Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35452) > Сторінка 427 з 591

Обрати Сторінку:    << Попередня Сторінка ]  1 59 118 177 236 295 354 413 422 423 424 425 426 427 428 429 430 431 432 472 531 590 591  Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
без ПДВ
74LVCH245APW-Q100118 74LVCH245APW-Q100118 NXP USA Inc. 74LVC_LVCH245A_Q100.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
на замовлення 29650 шт:
термін постачання 21-31 дні (днів)
74LVCH245APW/AU118 74LVCH245APW/AU118 NXP USA Inc. 74LVC_LVCH245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
на замовлення 3450 шт:
термін постачання 21-31 дні (днів)
74LVT245PW/AU118 74LVT245PW/AU118 NXP USA Inc. PHGLS29090-1.pdf?t.download=true&u=5oefqw Description: BUS TRANSCVR, LVT SERIES, 8-BIT
на замовлення 47070 шт:
термін постачання 21-31 дні (днів)
74LVCH16245ADGG-Q100118 74LVCH16245ADGG-Q100118 NXP USA Inc. 74LVC_LVCH16245A_Q100.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
товар відсутній
LD6805K/23P,115 LD6805K/23P,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 70000 шт:
термін постачання 21-31 дні (днів)
3206+7 грн
Мінімальне замовлення: 3206
LD6805K/23H,115 LD6805K/23H,115 NXP USA Inc. LD6805.pdf Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 60000 шт:
термін постачання 21-31 дні (днів)
2959+7.36 грн
Мінімальне замовлення: 2959
PCA9561D,112 PCA9561D,112 NXP USA Inc. PCA9561.pdf Description: IC INTERFACE SPECIALIZED 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 3V ~ 3.6V
Applications: Network, Telecom
Supplier Device Package: 20-SO
на замовлення 1425 шт:
термін постачання 21-31 дні (днів)
485+43.33 грн
Мінімальне замовлення: 485
TJA1102AHN/S/0Z TJA1102AHN/S/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
2000+196.21 грн
Мінімальне замовлення: 2000
TJA1102AHN/S/0Z TJA1102AHN/S/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
на замовлення 7824 шт:
термін постачання 21-31 дні (днів)
2+294.91 грн
10+ 255.36 грн
25+ 241.49 грн
100+ 196.4 грн
250+ 186.32 грн
500+ 177.32 грн
Мінімальне замовлення: 2
TJA1102AHN/0Z TJA1102AHN/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+235.88 грн
Мінімальне замовлення: 2000
TJA1102AHN/0Z TJA1102AHN/0Z NXP USA Inc. TJA1102_SDS.pdf Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
на замовлення 3720 шт:
термін постачання 21-31 дні (днів)
1+469.99 грн
10+ 406.42 грн
25+ 384.27 грн
100+ 312.53 грн
250+ 296.51 грн
500+ 266.05 грн
1000+ 220.7 грн
TJA1124BHG/0Z TJA1124BHG/0Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 4745 шт:
термін постачання 21-31 дні (днів)
2+231.1 грн
10+ 199.24 грн
25+ 188.38 грн
100+ 153.2 грн
250+ 145.35 грн
500+ 130.42 грн
1000+ 108.19 грн
Мінімальне замовлення: 2
SPC5644CAVLU1 SPC5644CAVLU1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
SPC5644CAVLU8 SPC5644CAVLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
DSPB56371AF180 DSPB56371AF180 NXP USA Inc. DSP56371.pdf Description: IC DSP 24BIT 180MHZ 80-LQFP
товар відсутній
74LV164DB112 74LV164DB112 NXP USA Inc. 74LV164.pdf Description: NOW NEXPERIA 74LV164DB - SERIAL
товар відсутній
74AXP2G07GS125 74AXP2G07GS125 NXP USA Inc. 74AXP2G07.pdf Description: 74AXP2G07GS - BUFFER, AXP SERIES
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)
2862+7.82 грн
Мінімальне замовлення: 2862
74AUP2G07GN/S500125 74AUP2G07GN/S500125 NXP USA Inc. PHGLS25894-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
на замовлення 70000 шт:
термін постачання 21-31 дні (днів)
1106+19.71 грн
Мінімальне замовлення: 1106
BGU7007 BGU7007 NXP USA Inc. BGU7007.pdf Description: SIGE:C LOW NOISE AMPLIFIER MMIC
товар відсутній
PCA9615DPZ PCA9615DPZ NXP USA Inc. PCA9615.pdf Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
товар відсутній
MC33FS6513CAER2 MC33FS6513CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
товар відсутній
PESD3V3S2UQ/S911,115 PESD3V3S2UQ/S911,115 NXP USA Inc. PIRSS12888-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA, TRANS VOLTAGE SUPP
Packaging: Bulk
товар відсутній
PCA9622DR/S911118 PCA9622DR/S911118 NXP USA Inc. PCA9622.pdf Description: LED DRIVER 16-SEGMENT
на замовлення 255786 шт:
термін постачання 21-31 дні (днів)
174+123.05 грн
Мінімальне замовлення: 174
PDZ12B/S911115 PDZ12B/S911115 NXP USA Inc. PHGLS19616-1.pdf?t.download=true&u=5oefqw Description: PDZ12B - VOLTAGE REGULATOR DIODE
товар відсутній
PSMN1R9-25YLC,115 PSMN1R9-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 100A LFPAK56
на замовлення 5149 шт:
термін постачання 21-31 дні (днів)
PSMN1R5-40ES,127 NXP USA Inc. PSMN1R5-40ES.pdf Description: MOSFET N-CH 40V 120A I2PAK
Packaging: Tube
на замовлення 7345 шт:
термін постачання 21-31 дні (днів)
224+97.23 грн
Мінімальне замовлення: 224
MKV46F256VLL16Q MKV46F256VLL16Q NXP USA Inc. KV4XP100M168.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
товар відсутній
