Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35441) > Сторінка 231 з 591
| Фото | Назва | Виробник | Інформація |
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SVF521R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART Part Status: Active |
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SVF522R2K1CMK4 | NXP USA Inc. |
 Description: IC MCU 32BIT ROMLESS 364MAPBGA |
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SVF522R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
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SVF532R3K1CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
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| TRACELINK | NXP USA Inc. |
Description: DEBUG & TRACE MCU 32BIT Packaging: Bulk For Use With/Related Products: Coldfire®, Kinetis® Type: Debugger Contents: Board(s) |
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MM912F634DV1AE | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
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MM912F634DV1AER2 | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
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MM912F634DV2AE | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP |
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MM912F634DV2AP | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
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MM912F634DV2APR2 | NXP USA Inc. |
Description: IC MCU DUAL LS/HS SWITCH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
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MM912G634DC1AE | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
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MM912G634DC1AER2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
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MM912G634DC2AP | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
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MM912G634DM1AE | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
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MM912G634DM1AER2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (48kB) Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified Grade: Automotive |
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MM912G634DV1AER2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
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MM912G634DV2AP | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
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MM912G634DV2APR2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
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MM912H634DM1AER2 | NXP USA Inc. |
Description: IC MCU 64KB LS/HS SWITCH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 6K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (64kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Number of I/O: 9 DigiKey Programmable: Not Verified |
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RD4247FXOS8700 | NXP USA Inc. |
Description: KIT SENSOR TOOL BOX CONT Packaging: Box Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB Interface: I2C, Serial, SPI Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Accelerometer, Magnetometer Utilized IC / Part: FXOS8700CQ Supplied Contents: Board(s) Embedded: No Sensing Range: ±2g, 4g, 8g, ±1200µT Part Status: Active |
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S912XEQ384F1VALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
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S9S08DN32F2CLF | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
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SPC5646BF0MLU1 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 176LQFP Packaging: Bulk Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 3MB (3M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4d Data Converters: A/D 27x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 147 DigiKey Programmable: Not Verified |
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MM912H634DV1AER2 | NXP USA Inc. |
Description: IC MCU 64KB LS/HS SWITCH 48LQFP |
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MM912JS812AMAF | NXP USA Inc. |
Description: IC DRVR INJECTOR/IGN 100LQFP |
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MM912JS812AMAFR2 | NXP USA Inc. |
Description: IC DRVR INJECTOR/IGN 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Interface: CAN, SCI, SPI RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.7V ~ 36V Controller Series: HCS12 Program Memory Type: FLASH (128kB) Applications: Engine Control Core Processor: S12XS Supplier Device Package: 100-LQFP-EP (14x14) Number of I/O: 6 DigiKey Programmable: Not Verified |
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MMDS20254HT1 | NXP USA Inc. |
Description: IC MOD RF ALIGNMENT 2G 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Advanced Doherty Alignment Module Frequency: 1.8GHz ~ 2.2GHz RF Type: Cellular Supplier Device Package: 32-QFN (6x6) |
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MML09231HT1 | NXP USA Inc. |
Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN Packaging: Tape & Reel (TR) Package / Case: 8-VFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 700MHz ~ 1.4GHz RF Type: GSM, LTE, W-CDMA Voltage - Supply: 5V Gain: 17.2dB Current - Supply: 55mA Noise Figure: 0.36dB P1dB: 24.5dBm Test Frequency: 900MHz Supplier Device Package: 8-DFN (2x2) |
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MPC8308CZQADDA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 473MAPBGA |
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MPC8308CZQAFDA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 473MAPBGA |
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MPC8308ZQADDA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 473MAPBGA |
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MM912G634DC2APR2 | NXP USA Inc. |
Description: IC MCU 48KB LS/HS SWITCH 48LQFP |
