Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35453) > Сторінка 476 з 591
Фото | Назва | Виробник | Інформація |
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BZB84-B51,215 | NXP USA Inc. |
Description: NOW NEXPERIA BZB84-B51 - ZENER D Tolerance: ±2% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 51 V Impedance (Max) (Zzt): 180 Ohms Supplier Device Package: SOT-23 Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V |
на замовлення 17900 шт: термін постачання 21-31 дні (днів) |
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BZB84-C10,215 | NXP USA Inc. | Description: NOW NEXPERIA BZB84-C10 - ZENER D |
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MRF6V2300NR5578 | NXP USA Inc. | Description: N CHANNEL ENHANCEMENT-MODE RF PO |
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LPC54607J256ET180E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
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BUJ303B,127 | NXP USA Inc. | Description: NOW WEEN - BUJ303B - POWER BIPOL |
на замовлення 5278 шт: термін постачання 21-31 дні (днів) |
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LD6836TD/14P,125 | NXP USA Inc. | Description: IC REG LINEAR 1.4V 300MA 5TSOP |
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MC33FS8510D3ESR2 | NXP USA Inc. | Description: FS8510 |
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MC33FS8510D3ES | NXP USA Inc. | Description: FS8510 |
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BGA7127,118 | NXP USA Inc. |
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON Packaging: Bulk Package / Case: 8-VFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.7GHz RF Type: ISM, RFID, WLAN Voltage - Supply: 5V Gain: 10.5dB Current - Supply: 180mA Noise Figure: 4.7dB P1dB: 27.5dBm Test Frequency: 2.445GHz Supplier Device Package: 8-HVSON (3x3) Part Status: Obsolete |
на замовлення 8377 шт: термін постачання 21-31 дні (днів) |
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BT138-600D,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 12A TO220AB Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Triac Type: Logic - Sensitive Gate Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 10 mA Current - Gate Trigger (Igt) (Max): 5 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A Voltage - Gate Trigger (Vgt) (Max): 1.5 V Supplier Device Package: TO-220AB Part Status: Active Current - On State (It (RMS)) (Max): 12 A Voltage - Off State: 600 V |
на замовлення 1140 шт: термін постачання 21-31 дні (днів) |
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S912ZVMC12F3MKHR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
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S912ZVMC12F3MKH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Active Number of I/O: 31 DigiKey Programmable: Not Verified |
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P87C660X2FAA529 | NXP USA Inc. | Description: 80C51 8-BIT MCU FAMILY |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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PZM9.1NB2,115 | NXP USA Inc. |
Description: DIODE ZENER 9.1V 300MW SMT3 Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 9.1 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: SMT3; MPAK Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 500 nA @ 6 V |
на замовлення 1800000 шт: термін постачання 21-31 дні (днів) |
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PZM12NB2A,115 | NXP USA Inc. |
Description: DIODE ZENER 12V 220MW SMT3 Packaging: Bulk Tolerance: ±2% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: SMT3; MPAK Power - Max: 220 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 100 nA @ 9 V |
на замовлення 1317000 шт: термін постачання 21-31 дні (днів) |
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SA56004ED,112 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8SO Packaging: Tube Features: Output Switch, Programmable Limit Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-SO Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C Part Status: Obsolete |
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PSMN2R2-40PS | NXP USA Inc. | Description: NOW NEXPERIA PSMN2R2-40BS - POWE |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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PSMN2R6-60PSQ127 | NXP USA Inc. | Description: MOSFET N-CH 60V 150A TO220AB |
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PSMN2R8-25MLC115 | NXP USA Inc. | Description: NOW NEXPERIA PSMN2R8-25MLC 70A, |
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PSMN2R2-40PS127 | NXP USA Inc. | Description: 100A, 40V, 0.0022OHM, N CHANNE |
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PSMN3R5-80PS | NXP USA Inc. |
Description: NOW NEXPERIA PSMN3R5-80PS - POWE Packaging: Bulk |
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PSMN3R2-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 100A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V Power Dissipation (Max): 79W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V |
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PSMN3R2-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 100A LFPAK56 Packaging: Cut Tape (CT) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V Power Dissipation (Max): 79W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 25 V Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V |
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BUK7E1R6-30E,127 | NXP USA Inc. | Description: MOSFET N-CH 30V 120A I2PAK |
