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853-43-022-10-003000 Mill-Max Manufacturing Corp. Description: STANDARD SOCKET HEADER
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 22
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Length - Post: 0.191" (4.85mm)
Insulation Height: 0.149" (3.78mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товар відсутній
833-43-010-20-001000 Mill-Max Manufacturing Corp. 2017-11%3A045.pdf Description: CONN RCPT 10P 0.079 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.140" (3.56mm)
Insulation Height: 0.157" (4.00mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
851-47-049-20-001000 851-47-049-20-001000 Mill-Max Manufacturing Corp. 040.pdf Description: CONN RCPT 49P 0.05 GOLD PCB R/A
товар відсутній
803-99-050-10-002000 803-99-050-10-002000 Mill-Max Manufacturing Corp. 2017-11%3A061.pdf Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
товар відсутній
803-99-050-10-001000 803-99-050-10-001000 Mill-Max Manufacturing Corp. 061.pdf Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
товар відсутній
803-99-050-10-004000 803-99-050-10-004000 Mill-Max Manufacturing Corp. 2017-11%3A061.pdf Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 50
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.272" (6.91mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
803-99-050-61-001000 803-99-050-61-001000 Mill-Max Manufacturing Corp. Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
товар відсутній
801-99-005-40-002000 Mill-Max Manufacturing Corp. 061.pdf Description: CONN RCPT 5P 0.1 TIN-LEAD SMD RA
товар відсутній
3121-2-00-34-00-00-08-0 3121-2-00-34-00-00-08-0 Mill-Max Manufacturing Corp. 2017-11%3A208.pdf Description: PIN RECEP GOLD SLDER MNT IN .023
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.040" (1.02mm)
Terminal Type: PC Pin
Flange Diameter: 0.040" (1.02mm)
Length - Overall: 0.248" (6.30mm)
Termination: Solder
Mounting Hole Diameter: 0.023" (0.58mm)
Contact Finish Thickness: 50.0µin (1.27µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.017" (0.43mm) Dia
Pin Size - Below Flange: 0.019" (0.48mm) Dia
Length - Below Flange: 0.075" (1.91mm)
Length - Above Flange: 0.157" (3.99mm)
Part Status: Active
на замовлення 889 шт:
термін постачання 21-31 дні (днів)
5+63.26 грн
10+ 51.63 грн
100+ 46.4 грн
Мінімальне замовлення: 5
3121-2-00-21-00-00-08-0 Mill-Max Manufacturing Corp. 2017-11%3A208.pdf Description: CONN PC PIN CIRC 0.017DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.040" (1.02mm)
Terminal Type: PC Pin
Flange Diameter: 0.040" (1.02mm)
Length - Overall: 0.248" (6.30mm)
Termination: Solder
Mounting Hole Diameter: 0.023" (0.58mm)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.017" (0.43mm) Dia
Pin Size - Below Flange: 0.019" (0.48mm) Dia
Length - Below Flange: 0.075" (1.91mm)
Length - Above Flange: 0.157" (3.99mm)
Part Status: Active
на замовлення 880 шт:
термін постачання 21-31 дні (днів)
5+63.26 грн
10+ 51.55 грн
25+ 49.47 грн
50+ 45.44 грн
100+ 43.47 грн
250+ 39.52 грн
500+ 34.98 грн
Мінімальне замовлення: 5
3121-2-00-80-00-00-08-0 Mill-Max Manufacturing Corp. 2017-11%3A208.pdf Description: CONN PC PIN CIRC
на замовлення 311 шт:
термін постачання 21-31 дні (днів)
6+54 грн
10+ 43.75 грн
25+ 41.96 грн
50+ 38.52 грн
100+ 36.84 грн
250+ 33.5 грн
Мінімальне замовлення: 6
346-43-116-41-013000 346-43-116-41-013000 Mill-Max Manufacturing Corp. 304,346%20Series%20(in.).pdf Description: CONN SOCKET SIP 16POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
346-43-117-41-013000 346-43-117-41-013000 Mill-Max Manufacturing Corp. 304,346%20Series%20(in.).pdf Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
346-43-118-41-013000 346-43-118-41-013000 Mill-Max Manufacturing Corp. 073.pdf Description: CONN SOCKET SIP 18POS GOLD
товар відсутній
346-43-119-41-013000 346-43-119-41-013000 Mill-Max Manufacturing Corp. 073.pdf Description: CONN SOCKET SIP 19POS GOLD
товар відсутній
346-43-116-41-012000 Mill-Max Manufacturing Corp. 073.pdf Description: CONN RCPT 16POS 0.1 GOLD PCB
