Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35440) > Сторінка 582 з 591
Фото | Назва | Виробник | Інформація |
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74LVC1G14GN,132 | NXP USA Inc. |
Description: IC INVERT SCHMITT 1CH 1INP 6XSON Features: Schmitt Trigger Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 1 Supplier Device Package: 6-XSON (0.9x1) Input Logic Level - High: 1.14V ~ 2.79V Input Logic Level - Low: 0.46V ~ 1.58V Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
на замовлення 166794 шт: термін постачання 21-31 дні (днів) |
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MCHC908QY4VDWE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
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MCHC908QY4VDWER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
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IW416HN/A1CMP | NXP USA Inc. |
Description: IC RF TXRX 802.15.4 68HVQFN Packaging: Tape & Reel (TR) Package / Case: 68-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: 0°C ~ 70°C Voltage - Supply: 1.05V, 1.8V, 2.2V Power - Output: 21dBm Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA Current - Receiving: 5µA ~ 60mA Data Rate (Max): 150Mbps Current - Transmitting: 240µA ~ 325mA Supplier Device Package: 68-HVQFN (8x8) Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART |
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IW416HN/A1CK | NXP USA Inc. |
Description: IC RF TXRX 802.15.4 68HVQFN Packaging: Tray Package / Case: 68-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: 0°C ~ 70°C Voltage - Supply: 1.05V, 1.8V, 2.2V Power - Output: 21dBm Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA Current - Receiving: 5µA ~ 60mA Data Rate (Max): 150Mbps Current - Transmitting: 240µA ~ 325mA Supplier Device Package: 68-HVQFN (8x8) Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART |
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88MW322-A0-NXUC/AK | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 88HVQFN Packaging: Tray Package / Case: 88-VFQFN Exposed Pad Sensitivity: -96.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB RAM, 128kB ROM Type: TxRx + MCU Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.4V ~ 5.25V Power - Output: 26dBm Protocol: 802.11n/g/b, Bluetooth Current - Receiving: 29.3mA ~ 45.2mA Data Rate (Max): 72.2Mbps Current - Transmitting: 27.6mA ~ 183.3mA Supplier Device Package: 88-HVQFN (10x10) GPIO: 50 Modulation: DSSS, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART |
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MCF51QU128VHS | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA Packaging: Bulk Package / Case: 44-VFLGA Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 11x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 44-MAPLGA (5x5) Number of I/O: 31 DigiKey Programmable: Not Verified |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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MCF51QU128VHS | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA Packaging: Tray Package / Case: 44-VFLGA Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 11x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 44-MAPLGA (5x5) Number of I/O: 31 DigiKey Programmable: Not Verified |
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MC34FS6408NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, CAN, 5V , 1.5 Packaging: Bulk Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2.7V ~ 36V Applications: System Basis Chip Current - Supply: 13mA Supplier Device Package: 48-LQFP (7x7) |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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MC34712EP | NXP USA Inc. |
Description: SWITCH-MODE POWER SUPPLY, FULLY Packaging: Bulk Package / Case: 24-VFQFN Exposed Pad Voltage - Output: 0.7V ~ 1.35V Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 3V ~ 6V Operating Temperature: -40°C ~ 85°C Applications: Converter, DDR Supplier Device Package: 24-QFN-EP (4x4) |
на замовлення 2450 шт: термін постачання 21-31 дні (днів) |
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MC908AZ32ACFU | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 40 DigiKey Programmable: Not Verified |
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74HCT132PW,118 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14TSSOP Features: Schmitt Trigger Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.9V ~ 2.1V Input Logic Level - Low: 0.5V ~ 0.6V Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
на замовлення 53845 шт: термін постачання 21-31 дні (днів) |
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PESD24VS2UQ,115 | NXP USA Inc. |
Description: TVS DIODE 24VWM 70VC SOT663 Packaging: Bulk |
на замовлення 2466717 шт: термін постачання 21-31 дні (днів) |
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MC9RS08KB8CWJ | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Number of I/O: 18 DigiKey Programmable: Not Verified |
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S912XEP768BVAL | NXP USA Inc. |
Description: IC MCU 16BIT 768KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 768KB (768K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 |
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S9KEAZN64BMLCR | NXP USA Inc. |
Description: IC MCU Packaging: Tape & Reel (TR) |
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S9KEAZN64BMLC | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
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MPF5030BMMA4ES | NXP USA Inc. |
Description: PMIC 3 BUCKS 2 LDO A1 DIE Packaging: Tray Package / Case: 40-PowerVFQFN Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.3V ~ 5.25V Applications: System Basis Chip Supplier Device Package: 40-HVQFN (6x6) |
на замовлення 395 шт: термін постачання 21-31 дні (днів) |