на замовлення 295 шт: термін постачання 21-31 дні (днів) |
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MPC8347CZQAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Part Status: Obsolete |
на замовлення 517 шт: термін постачання 21-31 дні (днів) |
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MPC8347CZQAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR Graphics Acceleration: No Part Status: Obsolete |
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MCIMX7S3DVK08SD | NXP USA Inc. |
Description: IC MPU I.MX7S 800MHZ 488TFBGA Packaging: Tray Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-TFBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS |
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MMRF1312GSR5 | NXP USA Inc. |
Description: TRANS 960-1215MHZ 1000W PEAK 50V Packaging: Tape & Reel (TR) Package / Case: NI-1230-4S GW Mounting Type: Surface Mount Frequency: 1.03GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4S GULL Part Status: Active Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
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PCA6416APW,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP Features: POR Packaging: Cut Tape (CT) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 8262 шт: термін постачання 21-31 дні (днів) |
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MPC8536AVJAULA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.333GHZ 783BGA Packaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MC908JK1EMDWE | NXP USA Inc. | Description: IC MCU 8BIT 1.5KB FLASH 20SOIC |
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MC908JB8FBE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk DigiKey Programmable: Not Verified |
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PEMI8QFN/HT,132 | NXP USA Inc. | Description: FILTER RC(PI) 45 OHM/23PF SMD |
на замовлення 12000 шт: термін постачання 21-31 дні (днів) |
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PR601HL/C1,557 | NXP USA Inc. | Description: IC RFID READER 13.56MHZ 100LQFP |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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KIT33908MBEVBE | NXP USA Inc. |
Description: KIT EVAL MC33908 MOTHER BOARD PO Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: MC33908 Supplied Contents: Board(s) Part Status: Active |
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TEA19031AET/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH 10SO Packaging: Tape & Reel (TR) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 10MHz Internal Switch(s): Yes Output Isolation: Isolated Voltage - Supply (Vcc/Vdd): 0V ~ 21V Supplier Device Package: 10-SO Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Control Features: EN Part Status: Obsolete Power (Watts): 45 W |
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TEA19031ADT/1J | NXP USA Inc. |
Description: IC OFFLINE SWITCH 10SO Packaging: Tape & Reel (TR) Package / Case: 10-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -25°C ~ 125°C (TJ) Frequency - Switching: 10MHz Internal Switch(s): Yes Output Isolation: Isolated Voltage - Supply (Vcc/Vdd): 0V ~ 21V Supplier Device Package: 10-SO Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Control Features: EN Part Status: Obsolete Power (Watts): 45 W |
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MPC5554AZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -55°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Number of I/O: 256 DigiKey Programmable: Not Verified |
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BUK7E2R3-40E,127-NXP | NXP USA Inc. |
Description: PFET, 120A I(D), 40V, 0.0023OHM, Packaging: Tube Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V Power Dissipation (Max): 293W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V |
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PCA9519PW118 | NXP USA Inc. |
Description: 4-CHANNEL LEVEL TRANSLATING I2C- Packaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Delay Time: 105ns Number of Channels: 4 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V Applications: I²C Current - Supply: 11.6mA Data Rate (Max): 400kHz Supplier Device Package: 20-TSSOP Capacitance - Input: 2 pF |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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PCA9518APW | NXP USA Inc. |
Description: INTERFACE CIRCUIT, CMOS, PDSO20 Packaging: Bulk |
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PCA9516APW | NXP USA Inc. |
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR Packaging: Bulk Part Status: Active |
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PCA9516APW,112 | NXP USA Inc. |
Description: IC REDRIVER I2C 5CH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Number of Channels: 5 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Applications: I²C Current - Supply: 5mA Data Rate (Max): 400kHz Supplier Device Package: 16-TSSOP Part Status: Obsolete Capacitance - Input: 6 pF |
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74AHCT241BQ,115 | NXP USA Inc. |
Description: IC BUF NON-INVERT 5.5V 20DHVQFN Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-DHVQFN (4.5x2.5) Part Status: Obsolete |
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PSMN070-200B | NXP USA Inc. | Description: 35A, 200V, 0.07OHM, N-CHANNEL |
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MC9S12GC32CFUE | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