товар відсутній
346-43-117-41-012000 Mill-Max Manufacturing Corp. 073.pdf Description: CONN RCPT 17POS 0.1 GOLD PCB
товар відсутній
346-43-119-41-012000 Mill-Max Manufacturing Corp. 073.pdf Description: CONN RCPT 19POS 0.1 GOLD PCB
товар відсутній
614-43-422-31-012000 Mill-Max Manufacturing Corp. 139.pdf Description: SKT CARRIER PGA
товар відсутній
3301-1-14-80-00-00-08-0 Mill-Max Manufacturing Corp. 2017-11%3A219.pdf Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole, Right Angle
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass
Terminal Style: Single End
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.051" (1.30mm)
товар відсутній
3360-1-14-80-00-00-08-0 Mill-Max Manufacturing Corp. 3360-1-14-80-00-00-08-0.pdf Description: CIRCUIT PIN JUMPER
товар відсутній
330-10-101-00-240000 Mill-Max Manufacturing Corp. 020.pdf Description: CONN SPRING TARGET 1POS SLD PCB
товар відсутній
324-91-155-41-002000 Mill-Max Manufacturing Corp. 069.pdf Description: CONN RCPT 55POS 0.1 GOLD PCB
товар відсутній
329-43-158-41-540000 Mill-Max Manufacturing Corp. 2017-11%3A048.pdf Description: CONN RCPT 58POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 58
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
329-43-159-41-540000 Mill-Max Manufacturing Corp. 2017-11%3A048.pdf Description: CONN RCPT 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
329-43-161-41-540000 Mill-Max Manufacturing Corp. 2017-11%3A048.pdf Description: CONN RCPT 61POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 61
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
3140-1-00-80-00-00-08-0 3140-1-00-80-00-00-08-0 Mill-Max Manufacturing Corp. 2020-01%3A221.pdf Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.851" (21.62mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Wire
Pin Size - Above Flange: 0.039" (0.99mm) Dia
Pin Size - Below Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.780" (19.81mm)
Length - Above Flange: 0.051" (1.30mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
5+65.57 грн
10+ 53.11 грн
25+ 50.96 грн
50+ 46.83 грн
100+ 44.79 грн
250+ 40.72 грн
500+ 36.05 грн
1000+ 32.04 грн
Мінімальне замовлення: 5
2316-2-00-80-00-00-07-0 2316-2-00-80-00-00-07-0 Mill-Max Manufacturing Corp. 2017-11%3A231.pdf Description: TERM TURRET SINGLE L=3.84MM TIN
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: Single End
Flange Diameter: 0.094" (2.39mm)
Length - Overall: 0.245" (6.22mm)
Termination: Swage
Length - Above Board: 0.151" (3.84mm)
Mounting Hole Diameter: 0.064" (1.63mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.060" (1.52mm)
Number of Turrets: Single
Length - Below Flange: 0.094" (2.39mm)
Staking Side OD: 0.060" (1.52mm)
Staking Side ID: 0.042" (1.07mm)
Part Status: Active
на замовлення 3091 шт:
термін постачання 21-31 дні (днів)
9+37.8 грн
10+ 30.98 грн
25+ 29.71 грн
50+ 27.27 грн
100+ 26.09 грн
250+ 23.73 грн
500+ 21 грн
1000+ 20.54 грн
Мінімальне замовлення: 9
399-10-109-10-008000 399-10-109-10-008000 Mill-Max Manufacturing Corp. CONN%20SPRING%20TARGET%2010POS%20SMD?s_term=CONN+SPRING+TARGET+10POS+SMD&s_type=Quick%2FProduct%2FPart+Number+Search#319-XX-XXX-00-006000 Description: CONN SPRING TARGET 9POS R/A PCB
Packaging: Tube
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Contacts: 9
Number of Rows: 1
на замовлення 770 шт:
термін постачання 21-31 дні (днів)
2+240.69 грн
10+ 210.6 грн
100+ 185.58 грн
500+ 148.03 грн
Мінімальне замовлення: 2
511-13-076-11-041002 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
товар відсутній
511-13-076-11-041003 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
товар відсутній
511-13-081-09-000001 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
товар відсутній
511-13-081-09-000002 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
товар відсутній
511-13-081-09-000003 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
товар відсутній
