Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (39583) > Сторінка 438 з 660
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 522-93-084-10-031001 | Mill-Max Manufacturing Corp. |
 Description: SKT PGA WRAPOST |
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| 522-93-084-10-031002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-10-031003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-11-041001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-11-041002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-11-041003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-11-045001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-11-045002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-11-045003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 522-93-084-12-051001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA WRAPOST |
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| 0038-3-17-01-30-14-02-0 | Mill-Max Manufacturing Corp. | Description: CONN RECEPT PIN WRAPOST .500" |
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| 0088-3-17-01-30-14-02-0 | Mill-Max Manufacturing Corp. | Description: CONN RECEPT PIN WRAPOST .510" |
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| 0088-3-17-01-32-14-02-0 | Mill-Max Manufacturing Corp. | Description: CONN RECEPT PIN WRAPOST .510" |
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| 801-41-041-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 41POS 0.1 GOLD PCB |
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| 801-41-041-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 41POS 0.1 GOLD PCB |
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| 831-41-041-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 41POS 0.079 GOLD PCB |
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851-41-041-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 41POS 0.05 GOLD PCB |
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851-41-041-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 41POS 0.05 GOLD PCB |
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| 833-43-036-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 36POS 0.079 GOLD PCB |
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| 833-43-036-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 36POS 0.079 GOLD SMD |
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| 116-91-636-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
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| 116-91-636-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
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| 116-91-636-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-636-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
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| 116-91-636-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-320-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-320-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-322-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-320-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-322-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-324-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-320-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-322-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-324-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-322-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-328-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-324-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-320-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-324-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-328-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-322-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-328-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-328-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-324-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 116-91-328-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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801-93-016-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 16POS 0.1 GOLD PCB R/A Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Through Hole, Right Angle Number of Positions: 16 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.100" (2.54mm) Number of Rows: 1 |
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335-90-115-00-160000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER VERT 15POS 2.54MM |
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335-90-116-00-160000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER VERT 16POS 2.54MM Packaging: Bulk Connector Type: Header Voltage Rating: 100V, 150VDC Mounting Type: Through Hole Number of Positions: 16 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Contact Shape: Circular Contact Length - Post: 0.104" (2.64mm) Insulation Height: 0.050" (1.27mm) Shrouding: Unshrouded Overall Contact Length: 0.299" (7.60mm) Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Contact Length - Mating: 0.125" (3.18mm) |
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| 319-10-129-00-002000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 29POS PCB Packaging: Bulk Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole Material: Brass Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 29 Number of Rows: 1 |
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| 319-10-129-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 29POS PCB Packaging: Bulk Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole Material: Brass Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 29 Number of Rows: 1 |
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| 801-93-015-62-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 15POS 0.1 GOLD PCB |
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| 801-93-016-10-004000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 16POS 0.1 GOLD PCB |
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| 399-90-126-10-009000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER R/A 26POS 2.54MM Packaging: Bulk Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 26 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Contact Shape: Circular Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT) Contact Length - Mating: 0.157" (4.00mm) |
товар відсутній |
||
| 315-13-148-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 48POS 0.1 GOLD PCB |
товар відсутній |
||
| 0553-2-15-01-11-14-10-0 | Mill-Max Manufacturing Corp. | Description: CONN RECEPT PIN .015-.021" .154" |
товар відсутній |
||
| 9324-0-15-01-23-27-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN RECEPT PIN .045-.065" .145" Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.119" (3.02mm) Length - Overall: 0.395" (10.03mm) Termination: Press-Fit Mounting Hole Diameter: 0.106" (2.69mm) Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.045" ~ 0.065" (1.14mm ~ 1.65mm) Pin Hole Diameter: 0.088" (2.24mm) Tail Diameter: 0.041" (1.04mm) Socket Depth: 0.200" (5.08mm) |
товар відсутній |
||
| 4034-0-15-01-23-27-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN RECEPT PIN .045-.065" .125" Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.123" (3.12mm) Length - Overall: 0.725" (18.42mm) Termination: Press-Fit Mounting Hole Diameter: 0.109" (2.77mm) Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.045" ~ 0.065" (1.14mm ~ 1.65mm) Pin Hole Diameter: 0.088" (2.24mm) Tail Diameter: 0.040" (1.02mm) Socket Depth: 0.375" (9.53mm) |
товар відсутній |
||
| 816-22-048-10-000101 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING PISTON 48POS PCB |
товар відсутній |
||
| 816-22-048-10-001101 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING PISTON 48POS PCB |
товар відсутній |
| 522-93-084-10-031001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-10-031002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-10-031003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-11-041001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-11-041002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-11-041003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-11-045001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-11-045002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-11-045003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 522-93-084-12-051001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
