Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (39583) > Сторінка 411 з 660
| Фото | Назва | Виробник | Інформація |
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| 334-10-116-00-000000 | Mill-Max Manufacturing Corp. |
 Description: CONN HDR POST 16POS GOLD |
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| 334-10-115-00-100000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 15POS GOLD |
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| 415-41-222-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 22POS 0.1 GOLD PCB |
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| 415-41-224-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 24POS 0.1 GOLD PCB |
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| 415-41-222-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 22POS 0.1 GOLD PCB |
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| 326-43-150-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 50POS 0.1 GOLD PCB |
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| 326-43-150-41-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 50POS 0.1 GOLD PCB |
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| 326-43-149-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 49 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.594" (15.09mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 326-43-150-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 50POS 0.1 GOLD PCB |
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| 511-13-155-16-003001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 155 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 511-13-155-16-003002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 155 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 511-13-155-16-003003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 155 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 323-93-134-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 34POS 0.1 GOLD PCB |
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853-43-014-10-021000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.05 GOLD PCB |
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853-43-016-10-011000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 16POS 0.05 GOLD PCB |
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853-43-014-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14P 0.05 GOLD PCB R/A |
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| 853-43-018-10-003000 | Mill-Max Manufacturing Corp. |
Description: STANDARD SOCKET HEADER Packaging: Tube Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 18 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Cup Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Length - Post: 0.191" (4.85mm) Insulation Height: 0.149" (3.78mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
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| 310-44-162-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 62POS 0.1 TIN PCB |
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851-41-049-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49P 0.05 GOLD PCB R/A |
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851-91-049-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49P 0.05 GOLD PCB R/A |
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| 831-41-049-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49P 0.079 GOLD PCB R/A |
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316-47-135-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 35POS 0.1 GOLD PCB |
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| 714-43-226-31-007000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 26POS 0.1 GOLD PCB |
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| 510-13-177-15-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 177 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-177-15-061002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 177 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-177-15-061003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 177 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-15-041001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-15-041002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-15-041003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-095002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-095003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-117001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-095001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 315-13-115-61-003000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 15POS 0.1 GOLD PCB |
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| 310-13-115-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 15POS 0.1 GOLD PCB |
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311-13-115-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 15POS 0.1 GOLD PCB |
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853-43-018-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 18POS 0.05 GOLD SMD |
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853-43-018-10-011000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 18POS 0.05 GOLD PCB |
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853-43-018-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 18P 0.05 GOLD PCB R/A |
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| 323-11-127-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 27POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 27 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.510" (12.95mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 323-11-128-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 28POS 0.1 GOLD PCB |
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| 323-11-130-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 30POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.510" (12.95mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 323-11-131-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 31POS 0.1 GOLD PCB |
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315-13-120-41-001000 | Mill-Max Manufacturing Corp. | Description: SOCKET LOW PROFILE SIP 20POS |
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311-13-120-41-001000 | Mill-Max Manufacturing Corp. | Description: SOCKET LONG SOLDERTAIL SIP 20POS |
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| 315-13-120-41-004000 | Mill-Max Manufacturing Corp. | Description: STANDRD SOLDER TAIL SIP SOCKET |