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MCIMX6G1AVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
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PCA9511ADP,118 | NXP USA Inc. |
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Number of Channels: 1 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, Accelerator Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C - Hotswap Current - Supply: 6mA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Capacitance - Input: 7 pF |
на замовлення 107500 шт: термін постачання 21-31 дні (днів) |
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PCA9511ADP,118 | NXP USA Inc. |
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Number of Channels: 1 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, Accelerator Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 5.5V Applications: I2C - Hotswap Current - Supply: 6mA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Capacitance - Input: 7 pF |
на замовлення 108103 шт: термін постачання 21-31 дні (днів) |
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BC857AW,135 | NXP USA Inc. |
Description: NOW NEXPERIA BC857AW - SMALL SIG Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT-323 Grade: Automotive Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 200 mW Qualification: AEC-Q101 |
на замовлення 310000 шт: термін постачання 21-31 дні (днів) |
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MPC8360EZUAJDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 740TBGA Packaging: Tray Package / Case: 740-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 740-TBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
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BTA312X-600B,127 | NXP USA Inc. |
Description: TRIAC 600V 12A TO-220F Packaging: Bulk |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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74LVC1G07GX,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 5X2SON Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 5-X2SON (0.80x0.80) |
на замовлення 92150 шт: термін постачання 21-31 дні (днів) |
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BTA204-800B,127 | NXP USA Inc. |
Description: TRIAC 800V 4A TO220AB Packaging: Bulk |
на замовлення 5947 шт: термін постачання 21-31 дні (днів) |
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BTA204-600D,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 4A TO220AB Packaging: Bulk |
на замовлення 11967 шт: термін постачання 21-31 дні (днів) |
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MIMXRT685SFVKBR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 176VFBGA Packaging: Tape & Reel (TR) Package / Case: 176-VFBGA Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 176-VFBGA (9x9) Number of I/O: 96 |
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MIMXRT685SFVKBR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 176VFBGA Packaging: Cut Tape (CT) Package / Case: 176-VFBGA Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 176-VFBGA (9x9) Number of I/O: 96 |
на замовлення 998 шт: термін постачання 21-31 дні (днів) |
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MIMXRT685SFFOBR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 249FOWLP Packaging: Cut Tape (CT) Package / Case: 249-WFBGA Mounting Type: Surface Mount Speed: 300MHz RAM Size: 4.5M x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M33 Data Converters: A/D 12x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 249-FOWLP (7x7) Number of I/O: 147 |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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74HC139D,653 | NXP USA Inc. |
Description: IC DECODER/DEMUX DUAL 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
на замовлення 388822 шт: термін постачання 21-31 дні (днів) |
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BCW61C,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 32V 100MA SOT23 Packaging: Bulk |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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74AHC374D,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 5.5V Current - Quiescent (Iq): 4 µA Current - Output High, Low: 8mA, 8mA Trigger Type: Positive Edge Clock Frequency: 120 MHz Input Capacitance: 3 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 10.1ns @ 5V, 50pF Number of Bits per Element: 8 |
на замовлення 4098 шт: термін постачання 21-31 дні (днів) |
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MPC852TCZT50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
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1N4730A,113 | NXP USA Inc. |
Description: DIODE ZENER 3.9V 1W DO41 Packaging: Bulk |
на замовлення 91773 шт: термін постачання 21-31 дні (днів) |
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1N4730A,133 | NXP USA Inc. |
Description: DIODE ZENER 3.9V 1W DO41 Tolerance: ±5% Packaging: Bulk Package / Case: DO-204AL, DO-41, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 3.9 V Impedance (Max) (Zzt): 9 Ohms Supplier Device Package: DO-41 Power - Max: 1 W Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA Current - Reverse Leakage @ Vr: 50 µA @ 1 V |
на замовлення 41850 шт: термін постачання 21-31 дні (днів) |
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MPXV2202GC6T1 | NXP USA Inc. |
Description: SENSOR 29.01PSIG 0.13" .04V Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SMD, Gull Wing, Top Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Vented Gauge Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Port Style: Barbless Maximum Pressure: 58.02PSI (400kPa) |
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74HCT4017D,652 | NXP USA Inc. |
Description: IC DECADE COUNTER 10BIT 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C (TA) Direction: Up Trigger Type: Positive, Negative Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 4.5 V ~ 5.5 V Count Rate: 67 MHz Number of Bits per Element: 10 |