MKV46F256VLL16P MKV46F256VLL16P NXP USA Inc. KINETISKV4X.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
товар відсутній
IP3337CX18/LF/P135 NXP USA Inc. IP3337CX18.pdf Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
на замовлення 4499 шт:
термін постачання 21-31 дні (днів)
875+24.75 грн
Мінімальне замовлення: 875
BUK7628-100A,118 BUK7628-100A,118 NXP USA Inc. BUK7628-100A.pdf Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
на замовлення 5440 шт:
термін постачання 21-31 дні (днів)
480+45.27 грн
Мінімальне замовлення: 480
74LVC2G17GN,132 74LVC2G17GN,132 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
на замовлення 128756 шт:
термін постачання 21-31 дні (днів)
1708+12.58 грн
Мінімальне замовлення: 1708
N74F38D,602 N74F38D,602 NXP USA Inc. DS_568_74F38.pdf Description: IC GATE NAND 4CH 2-INP 14SO
Features: Open Collector
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
на замовлення 19835 шт:
термін постачання 21-31 дні (днів)
2420+8.74 грн
Мінімальне замовлення: 2420
N74F38D-Q100118 N74F38D-Q100118 NXP USA Inc. PHGLS29162-1.pdf?t.download=true&u=5oefqw Description: NAND GATE, F/FAST SERIES, TTL
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
BY229-600,127 BY229-600,127 NXP USA Inc. BY229_SERIES.pdf Description: DIODE GEN PURP 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
товар відсутній
BY229X-200,127 BY229X-200,127 NXP USA Inc. BY229(F,X).pdf Description: DIODE GEN PURP 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
товар відсутній
BY229X-600,127 BY229X-600,127 NXP USA Inc. BY229(F,X).pdf Description: DIODE GEN PURP 500V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
товар відсутній
BY229X-800,127 BY229X-800,127 NXP USA Inc. BY229(F,X).pdf Description: DIODE GEN PURP 600V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
товар відсутній
BUK9107-55ATE,118 NXP USA Inc. PHGLS18440-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
товар відсутній
BUK7614-55A,118 BUK7614-55A,118 NXP USA Inc. BUK%2875%2C76%2914-55A.pdf Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
товар відсутній
BUK7614-55A,118 BUK7614-55A,118 NXP USA Inc. BUK%2875%2C76%2914-55A.pdf Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
товар відсутній
BUK7614-55,118 BUK7614-55,118 NXP USA Inc. BUK7614-55.pdf Description: MOSFET N-CH 55V 68A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 142W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
товар відсутній
74HC165BQ115 NXP USA Inc. 74HC_HCT165.pdf Description: NOW NEXPERIA 74HC165BQ-Q100 - PA
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Active
Number of Bits per Element: 8
товар відсутній
SPC5606BK0MLL6R,528 NXP USA Inc. Description: POWERPC CORE ARCHITECTURE MPU
товар відсутній
SPC5606BK0CLL6 SPC5606BK0CLL6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLL4 SPC5606BK0VLL4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLQ4 SPC5606BK0CLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLQ6 SPC5606BK0CLQ6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLQ4 SPC5606BK0VLQ4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLL6R SPC5606BK0VLL6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BF1VLQ6 SPC5606BF1VLQ6 NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLU4 SPC5606BK0CLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BF1VLQ6R SPC5606BF1VLQ6R NXP USA Inc. MPC560XBFAMFS.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLU6 SPC5606BK0CLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
товар відсутній
SPC5606BK0VLU4 SPC5606BK0VLU4 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLU6 SPC5606BK0VLU6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLU6R SPC5606BK0VLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0MLU6R SPC5606BK0MLU6R NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606SF2CLU6R SPC5606SF2CLU6R NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
товар відсутній
SPC5606EF2VMC SPC5606EF2VMC NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
товар відсутній
SPC5606EF2VMCR SPC5606EF2VMCR NXP USA Inc. Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
товар відсутній
74LVCH245APW-Q100118 74LVC_LVCH245A_Q100.pdf
74LVCH245APW-Q100118
Виробник: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
на замовлення 29650 шт:
термін постачання 21-31 дні (днів)
74LVCH245APW/AU118 74LVC_LVCH245A.pdf
74LVCH245APW/AU118
Виробник: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
на замовлення 3450 шт:
термін постачання 21-31 дні (днів)
74LVT245PW/AU118 PHGLS29090-1.pdf?t.download=true&u=5oefqw
74LVT245PW/AU118
Виробник: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
на замовлення 47070 шт:
термін постачання 21-31 дні (днів)
74LVCH16245ADGG-Q100118 74LVC_LVCH16245A_Q100.pdf
74LVCH16245ADGG-Q100118
Виробник: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
товар відсутній
LD6805K/23P,115 LD6805.pdf
LD6805K/23P,115
Виробник: NXP USA Inc.