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| 311-13-120-41-003000 | Mill-Max Manufacturing Corp. | Description: STANDRD SOLDER TAIL SIP SOCKET |
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| 321-13-120-41-001000 | Mill-Max Manufacturing Corp. |
Description: SOCKET 1 LEVEL WRAPOST SIP 20POS |
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| 322-13-120-41-001000 | Mill-Max Manufacturing Corp. |
Description: SOCKET 2 LEVEL WRAPOST SIP 20POS |
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| 323-13-120-41-001000 | Mill-Max Manufacturing Corp. |
Description: SOCKET 3 LEVEL WRAPOST SIP 20POS |
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| 850-10-007-20-003000 | Mill-Max Manufacturing Corp. |
Description: STANDARD PIN HEADER Packaging: Tube Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole, Right Angle Number of Positions: 7 Pitch: 0.050" (1.27mm) Contact Type: Solder Cup Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Number of Rows: 1 |
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850-10-007-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER R/A 7POS 1.27MM Packaging: Tube Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 7 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Circular Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.087" (2.20mm) Shrouding: Unshrouded Insulation Material: Polyamide (PA46), Nylon 4/6 Contact Length - Mating: 0.118" (3.00mm) |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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830-10-007-20-005000 | Mill-Max Manufacturing Corp. |
Description: STANDARD PIN HEADER Packaging: Tube Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole, Right Angle Number of Positions: 7 Pitch: 0.079" (2.00mm) Contact Type: Solder Cup Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Number of Rows: 1 |
на замовлення 73 шт: термін постачання 21-31 дні (днів) |
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342-10-110-00-591000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR DIP POST 10POS GOLD Packaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 10 Pitch: 0.100" (2.54mm) Contact Type: Post, Extended Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 1 |
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342-10-109-00-593000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR DIP POST 9POS GOLD |
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342-10-109-00-594000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR DIP POST 9POS GOLD |
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852-40-022-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER SMD 22POS 1.27MM |
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| 832-40-022-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER SMD 22POS 2MM |
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850-40-022-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER SMD 22POS 1.27MM |
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850-40-022-30-002000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER SMD 22POS 1.27MM |
товар відсутній |
| 334-10-116-00-000000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 16POS GOLD
Description: CONN HDR POST 16POS GOLD
товар відсутній
| 334-10-115-00-100000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 15POS GOLD
Description: CONN HDR POST 15POS GOLD
товар відсутній
| 415-41-222-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 22POS 0.1 GOLD PCB
Description: CONN RCPT 22POS 0.1 GOLD PCB
товар відсутній
| 415-41-224-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 24POS 0.1 GOLD PCB
Description: CONN RCPT 24POS 0.1 GOLD PCB
товар відсутній
| 415-41-222-41-003000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 22POS 0.1 GOLD PCB
Description: CONN RCPT 22POS 0.1 GOLD PCB
товар відсутній
| 326-43-150-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 GOLD PCB
Description: CONN RCPT 50POS 0.1 GOLD PCB
товар відсутній
| 326-43-150-41-002000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 GOLD PCB
Description: CONN RCPT 50POS 0.1 GOLD PCB
товар відсутній
| 326-43-149-41-003000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 49
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.594" (15.09mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 49POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 49
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.594" (15.09mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
| 326-43-150-41-003000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 GOLD PCB
Description: CONN RCPT 50POS 0.1 GOLD PCB
товар відсутній
| 511-13-155-16-003001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 511-13-155-16-003002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 511-13-155-16-003003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 323-93-134-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 34POS 0.1 GOLD PCB
Description: CONN RCPT 34POS 0.1 GOLD PCB
товар відсутній
| 853-43-014-10-021000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.05 GOLD PCB
Description: CONN RCPT 14POS 0.05 GOLD PCB
товар відсутній
| 853-43-016-10-011000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 16POS 0.05 GOLD PCB
Description: CONN RCPT 16POS 0.05 GOLD PCB
товар відсутній
| 853-43-014-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14P 0.05 GOLD PCB R/A
Description: CONN RCPT 14P 0.05 GOLD PCB R/A
товар відсутній
| 853-43-018-10-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD SOCKET HEADER
Packaging: Tube
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Length - Post: 0.191" (4.85mm)
Insulation Height: 0.149" (3.78mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: STANDARD SOCKET HEADER
Packaging: Tube
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Length - Post: 0.191" (4.85mm)
Insulation Height: 0.149" (3.78mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товар відсутній
| 310-44-162-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 62POS 0.1 TIN PCB
Description: CONN RCPT 62POS 0.1 TIN PCB
товар відсутній
| 851-41-049-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
товар відсутній
| 851-91-049-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
товар відсутній
| 831-41-049-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49P 0.079 GOLD PCB R/A
Description: CONN RCPT 49P 0.079 GOLD PCB R/A
товар відсутній
| 316-47-135-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 35POS 0.1 GOLD PCB
Description: CONN SOCKET 35POS 0.1 GOLD PCB
товар відсутній