на замовлення 3850 шт: термін постачання 21-31 дні (днів) |
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PTN36043BBXY | NXP USA Inc. |
Description: IC Packaging: Cut Tape (CT) Package / Case: 18-XFQFN Exposed Pad Delay Time: 500ps (Max) Number of Channels: 2 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Applications: USB Type C Current - Supply: 113mA Supplier Device Package: 18-X2QFN (2.4x2) Signal Conditioning: Input Equalization, Output De-Emphasis |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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LPC865M201JHI48/0K | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48VFQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, I3C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 42 |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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PTN36242LBS,518 | NXP USA Inc. |
Description: IC REDRIVER USB 3.0 2CH 32HVQFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Delay Time: 0.4ns Number of Channels: 2 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: 0°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Applications: USB 3.0 Current - Supply: 225mA Supplier Device Package: 32-HVQFN (3x6) Signal Conditioning: Input Equalization, Output De-Emphasis |
на замовлення 7900 шт: термін постачання 21-31 дні (днів) |
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SPC5604PF1VLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 30x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 68 DigiKey Programmable: Not Verified |
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SPC5644AF0MMG2R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 208MAPBGA Packaging: Cut Tape (CT) Package / Case: 208-BGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 4MB (4M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-BGA (17x17) Number of I/O: 120 DigiKey Programmable: Not Verified |
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LFVBSK77CZWA | NXP USA Inc. |
Description: QORIVVA MPC5777C 416 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5777C Accessory Type: Base Board |
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C9KEAZN16AMLC | NXP USA Inc. |
Description: IC Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 57 |
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BFU520XRVL | NXP USA Inc. |
Description: RF TRANS NPN 12V 10.5GHZ SOT143R Packaging: Bulk Package / Case: SOT-143R Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 17.5dB Power - Max: 450mW Current - Collector (Ic) (Max): 30mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V Frequency - Transition: 10.5GHz Noise Figure (dB Typ @ f): 1dB @ 1.8GHz Supplier Device Package: SOT-143R |
на замовлення 3868 шт: термін постачання 21-31 дні (днів) |
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PQMD12Z | NXP USA Inc. |
Description: NOW NEXPERIA PQMD - SMALL SIGNAL Packaging: Bulk Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual) Power - Max: 350mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Frequency - Transition: 230MHz, 180MHz Resistor - Base (R1): 47kOhms Resistor - Emitter Base (R2): 47kOhms Supplier Device Package: DFN1010B-6 |
на замовлення 1453189 шт: термін постачання 21-31 дні (днів) |
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MC7447AVU1167NB | NXP USA Inc. |
Description: IC MPU MPC74XX 1.167GHZ 360BGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.167GHZ Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
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MC33FS8530A0KSR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MC33FS8530A0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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LS1023ASE7QQB | NXP USA Inc. |
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
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MC33FS8435G0ES | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MIMXRT1189JVM8B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
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74HC03PW,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-TSSOP Features: Open Drain Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: -, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
на замовлення 14127 шт: термін постачання 21-31 дні (днів) |
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MWCT1015SFVLLPR | NXP USA Inc. |
Description: WCT1015,NO CSEC/CAN-FD Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: Wireless Power Transmitter Supplier Device Package: 100-LQFP (14x14) Grade: Automotive |
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MWCT1015SFVLLP | NXP USA Inc. |
Description: WCT1015,NO CSEC/CAN-FD Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: Wireless Power Transmitter Supplier Device Package: 100-LQFP (14x14) Grade: Automotive |
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BTA201-600B,112 | NXP USA Inc. |
Description: TRIAC 600V 1A TO92-3 Packaging: Bulk |
на замовлення 9458 шт: термін постачання 21-31 дні (днів) |
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M86207G12 | NXP USA Inc. |
Description: IC TELECOM INTERFACE 625BGA Packaging: Tray |
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MC68HC908QY2CDTE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
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MC9S08SH4CWJR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 20SOIC Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-SOIC Number of I/O: 17 DigiKey Programmable: Not Verified |
на замовлення 115077 шт: термін постачання 21-31 дні (днів) |
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74LVC1G14GN,132 |
Виробник: NXP USA Inc.