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MC33FS6512NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
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MC33FS6512NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
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MPC8572CLVJAULE | NXP USA Inc. | Description: IC MPU MPC85XX 1.333GHZ 1023BGA |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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LD6815TD/36P,125 | NXP USA Inc. |
Description: NEXPERIA LD6815TD/36P - FIXED PO Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 3.6V Control Features: Enable Part Status: Active PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA (Typ) Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
на замовлення 60000 шт: термін постачання 21-31 дні (днів) |
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MPC8360VVALFHA | NXP USA Inc. | Description: POWERQUICC 32 BIT POWER ARCH SOC |
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MK22DN512VDC5 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 121XFBGA Packaging: Tray Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MK22FN256VMP12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA Packaging: Tray Package / Case: 64-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 256KB (256K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-MAPBGA (5x5) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
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SPC5646CF0VMJ1R | NXP USA Inc. | Description: IC MCU 32BIT 3MB FLASH 256MAPBGA |
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NCX2200GM,132 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
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NCX2200GM,132 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 6-XSON, SOT886 (1.45x1) Propagation Delay (Max): 800ns Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA @ 5.5V CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
на замовлення 245973 шт: термін постачання 21-31 дні (днів) |
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FXPS7250DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
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FXPS7165DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
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FXPS7400DI4T1 | NXP USA Inc. | Description: 20-400 KPA BAP DIG I2C |
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FXPS7400DI4ST1 | NXP USA Inc. | Description: IC PRESSURE SENSOR 16HQFN |
товар відсутній |
BZB84-B51,215 |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZB84-B51 - ZENER D
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 51 V
Impedance (Max) (Zzt): 180 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
Description: NOW NEXPERIA BZB84-B51 - ZENER D
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 51 V
Impedance (Max) (Zzt): 180 Ohms
Supplier Device Package: SOT-23
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 35.7 V
на замовлення 17900 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
10303+ | 2.13 грн |
LPC54607J256ET180E |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
товар відсутній
BUJ303B,127 |
Виробник: NXP USA Inc.
Description: NOW WEEN - BUJ303B - POWER BIPOL
Description: NOW WEEN - BUJ303B - POWER BIPOL
на замовлення 5278 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
825+ | 26.4 грн |
BGA7127,118 |
Виробник: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Bulk
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
на замовлення 8377 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
204+ | 105.95 грн |
BT138-600D,127 |
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Active
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 600 V
Description: TRIAC SENS GATE 600V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Active
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 600 V
на замовлення 1140 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
724+ | 28.66 грн |
S912ZVMC12F3MKHR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
товар відсутній
S912ZVMC12F3MKH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
товар відсутній
P87C660X2FAA529 |
Виробник: NXP USA Inc.
Description: 80C51 8-BIT MCU FAMILY
Description: 80C51 8-BIT MCU FAMILY
на замовлення 56 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
56+ | 532.75 грн |
PZM9.1NB2,115 |
Виробник: NXP USA Inc.
Description: DIODE ZENER 9.1V 300MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Description: DIODE ZENER 9.1V 300MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
на замовлення 1800000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
8876+ | 2.16 грн |
PZM12NB2A,115 |
Виробник: NXP USA Inc.
Description: DIODE ZENER 12V 220MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 220 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
Description: DIODE ZENER 12V 220MW SMT3
Packaging: Bulk
Tolerance: ±2%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SMT3; MPAK
Power - Max: 220 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
на замовлення 1317000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
8876+ | 2.15 грн |
SA56004ED,112 |
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -40C-125C 8SO
Packaging: Tube
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-SO
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Part Status: Obsolete
товар відсутній
PSMN2R2-40PS |
Виробник: NXP USA Inc.