| 714-43-226-31-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 26POS 0.1 GOLD PCB
Description: CONN RCPT 26POS 0.1 GOLD PCB
товар відсутній
| 510-13-177-15-061001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-177-15-061002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-177-15-061003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-179-15-041001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-179-15-041002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-179-15-041003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-179-18-095002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-179-18-095003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-179-18-117001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-179-18-095001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 315-13-115-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 15POS 0.1 GOLD PCB
Description: CONN RCPT 15POS 0.1 GOLD PCB
товар відсутній
| 310-13-115-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 15POS 0.1 GOLD PCB
Description: CONN RCPT 15POS 0.1 GOLD PCB
товар відсутній
| 311-13-115-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 15POS 0.1 GOLD PCB
Description: CONN RCPT 15POS 0.1 GOLD PCB
товар відсутній
| 853-43-018-30-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 18POS 0.05 GOLD SMD
Description: CONN RCPT 18POS 0.05 GOLD SMD
товар відсутній
| 853-43-018-10-011000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 18POS 0.05 GOLD PCB
Description: CONN RCPT 18POS 0.05 GOLD PCB
товар відсутній
| 853-43-018-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 18P 0.05 GOLD PCB R/A
Description: CONN RCPT 18P 0.05 GOLD PCB R/A
товар відсутній
| 323-11-127-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 27POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 27
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 27POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 27
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
| 323-11-128-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.1 GOLD PCB
Description: CONN RCPT 28POS 0.1 GOLD PCB
товар відсутній
| 323-11-130-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 30POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 30POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
| 323-11-131-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 31POS 0.1 GOLD PCB
Description: CONN RCPT 31POS 0.1 GOLD PCB
товар відсутній
| 315-13-120-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET LOW PROFILE SIP 20POS
Description: SOCKET LOW PROFILE SIP 20POS
товар відсутній
| 311-13-120-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET LONG SOLDERTAIL SIP 20POS
Description: SOCKET LONG SOLDERTAIL SIP 20POS
товар відсутній
| 315-13-120-41-004000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDER TAIL SIP SOCKET
Description: STANDRD SOLDER TAIL SIP SOCKET
товар відсутній
| 311-13-120-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDER TAIL SIP SOCKET
Description: STANDRD SOLDER TAIL SIP SOCKET
товар відсутній
| 321-13-120-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET 1 LEVEL WRAPOST SIP 20POS
Description: SOCKET 1 LEVEL WRAPOST SIP 20POS
товар відсутній
| 322-13-120-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET 2 LEVEL WRAPOST SIP 20POS
Description: SOCKET 2 LEVEL WRAPOST SIP 20POS
товар відсутній
| 323-13-120-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET 3 LEVEL WRAPOST SIP 20POS
Description: SOCKET 3 LEVEL WRAPOST SIP 20POS
товар відсутній
| 850-10-007-20-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD PIN HEADER
Packaging: Tube
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole, Right Angle
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
Description: STANDARD PIN HEADER
Packaging: Tube
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole, Right Angle
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
товар відсутній
| 850-10-007-20-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER R/A 7POS 1.27MM
Packaging: Tube
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 7
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Circular
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.087" (2.20mm)
Shrouding: Unshrouded
Insulation Material: Polyamide (PA46), Nylon 4/6
Contact Length - Mating: 0.118" (3.00mm)
Description: CONN HEADER R/A 7POS 1.27MM
Packaging: Tube
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 7
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Circular
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.087" (2.20mm)
Shrouding: Unshrouded
Insulation Material: Polyamide (PA46), Nylon 4/6
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 56 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1181.7 грн |
| 56+ | 921.24 грн |
| 830-10-007-20-005000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD PIN HEADER
Packaging: Tube
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole, Right Angle
Number of Positions: 7
Pitch: 0.079" (2.00mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
Description: STANDARD PIN HEADER
Packaging: Tube
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole, Right Angle
Number of Positions: 7
Pitch: 0.079" (2.00mm)
Contact Type: Solder Cup
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
на замовлення 73 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1276.94 грн |
| 10+ | 1065.97 грн |
| 37+ | 1010.36 грн |
| 342-10-110-00-591000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR DIP POST 10POS GOLD
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
Description: CONN HDR DIP POST 10POS GOLD
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 1
товар відсутній
| 342-10-109-00-593000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR DIP POST 9POS GOLD
Description: CONN HDR DIP POST 9POS GOLD
товар відсутній
| 342-10-109-00-594000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR DIP POST 9POS GOLD
Description: CONN HDR DIP POST 9POS GOLD
товар відсутній
| 852-40-022-30-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER SMD 22POS 1.27MM
Description: CONN HEADER SMD 22POS 1.27MM
товар відсутній
| 832-40-022-30-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER SMD 22POS 2MM
Description: CONN HEADER SMD 22POS 2MM
товар відсутній
| 850-40-022-30-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER SMD 22POS 1.27MM
Description: CONN HEADER SMD 22POS 1.27MM
товар відсутній
| 850-40-022-30-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER SMD 22POS 1.27MM
Description: CONN HEADER SMD 22POS 1.27MM
товар відсутній