Description: IC INVERT SCHMITT 1CH 1INP 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.14V ~ 2.79V
Input Logic Level - Low: 0.46V ~ 1.58V
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: IC INVERT SCHMITT 1CH 1INP 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.14V ~ 2.79V
Input Logic Level - Low: 0.46V ~ 1.58V
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
на замовлення 166794 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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2882+ | 6.99 грн |
MCHC908QY4VDWE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
товар відсутній
MCHC908QY4VDWER |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
товар відсутній
IW416HN/A1CMP |
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
товар відсутній
IW416HN/A1CK |
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
товар відсутній
88MW322-A0-NXUC/AK |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tray
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Description: IC RF TXRX+MCU BLE 88HVQFN
Packaging: Tray
Package / Case: 88-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB RAM, 128kB ROM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.4V ~ 5.25V
Power - Output: 26dBm
Protocol: 802.11n/g/b, Bluetooth
Current - Receiving: 29.3mA ~ 45.2mA
Data Rate (Max): 72.2Mbps
Current - Transmitting: 27.6mA ~ 183.3mA
Supplier Device Package: 88-HVQFN (10x10)
GPIO: 50
Modulation: DSSS, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
товар відсутній
MCF51QU128VHS |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
на замовлення 490 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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80+ | 265.58 грн |
MCF51QU128VHS |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Tray
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 11x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
товар відсутній
MC34FS6408NAE |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, CAN, 5V , 1.5
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-LQFP (7x7)
Description: SYSTEM BASIS CHIP, CAN, 5V , 1.5
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 36V
Applications: System Basis Chip
Current - Supply: 13mA
Supplier Device Package: 48-LQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
42+ | 514.71 грн |
MC34712EP |
Виробник: NXP USA Inc.
Description: SWITCH-MODE POWER SUPPLY, FULLY
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
Description: SWITCH-MODE POWER SUPPLY, FULLY
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
на замовлення 2450 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
93+ | 226.45 грн |
MC908AZ32ACFU |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
74HCT132PW,118 |
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.9V ~ 2.1V
Input Logic Level - Low: 0.5V ~ 0.6V
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
на замовлення 53845 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2597+ | 8.59 грн |
PESD24VS2UQ,115 |
на замовлення 2466717 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5079+ | 4.19 грн |
MC9RS08KB8CWJ |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
товар відсутній
S912XEP768BVAL |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
товар відсутній
MPF5030BMMA4ES |
Виробник: NXP USA Inc.
Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 395 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 419.41 грн |
10+ | 368.96 грн |
25+ | 361.88 грн |
40+ | 337.15 грн |
80+ | 302.52 грн |
230+ | 301.39 грн |
MCIMX6G1AVM05AB |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товар відсутній
PCA9511ADP,118 |
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
на замовлення 107500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2500+ | 85.89 грн |
PCA9511ADP,118 |
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
на замовлення 108103 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 143.95 грн |
10+ | 124.53 грн |
25+ | 117.46 грн |
100+ | 93.9 грн |
250+ | 88.17 грн |
500+ | 77.62 грн |
BC857AW,135 |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BC857AW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
Description: NOW NEXPERIA BC857AW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
на замовлення 310000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
13172+ | 1.4 грн |
MPC8360EZUAJDGA |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товар відсутній
BTA312X-600B,127 |
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
600+ | 34.95 грн |
74LVC1G07GX,125 |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Description: IC BUFFER NON-INVERT 5.5V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-X2SON (0.80x0.80)
на замовлення 92150 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5017+ | 4.3 грн |
BTA204-800B,127 |
на замовлення 5947 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1111+ | 18.87 грн |
BTA204-600D,127 |
на замовлення 11967 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1145+ | 18.17 грн |
MIMXRT685SFVKBR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
товар відсутній
MIMXRT685SFVKBR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Cut Tape (CT)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Cut Tape (CT)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
на замовлення 998 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1326.7 грн |
10+ | 1134.15 грн |
25+ | 1081.52 грн |
50+ | 979.13 грн |
100+ | 944.5 грн |
250+ | 900.5 грн |
500+ | 854.28 грн |
MIMXRT685SFFOBR |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 147
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 147
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1573.37 грн |
10+ | 1410.57 грн |
25+ | 1395.48 грн |
50+ | 1277.3 грн |
100+ | 1121.27 грн |
250+ | 1083.45 грн |
500+ | 1037.01 грн |