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 70000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3206+7 грн
Мінімальне замовлення: 3206
LD6805K/23H,115 LD6805.pdf
LD6805K/23H,115
Виробник: NXP USA Inc.
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
на замовлення 60000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2959+7.36 грн
Мінімальне замовлення: 2959
PCA9561D,112 PCA9561.pdf
PCA9561D,112
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 3V ~ 3.6V
Applications: Network, Telecom
Supplier Device Package: 20-SO
на замовлення 1425 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
485+43.33 грн
Мінімальне замовлення: 485
TJA1102AHN/S/0Z TJA1102_SDS.pdf
TJA1102AHN/S/0Z
Виробник: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2000+196.21 грн
Мінімальне замовлення: 2000
TJA1102AHN/S/0Z TJA1102_SDS.pdf
TJA1102AHN/S/0Z
Виробник: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
на замовлення 7824 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+294.91 грн
10+ 255.36 грн
25+ 241.49 грн
100+ 196.4 грн
250+ 186.32 грн
500+ 177.32 грн
Мінімальне замовлення: 2
TJA1102AHN/0Z TJA1102_SDS.pdf
TJA1102AHN/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2000+235.88 грн
Мінімальне замовлення: 2000
TJA1102AHN/0Z TJA1102_SDS.pdf
TJA1102AHN/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
на замовлення 3720 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+469.99 грн
10+ 406.42 грн
25+ 384.27 грн
100+ 312.53 грн
250+ 296.51 грн
500+ 266.05 грн
1000+ 220.7 грн
TJA1124BHG/0Z TJA1124.pdf
TJA1124BHG/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
на замовлення 4745 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+231.1 грн
10+ 199.24 грн
25+ 188.38 грн
100+ 153.2 грн
250+ 145.35 грн
500+ 130.42 грн
1000+ 108.19 грн
Мінімальне замовлення: 2
SPC5644CAVLU1
SPC5644CAVLU1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
SPC5644CAVLU8
SPC5644CAVLU8
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
DSPB56371AF180 DSP56371.pdf
DSPB56371AF180
Виробник: NXP USA Inc.
Description: IC DSP 24BIT 180MHZ 80-LQFP
товар відсутній
74LV164DB112 74LV164.pdf
74LV164DB112
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LV164DB - SERIAL
товар відсутній
74AXP2G07GS125 74AXP2G07.pdf
74AXP2G07GS125
Виробник: NXP USA Inc.
Description: 74AXP2G07GS - BUFFER, AXP SERIES
на замовлення 4500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2862+7.82 грн
Мінімальне замовлення: 2862
74AUP2G07GN/S500125 PHGLS25894-1.pdf?t.download=true&u=5oefqw
74AUP2G07GN/S500125
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
на замовлення 70000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1106+19.71 грн
Мінімальне замовлення: 1106
BGU7007 BGU7007.pdf
BGU7007
Виробник: NXP USA Inc.
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
товар відсутній
PCA9615DPZ PCA9615.pdf
PCA9615DPZ
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 1MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
товар відсутній
MC33FS6513CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6513CAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
товар відсутній
PESD3V3S2UQ/S911,115 PIRSS12888-1.pdf?t.download=true&u=5oefqw
PESD3V3S2UQ/S911,115
Виробник: NXP USA Inc.
Description: NOW NEXPERIA, TRANS VOLTAGE SUPP
Packaging: Bulk
товар відсутній
PCA9622DR/S911118 PCA9622.pdf
PCA9622DR/S911118
Виробник: NXP USA Inc.
Description: LED DRIVER 16-SEGMENT
на замовлення 255786 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
174+123.05 грн
Мінімальне замовлення: 174
PDZ12B/S911115 PHGLS19616-1.pdf?t.download=true&u=5oefqw
PDZ12B/S911115
Виробник: NXP USA Inc.