товар відсутній
| 0038-3-17-01-30-14-02-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN WRAPOST .500"
Description: CONN RECEPT PIN WRAPOST .500"
товар відсутній
| 0088-3-17-01-30-14-02-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN WRAPOST .510"
Description: CONN RECEPT PIN WRAPOST .510"
товар відсутній
| 0088-3-17-01-32-14-02-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN WRAPOST .510"
Description: CONN RECEPT PIN WRAPOST .510"
товар відсутній
| 801-41-041-10-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 41POS 0.1 GOLD PCB
Description: CONN RCPT 41POS 0.1 GOLD PCB
товар відсутній
| 801-41-041-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 41POS 0.1 GOLD PCB
Description: CONN RCPT 41POS 0.1 GOLD PCB
товар відсутній
| 831-41-041-10-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 41POS 0.079 GOLD PCB
Description: CONN RCPT 41POS 0.079 GOLD PCB
товар відсутній
| 851-41-041-10-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 41POS 0.05 GOLD PCB
Description: CONN RCPT 41POS 0.05 GOLD PCB
товар відсутній
| 851-41-041-10-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 41POS 0.05 GOLD PCB
Description: CONN RCPT 41POS 0.05 GOLD PCB
товар відсутній
| 833-43-036-10-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 36POS 0.079 GOLD PCB
Description: CONN RCPT 36POS 0.079 GOLD PCB
товар відсутній
| 833-43-036-30-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 36POS 0.079 GOLD SMD
Description: CONN RCPT 36POS 0.079 GOLD SMD
товар відсутній
| 116-91-636-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
товар відсутній
| 116-91-636-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
товар відсутній
| 116-91-636-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-636-41-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
товар відсутній
| 116-91-636-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-632-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-320-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-320-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-322-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-320-41-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-322-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-324-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-320-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-322-41-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-324-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-322-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-328-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-324-41-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-320-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-324-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-328-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-322-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-328-41-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-328-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-324-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 116-91-328-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 801-93-016-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 16POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Number of Rows: 1
Description: CONN RCPT 16POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 16
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Number of Rows: 1
товар відсутній
| 335-90-115-00-160000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER VERT 15POS 2.54MM
Description: CONN HEADER VERT 15POS 2.54MM
товар відсутній
| 335-90-116-00-160000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER VERT 16POS 2.54MM
Packaging: Bulk
Connector Type: Header
Voltage Rating: 100V, 150VDC
Mounting Type: Through Hole
Number of Positions: 16
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Shape: Circular
Contact Length - Post: 0.104" (2.64mm)
Insulation Height: 0.050" (1.27mm)
Shrouding: Unshrouded
Overall Contact Length: 0.299" (7.60mm)
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Length - Mating: 0.125" (3.18mm)
Description: CONN HEADER VERT 16POS 2.54MM
Packaging: Bulk
Connector Type: Header
Voltage Rating: 100V, 150VDC
Mounting Type: Through Hole
Number of Positions: 16
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Shape: Circular
Contact Length - Post: 0.104" (2.64mm)
Insulation Height: 0.050" (1.27mm)
Shrouding: Unshrouded
Overall Contact Length: 0.299" (7.60mm)
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Length - Mating: 0.125" (3.18mm)
товар відсутній
| 319-10-129-00-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 29POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 29
Number of Rows: 1
Description: CONN SPRING TARGET 29POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 29
Number of Rows: 1
товар відсутній
| 319-10-129-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 29POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 29
Number of Rows: 1
Description: CONN SPRING TARGET 29POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 29
Number of Rows: 1
товар відсутній
| 801-93-015-62-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 15POS 0.1 GOLD PCB
Description: CONN RCPT 15POS 0.1 GOLD PCB
товар відсутній
| 801-93-016-10-004000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 16POS 0.1 GOLD PCB
Description: CONN RCPT 16POS 0.1 GOLD PCB
товар відсутній
| 399-90-126-10-009000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER R/A 26POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 26
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Shape: Circular
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Contact Length - Mating: 0.157" (4.00mm)
Description: CONN HEADER R/A 26POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 26
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Shape: Circular
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Contact Length - Mating: 0.157" (4.00mm)
товар відсутній
| 315-13-148-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 48POS 0.1 GOLD PCB
Description: CONN RCPT 48POS 0.1 GOLD PCB
товар відсутній
| 0553-2-15-01-11-14-10-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN .015-.021" .154"
Description: CONN RECEPT PIN .015-.021" .154"
товар відсутній
| 9324-0-15-01-23-27-04-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN .045-.065" .145"
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.119" (3.02mm)
Length - Overall: 0.395" (10.03mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.106" (2.69mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.045" ~ 0.065" (1.14mm ~ 1.65mm)
Pin Hole Diameter: 0.088" (2.24mm)
Tail Diameter: 0.041" (1.04mm)
Socket Depth: 0.200" (5.08mm)
Description: CONN RECEPT PIN .045-.065" .145"
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.119" (3.02mm)
Length - Overall: 0.395" (10.03mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.106" (2.69mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.045" ~ 0.065" (1.14mm ~ 1.65mm)
Pin Hole Diameter: 0.088" (2.24mm)
Tail Diameter: 0.041" (1.04mm)
Socket Depth: 0.200" (5.08mm)
товар відсутній
| 4034-0-15-01-23-27-04-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RECEPT PIN .045-.065" .125"
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.123" (3.12mm)
Length - Overall: 0.725" (18.42mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.109" (2.77mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.045" ~ 0.065" (1.14mm ~ 1.65mm)
Pin Hole Diameter: 0.088" (2.24mm)
Tail Diameter: 0.040" (1.02mm)
Socket Depth: 0.375" (9.53mm)
Description: CONN RECEPT PIN .045-.065" .125"
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.123" (3.12mm)
Length - Overall: 0.725" (18.42mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.109" (2.77mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.045" ~ 0.065" (1.14mm ~ 1.65mm)
Pin Hole Diameter: 0.088" (2.24mm)
Tail Diameter: 0.040" (1.02mm)
Socket Depth: 0.375" (9.53mm)
товар відсутній
| 816-22-048-10-000101 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING PISTON 48POS PCB
Description: CONN SPRING PISTON 48POS PCB
товар відсутній
| 816-22-048-10-001101 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING PISTON 48POS PCB
Description: CONN SPRING PISTON 48POS PCB
товар відсутній