74HC139D,653 |
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX DUAL 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC DECODER/DEMUX DUAL 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
на замовлення 388822 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3426+ | 6.29 грн |
BCW61C,235 |
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
13053+ | 1.4 грн |
74AHC374D,112 |
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 120 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.1ns @ 5V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 8mA, 8mA
Trigger Type: Positive Edge
Clock Frequency: 120 MHz
Input Capacitance: 3 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 10.1ns @ 5V, 50pF
Number of Bits per Element: 8
на замовлення 4098 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1480+ | 13.98 грн |
MPC852TCZT50A |
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
товар відсутній
1N4730A,113 |
на замовлення 91773 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
9072+ | 2.1 грн |
1N4730A,133 |
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.9V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Description: DIODE ZENER 3.9V 1W DO41
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: DO-41
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
на замовлення 41850 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
9072+ | 2.1 грн |
MPXV2202GC6T1 |
Виробник: NXP USA Inc.
Description: SENSOR 29.01PSIG 0.13" .04V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 29.01PSIG 0.13" .04V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
товар відсутній
74HCT4017D,652 |
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 67 MHz
Number of Bits per Element: 10
Description: IC DECADE COUNTER 10BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 67 MHz
Number of Bits per Element: 10
на замовлення 3850 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1255+ | 17.18 грн |
PTN36043BBXY |
Виробник: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 173.52 грн |
10+ | 150.09 грн |
25+ | 141.62 грн |
100+ | 113.21 грн |
250+ | 106.31 грн |
500+ | 93.02 грн |
1000+ | 75.81 грн |
2500+ | 70.58 грн |
5000+ | 67.96 грн |
LPC865M201JHI48/0K |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, I3C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, I3C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 192.98 грн |
10+ | 167.39 грн |
25+ | 157.92 грн |
80+ | 126.26 грн |
230+ | 118.56 грн |
440+ | 103.74 грн |
1300+ | 84.54 грн |
PTN36242LBS,518 |
Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
на замовлення 7900 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
184+ | 116.69 грн |
SPC5604PF1VLL6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
товар відсутній
SPC5644AF0MMG2R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
товар відсутній
LFVBSK77CZWA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5777C 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Description: QORIVVA MPC5777C 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
товар відсутній
C9KEAZN16AMLC |
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
Description: IC
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
товар відсутній
BFU520XRVL |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 1dB @ 1.8GHz
Supplier Device Package: SOT-143R
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 1dB @ 1.8GHz
Supplier Device Package: SOT-143R
на замовлення 3868 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2581+ | 8.39 грн |
PQMD12Z |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PQMD - SMALL SIGNAL
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 350mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Frequency - Transition: 230MHz, 180MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: DFN1010B-6
Description: NOW NEXPERIA PQMD - SMALL SIGNAL
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 350mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Frequency - Transition: 230MHz, 180MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: DFN1010B-6
на замовлення 1453189 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
7612+ | 2.86 грн |
MC7447AVU1167NB |
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.167GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.167GHZ
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.167GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.167GHZ
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
товар відсутній
MC33FS8530A0KSR2 |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
MC33FS8530A0KS |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
LS1023ASE7QQB |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товар відсутній
MC33FS8435G0ES |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товар відсутній
74HC03PW,112 |
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-TSSOP
Features: Open Drain
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 4CH 2-INP 14-TSSOP
Features: Open Drain
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: -, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
на замовлення 14127 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2263+ | 9.09 грн |
MWCT1015SFVLLPR |
Виробник: NXP USA Inc.
Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
товар відсутній
MWCT1015SFVLLP |
Виробник: NXP USA Inc.
Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
товар відсутній
BTA201-600B,112 |
на замовлення 9458 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1315+ | 16.08 грн |
M86207G12 |
товар відсутній
MC68HC908QY2CDTE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
товар відсутній
MC9S08SH4CWJR |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 115077 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
135+ | 155.86 грн |