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MVF61NS151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 167MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz, 167MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
на замовлення 1230 шт: термін постачання 21-31 дні (днів) |
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P2020NXE2MHC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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MVF30NS151CKU26 | NXP USA Inc. |
Description: IC MPU VYBRID 266MHZ 176HLQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
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MVF50NN151CMK40 | NXP USA Inc. |
Description: IC MPU VYBRID 400MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART Part Status: Active |
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MVF50NS151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 500MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
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MVF60NN151CMK40 | NXP USA Inc. |
Description: IC MPU VYBRID 167MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 167MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU |
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MVF60NN151CMK50 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 364MAPBGA |
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MVF61NN151CMK50 | NXP USA Inc. |
Description: IC MPU VYBRID 167MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 500MHz, 167MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
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| P1023RDB-PA | NXP USA Inc. |
Description: PLATFORM REF DESIGN WLAN P1023 Packaging: Tray For Use With/Related Products: P1023 Type: Transceiver; 802.11 a/b/g/n (Wi-Fi, WiFi, WLAN) Supplied Contents: Board(s) Part Status: Active |
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P2010NXE2MHC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
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P2010NXN2MHC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Part Status: Obsolete |
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| P2040NSN7HLC | NXP USA Inc. |
Description: IC MPU QORIQ P2 800MHZ 780FCPBGA Packaging: Tray Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10/100/1000Mbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI |
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P2041NSE7MMC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.2GHZ 780FCBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Part Status: Obsolete |
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P2041NSN7PNC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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P2041NXE7NNC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.3GHZ 780FCBGA |
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P2041NXE7PNC | NXP USA Inc. |
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA |
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| P2041RDB-PC | NXP USA Inc. |
Description: P2041 EVAL BRD |
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MC10XS3425EK | NXP USA Inc. |
Description: IC SWITCH 32SOIC SPQL1025 |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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| DLD-MCTB-PXS20-N | NXP USA Inc. | Description: MOTOR CONTROL TOOLBOX |
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MC10XS3535DHFK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN Features: Watchdog Timer Packaging: Tray Package / Case: 24-PowerQFN Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 10mOhm (Max), 35mOhm (Max) Voltage - Load: 7V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Ratio - Input:Output: 1:6 Supplier Device Package: 24-PQFN (12x12) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Part Status: Obsolete |
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MC10XS3535DHFKR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN |
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MC17XS6500EKR2 | NXP USA Inc. | Description: IC PWR SWITCH N-CHAN 1:1 32HSOP |
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MC33730EK | NXP USA Inc. |
Description: IC REG TRIPLE BUCK/LINEAR 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6V ~ 26.5V Frequency - Switching: 100kHz ~ 500kHz Topology: Step-Down (Buck) (1), Linear (LDO) (2) Supplier Device Package: 32-SOIC-EP Voltage/Current - Output 1: 5V, 2A Voltage/Current - Output 2: Adjustable, 15mA Voltage/Current - Output 3: Adjustable, 15mA w/LED Driver: No w/Supervisor: No w/Sequencer: No Part Status: Active Number of Outputs: 3 |
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MC33790HEG | NXP USA Inc. |
Description: IC DSI INTERFACE 2CH 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 1 mA DigiKey Programmable: Not Verified |
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MC33790HEGR2 | NXP USA Inc. |
Description: IC DSI INTERFACE 2CH 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 16-SOIC Current - Supply: 1 mA DigiKey Programmable: Not Verified |
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MC33813AE | NXP USA Inc. |
Description: IC CTRL SMALL ENG 1CYL 48LQFP |
на замовлення 165 шт: термін постачання 21-31 дні (днів) |
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MC33981ABHFK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:1 16QFN |
на замовлення 360 шт: термін постачання 21-31 дні (днів) |
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MC34903CP3EKR2 | NXP USA Inc. |
Description: IC SWITCH HIGH SIDE 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Current - Supply: 2mA Supplier Device Package: 32-SOIC-EP Part Status: Obsolete |
товар відсутній |
| SVF521R3K1CMK4 |
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Part Status: Active
товар відсутній
| SVF522R3K1CMK4 |
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
товар відсутній
| SVF532R3K1CMK4 |
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
товар відсутній
| TRACELINK |
Виробник: NXP USA Inc.
Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
Description: DEBUG & TRACE MCU 32BIT
Packaging: Bulk
For Use With/Related Products: Coldfire®, Kinetis®
Type: Debugger
Contents: Board(s)
товар відсутній
| MM912F634DV1AE |
|
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
товар відсутній
| MM912F634DV1AER2 |
|
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
товар відсутній
| MM912F634DV2AP |
|
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
товар відсутній
| MM912F634DV2APR2 |
|
Виробник: NXP USA Inc.
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU DUAL LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
товар відсутній
| MM912G634DC2AP |
|
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
товар відсутній
| MM912G634DM1AE |
|
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
товар відсутній
| MM912G634DM1AER2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
Description: IC MCU 48KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (48kB)
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Grade: Automotive
товар відсутній
| MM912H634DM1AER2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (64kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU 64KB LS/HS SWITCH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (64kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Number of I/O: 9
DigiKey Programmable: Not Verified
товар відсутній
| RD4247FXOS8700 |
Виробник: NXP USA Inc.
Description: KIT SENSOR TOOL BOX CONT
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: FXOS8700CQ
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1200µT
Part Status: Active
Description: KIT SENSOR TOOL BOX CONT
Packaging: Box
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g, 0.1µT/LSB
Interface: I2C, Serial, SPI
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, Magnetometer
Utilized IC / Part: FXOS8700CQ
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±2g, 4g, 8g, ±1200µT
Part Status: Active
товар відсутній
| S912XEQ384F1VALR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
товар відсутній
| S9S08DN32F2CLF |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
товар відсутній
| SPC5646BF0MLU1 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
товар відсутній
| MM912JS812AMAFR2 |
|
Виробник: NXP USA Inc.
Description: IC DRVR INJECTOR/IGN 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SCI, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Engine Control
Core Processor: S12XS
Supplier Device Package: 100-LQFP-EP (14x14)
Number of I/O: 6
DigiKey Programmable: Not Verified
Description: IC DRVR INJECTOR/IGN 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SCI, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.7V ~ 36V
Controller Series: HCS12
Program Memory Type: FLASH (128kB)
Applications: Engine Control
Core Processor: S12XS
Supplier Device Package: 100-LQFP-EP (14x14)
Number of I/O: 6
DigiKey Programmable: Not Verified
товар відсутній
| MMDS20254HT1 |
Виробник: NXP USA Inc.
Description: IC MOD RF ALIGNMENT 2G 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Advanced Doherty Alignment Module
Frequency: 1.8GHz ~ 2.2GHz
RF Type: Cellular
Supplier Device Package: 32-QFN (6x6)
Description: IC MOD RF ALIGNMENT 2G 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Advanced Doherty Alignment Module
Frequency: 1.8GHz ~ 2.2GHz
RF Type: Cellular
Supplier Device Package: 32-QFN (6x6)
товар відсутній
| MML09231HT1 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 17.2dB
Current - Supply: 55mA
Noise Figure: 0.36dB
P1dB: 24.5dBm
Test Frequency: 900MHz
Supplier Device Package: 8-DFN (2x2)
Description: IC RF AMP GSM 700MHZ-1.4GHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1.4GHz
RF Type: GSM, LTE, W-CDMA
Voltage - Supply: 5V
Gain: 17.2dB
Current - Supply: 55mA
Noise Figure: 0.36dB
P1dB: 24.5dBm
Test Frequency: 900MHz
Supplier Device Package: 8-DFN (2x2)
товар відсутній
| MVF61NS151CMK50 |
|
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
на замовлення 1230 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2943.65 грн |
| 10+ | 2162.95 грн |
| 25+ | 1991.11 грн |
| 90+ | 1700.25 грн |
| 270+ | 1667.8 грн |
| P2020NXE2MHC |
|
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| MVF30NS151CKU26 |
|
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
товар відсутній
| MVF50NN151CMK40 |
|
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Part Status: Active
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Part Status: Active
товар відсутній
| MVF50NS151CMK50 |
|
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
товар відсутній
| MVF60NN151CMK40 |
|
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
товар відсутній
| MVF61NN151CMK50 |
|
Виробник: NXP USA Inc.