Description: NOW NEXPERIA PSMN2R2-40BS - POWE
Description: NOW NEXPERIA PSMN2R2-40BS - POWE
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
202+ | 117.6 грн |
PSMN3R5-80PS |
товар відсутній
PSMN3R2-25YLC,115 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
товар відсутній
PSMN3R2-25YLC,115 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Cut Tape (CT)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 79W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1781 pF @ 12 V
товар відсутній
BUK7E1R6-30E,127 |
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 120A I2PAK
Description: MOSFET N-CH 30V 120A I2PAK
на замовлення 295 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
295+ | 96.29 грн |
MPC8347CZQAGDB |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Part Status: Obsolete
на замовлення 517 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
5+ | 4702.99 грн |
MPC8347CZQAGDB |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
MCIMX7S3DVK08SD |
Виробник: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Tray
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
товар відсутній
MMRF1312GSR5 |
Виробник: NXP USA Inc.
Description: TRANS 960-1215MHZ 1000W PEAK 50V
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S GW
Mounting Type: Surface Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S GULL
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: TRANS 960-1215MHZ 1000W PEAK 50V
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S GW
Mounting Type: Surface Mount
Frequency: 1.03GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S GULL
Part Status: Active
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
товар відсутній
PCA6416APW,118 |
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 8262 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 119.05 грн |
10+ | 102.88 грн |
25+ | 97.05 грн |
100+ | 77.58 грн |
250+ | 72.85 грн |
500+ | 63.74 грн |
1000+ | 51.95 грн |
MPC8536AVJAULA |
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 19474.52 грн |
MC908JB8FBE557 |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
товар відсутній
PEMI8QFN/HT,132 |
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/23PF SMD
Description: FILTER RC(PI) 45 OHM/23PF SMD
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1697+ | 14.21 грн |
PR601HL/C1,557 |
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 100LQFP
Description: IC RFID READER 13.56MHZ 100LQFP
на замовлення 35 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
35+ | 831.88 грн |
KIT33908MBEVBE |
Виробник: NXP USA Inc.
Description: KIT EVAL MC33908 MOTHER BOARD PO
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC33908
Supplied Contents: Board(s)
Part Status: Active
Description: KIT EVAL MC33908 MOTHER BOARD PO
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC33908
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
TEA19031AET/1J |
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
товар відсутній
TEA19031ADT/1J |
Виробник: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
товар відсутній
MPC5554AZP132 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
товар відсутній
BUK7E2R3-40E,127-NXP |
Виробник: NXP USA Inc.
Description: PFET, 120A I(D), 40V, 0.0023OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Description: PFET, 120A I(D), 40V, 0.0023OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
товар відсутній
PCA9519PW118 |
Виробник: NXP USA Inc.
Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Delay Time: 105ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Capacitance - Input: 2 pF
Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Delay Time: 105ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Capacitance - Input: 2 pF
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
119+ | 180.19 грн |
PCA9518APW |
товар відсутній
PCA9516APW |
Виробник: NXP USA Inc.
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Packaging: Bulk
Part Status: Active
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Packaging: Bulk
Part Status: Active
товар відсутній
PCA9516APW,112 |
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
товар відсутній
74AHCT241BQ,115 |
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
товар відсутній
MC9S12GC32CFUE |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
товар відсутній
MC33FS6512NAE |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товар відсутній
MC33FS6512NAER2 |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товар відсутній
MPC8572CLVJAULE |
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 37564.76 грн |
LD6815TD/36P,125 |
Виробник: NXP USA Inc.
Description: NEXPERIA LD6815TD/36P - FIXED PO
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: NEXPERIA LD6815TD/36P - FIXED PO
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 60000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3328+ | 6.63 грн |
MK22DN512VDC5 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
товар відсутній
MK22FN256VMP12 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
товар відсутній
NCX2200GM,132 |
Виробник: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
товар відсутній
NCX2200GM,132 |
Виробник: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
на замовлення 245973 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2070+ | 10.06 грн |