | Preci-Dip |
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510-83-109-12-051101 | Preci-Dip |
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510-83-114-13-001101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 114 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-114-13-061101 | Preci-Dip |
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510-83-114-13-062101 | Preci-Dip |
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510-83-120-13-001101 | Preci-Dip |
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510-83-120-13-061101 | Preci-Dip |
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510-83-121-11-000101 | Preci-Dip |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 121 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-121-13-001101 | Preci-Dip |
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510-83-121-13-041101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 121 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-121-13-061101 | Preci-Dip |
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510-83-121-15-001101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 121 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-121-15-061101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 121 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-124-13-001101 | Preci-Dip |
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510-83-124-13-041101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 124 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-125-13-041101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 125 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-128-13-041101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 128 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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510-83-128-13-042101 | Preci-Dip |
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510-83-128-13-043101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 128 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-128-13-071101 | Preci-Dip |
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510-83-132-13-001101 | Preci-Dip |
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510-83-132-13-002101 | Preci-Dip |
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510-83-132-13-041101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 132 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-132-13-042101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 132 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-132-14-001101 | Preci-Dip |
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510-83-132-14-071101 | Preci-Dip |
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510-83-133-13-001101 | Preci-Dip |
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510-83-133-13-002101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 133 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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510-83-133-13-041101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 133 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-133-13-043101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 133 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-133-14-071101 | Preci-Dip |
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510-83-135-14-051101 | Preci-Dip |
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510-83-136-14-051101 | Preci-Dip |
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510-83-142-15-081101 | Preci-Dip |
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510-83-143-15-081101 | Preci-Dip |
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510-83-144-12-000101 | Preci-Dip |
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510-83-144-13-001101 | Preci-Dip |
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510-83-144-13-041101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 144 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-144-15-001101 | Preci-Dip |
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510-83-144-15-081101 | Preci-Dip |
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510-83-145-13-041101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 145 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-145-15-001101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 145 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-145-15-002101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 145 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-145-15-081101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 145 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-145-17-001101 | Preci-Dip |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 145 (17 x 17) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-146-15-061101 | Preci-Dip |
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510-83-148-15-061101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 148 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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510-83-148-15-062101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 148 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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510-83-149-15-003101 | Preci-Dip |
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510-83-149-15-061101 | Preci-Dip |
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510-83-149-15-063101 | Preci-Dip |
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510-83-149-15-064101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 149 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
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510-83-153-15-061101 | Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 153 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
товар відсутній |
510-83-100-15-001101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 100POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 100POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-100-15-101101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 100POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 100POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 100 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-101-11-001101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 101POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 101 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 101POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 101 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-101-13-001101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 101POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 101 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 101POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 101 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-101-13-061101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 101POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 101 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 101POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 101 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-114-13-001101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 114POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 114 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 114POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 114 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-121-11-000101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-121-13-041101 |
![]() |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-121-15-001101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-121-15-061101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 121POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 121 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-124-13-041101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 124POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 124 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 124POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 124 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-125-13-041101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 125POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 125 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 125POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 125 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-128-13-041101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 128POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 128 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 128POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 128 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
510-83-128-13-043101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 128POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 128 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 128POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 128 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-132-13-041101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 132POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 132POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-132-13-042101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 132POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 132POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-133-13-002101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 133POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 133POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
510-83-133-13-041101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 133POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 133POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-133-13-043101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 133POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 133POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 133 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-144-13-041101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 144POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 144 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 144POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 144 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-145-13-041101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-145-15-001101 |
![]() |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-145-15-002101 |
![]() |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-145-15-081101 |
![]() |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-145-17-001101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (17 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 145POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 145 (17 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-148-15-061101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 148POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 148 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 148POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 148 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
510-83-148-15-062101 |
![]() |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 148POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 148 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 148POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 148 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній
510-83-149-15-064101 |
![]() |
Виробник: Preci-Dip
Description: CONN SOCKET PGA 149POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 149 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN SOCKET PGA 149POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 149 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
товар відсутній
510-83-153-15-061101 |
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Виробник: Preci-Dip
Description: CONN SOCKET PGA 153POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 153 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET PGA 153POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 153 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
товар відсутній