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 167MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz, 167MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
товар відсутній
| P1023RDB-PA |
|
Виробник: NXP USA Inc.
Description: PLATFORM REF DESIGN WLAN P1023
Packaging: Tray
For Use With/Related Products: P1023
Type: Transceiver; 802.11 a/b/g/n (Wi-Fi, WiFi, WLAN)
Supplied Contents: Board(s)
Part Status: Active
Description: PLATFORM REF DESIGN WLAN P1023
Packaging: Tray
For Use With/Related Products: P1023
Type: Transceiver; 802.11 a/b/g/n (Wi-Fi, WiFi, WLAN)
Supplied Contents: Board(s)
Part Status: Active
товар відсутній
| P2010NXE2MHC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
товар відсутній
| P2010NXN2MHC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
товар відсутній
| P2040NSN7HLC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 800MHZ 780FCPBGA
Packaging: Tray
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Description: IC MPU QORIQ P2 800MHZ 780FCPBGA
Packaging: Tray
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
товар відсутній
| P2041NSE7MMC |
|
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Obsolete
Description: IC MPU Q OR IQ 1.2GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Part Status: Obsolete
товар відсутній
| P2041NSN7PNC |
|
Виробник: NXP USA Inc.
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA
Description: IC MPU Q OR IQ 1.5GHZ 780FCBGA
на замовлення 58 шт:
термін постачання 21-31 дні (днів)| MC10XS3425EK |
|
Виробник: NXP USA Inc.
Description: IC SWITCH 32SOIC SPQL1025
Description: IC SWITCH 32SOIC SPQL1025
на замовлення 42 шт:
термін постачання 21-31 дні (днів)| MC10XS3535DHFK |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
Description: IC PWR SWITCH N-CHAN 1:6 24PQFN
Features: Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 10mOhm (Max), 35mOhm (Max)
Voltage - Load: 7V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Ratio - Input:Output: 1:6
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Part Status: Obsolete
товар відсутній
| MC33730EK |
Виробник: NXP USA Inc.
Description: IC REG TRIPLE BUCK/LINEAR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 26.5V
Frequency - Switching: 100kHz ~ 500kHz
Topology: Step-Down (Buck) (1), Linear (LDO) (2)
Supplier Device Package: 32-SOIC-EP
Voltage/Current - Output 1: 5V, 2A
Voltage/Current - Output 2: Adjustable, 15mA
Voltage/Current - Output 3: Adjustable, 15mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Part Status: Active
Number of Outputs: 3
Description: IC REG TRIPLE BUCK/LINEAR 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 26.5V
Frequency - Switching: 100kHz ~ 500kHz
Topology: Step-Down (Buck) (1), Linear (LDO) (2)
Supplier Device Package: 32-SOIC-EP
Voltage/Current - Output 1: 5V, 2A
Voltage/Current - Output 2: Adjustable, 15mA
Voltage/Current - Output 3: Adjustable, 15mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Part Status: Active
Number of Outputs: 3
товар відсутній
| MC33790HEG |
Виробник: NXP USA Inc.
Description: IC DSI INTERFACE 2CH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
Description: IC DSI INTERFACE 2CH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
товар відсутній
| MC33790HEGR2 |
Виробник: NXP USA Inc.
Description: IC DSI INTERFACE 2CH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
Description: IC DSI INTERFACE 2CH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 1 mA
DigiKey Programmable: Not Verified
товар відсутній
| MC33813AE |
|
Виробник: NXP USA Inc.
Description: IC CTRL SMALL ENG 1CYL 48LQFP
Description: IC CTRL SMALL ENG 1CYL 48LQFP
на замовлення 165 шт:
термін постачання 21-31 дні (днів)| MC33981ABHFK |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
на замовлення 360 шт:
термін постачання 21-31 дні (днів)| MC34903CP3EKR2 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
Part Status: Obsolete
Description: IC SWITCH HIGH SIDE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2mA
Supplier Device Package: 32-SOIC-EP
Part Status: Obsolete
товар відсутній