Description: PDZ12B - VOLTAGE REGULATOR DIODE
товар відсутній
PSMN1R9-25YLC,115
PSMN1R9-25YLC,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
на замовлення 5149 шт:
термін постачання 21-31 дні (днів)
PSMN1R5-40ES,127 PSMN1R5-40ES.pdf
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 120A I2PAK
Packaging: Tube
на замовлення 7345 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
224+97.23 грн
Мінімальне замовлення: 224
MKV46F256VLL16Q KV4XP100M168.pdf
MKV46F256VLL16Q
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
товар відсутній
MKV46F256VLL16P KINETISKV4X.pdf
MKV46F256VLL16P
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
товар відсутній
IP3337CX18/LF/P135 IP3337CX18.pdf
Виробник: NXP USA Inc.
Description: DATA LINE FILTER
Packaging: Bulk
Part Status: Active
на замовлення 4499 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
875+24.75 грн
Мінімальне замовлення: 875
BUK7628-100A,118 BUK7628-100A.pdf
BUK7628-100A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
на замовлення 5440 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
480+45.27 грн
Мінімальне замовлення: 480
74LVC2G17GN,132 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GN,132
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
на замовлення 128756 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1708+12.58 грн
Мінімальне замовлення: 1708
N74F38D,602 DS_568_74F38.pdf
N74F38D,602
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14SO
Features: Open Collector
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
на замовлення 19835 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2420+8.74 грн
Мінімальне замовлення: 2420
N74F38D-Q100118 PHGLS29162-1.pdf?t.download=true&u=5oefqw
N74F38D-Q100118
Виробник: NXP USA Inc.
Description: NAND GATE, F/FAST SERIES, TTL
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
BY229-600,127 BY229_SERIES.pdf
BY229-600,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
товар відсутній
BY229X-200,127 BY229(F,X).pdf
BY229X-200,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
товар відсутній
BY229X-600,127 BY229(F,X).pdf
BY229X-600,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 500V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
товар відсутній
BY229X-800,127 BY229(F,X).pdf
BY229X-800,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 600V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
товар відсутній
BUK9107-55ATE,118 PHGLS18440-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
товар відсутній
BUK7614-55A,118 BUK%2875%2C76%2914-55A.pdf
BUK7614-55A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
товар відсутній
BUK7614-55A,118 BUK%2875%2C76%2914-55A.pdf
BUK7614-55A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 73A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2464 pF @ 25 V
Qualification: AEC-Q101
товар відсутній
BUK7614-55,118 BUK7614-55.pdf
BUK7614-55,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 68A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 25A, 10V
Power Dissipation (Max): 142W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
товар відсутній
74HC165BQ115 74HC_HCT165.pdf
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74HC165BQ-Q100 - PA
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Part Status: Active
Number of Bits per Element: 8
товар відсутній
SPC5606BK0MLL6R,528
Виробник: NXP USA Inc.
Description: POWERPC CORE ARCHITECTURE MPU
товар відсутній
SPC5606BK0CLL6 MPC5606B.pdf
SPC5606BK0CLL6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLL4 MPC5606B.pdf
SPC5606BK0VLL4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLQ4 MPC5606B.pdf
SPC5606BK0CLQ4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLQ6 MPC5606B.pdf
SPC5606BK0CLQ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLQ4 MPC5606B.pdf
SPC5606BK0VLQ4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLL6R MPC5606B.pdf
SPC5606BK0VLL6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BF1VLQ6 MPC560XBFAMFS.pdf
SPC5606BF1VLQ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLU4 MPC5606B.pdf
SPC5606BK0CLU4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BF1VLQ6R MPC560XBFAMFS.pdf
SPC5606BF1VLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0CLU6 MPC5606B.pdf
SPC5606BK0CLU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
товар відсутній
SPC5606BK0VLU4 MPC5606B.pdf
SPC5606BK0VLU4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLU6 MPC5606B.pdf
SPC5606BK0VLU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0VLU6R MPC5606B.pdf
SPC5606BK0VLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606BK0MLU6R MPC5606B.pdf
SPC5606BK0MLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 149
DigiKey Programmable: Not Verified
товар відсутній
SPC5606SF2CLU6R MPC5606S.pdf
SPC5606SF2CLU6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 133
DigiKey Programmable: Not Verified
товар відсутній
SPC5606EF2VMC
SPC5606EF2VMC
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
товар відсутній
SPC5606EF2VMCR
SPC5606EF2VMCR
Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 39
DigiKey Programmable: Not Verified
товар відсутній
Обрати Сторінку:    << Попередня Сторінка ]  1 59 118 177 236 295 354 413 422 423 424 425 426 427 428 429 430 431 432 472 531 590 591  Наступна Сторінка >> ]