116-91-310-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-310-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-310-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-310-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-006000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-003000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-007000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-008000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A111.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-169-13-000001 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-169-13-000002 Mill-Max Manufacturing Corp. 2017-11%3A138.pdf Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
853-43-022-10-003000
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD SOCKET HEADER
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 22
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Length - Post: 0.191" (4.85mm)
Insulation Height: 0.149" (3.78mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товар відсутній
833-43-010-20-001000 2017-11%3A045.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 10P 0.079 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.140" (3.56mm)
Insulation Height: 0.157" (4.00mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товар відсутній
851-47-049-20-001000 040.pdf
851-47-049-20-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
товар відсутній
803-99-050-10-002000 2017-11%3A061.pdf
803-99-050-10-002000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
товар відсутній
803-99-050-10-001000 061.pdf
803-99-050-10-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
товар відсутній
803-99-050-10-004000 2017-11%3A061.pdf
803-99-050-10-004000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 50
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.272" (6.91mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
803-99-050-61-001000
803-99-050-61-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 TIN-LEAD PCB
товар відсутній
801-99-005-40-002000 061.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 5P 0.1 TIN-LEAD SMD RA
товар відсутній
3121-2-00-34-00-00-08-0 2017-11%3A208.pdf
3121-2-00-34-00-00-08-0
Виробник: Mill-Max Manufacturing Corp.
Description: PIN RECEP GOLD SLDER MNT IN .023
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.040" (1.02mm)
Terminal Type: PC Pin
Flange Diameter: 0.040" (1.02mm)
Length - Overall: 0.248" (6.30mm)
Termination: Solder
Mounting Hole Diameter: 0.023" (0.58mm)
Contact Finish Thickness: 50.0µin (1.27µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.017" (0.43mm) Dia
Pin Size - Below Flange: 0.019" (0.48mm) Dia
Length - Below Flange: 0.075" (1.91mm)
Length - Above Flange: 0.157" (3.99mm)
Part Status: Active
на замовлення 889 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+63.26 грн
10+ 51.63 грн
100+ 46.4 грн
Мінімальне замовлення: 5
3121-2-00-21-00-00-08-0 2017-11%3A208.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC 0.017DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.040" (1.02mm)
Terminal Type: PC Pin
Flange Diameter: 0.040" (1.02mm)
Length - Overall: 0.248" (6.30mm)
Termination: Solder
Mounting Hole Diameter: 0.023" (0.58mm)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.017" (0.43mm) Dia
Pin Size - Below Flange: 0.019" (0.48mm) Dia
Length - Below Flange: 0.075" (1.91mm)
Length - Above Flange: 0.157" (3.99mm)
Part Status: Active
на замовлення 880 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+63.26 грн
10+ 51.55 грн
25+ 49.47 грн
50+ 45.44 грн
100+ 43.47 грн
250+ 39.52 грн
500+ 34.98 грн
Мінімальне замовлення: 5
3121-2-00-80-00-00-08-0 2017-11%3A208.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
на замовлення 311 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
6+54 грн
10+ 43.75 грн
25+ 41.96 грн
50+ 38.52 грн
100+ 36.84 грн
250+ 33.5 грн
Мінімальне замовлення: 6
346-43-116-41-013000 304,346%20Series%20(in.).pdf
346-43-116-41-013000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 16POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
346-43-117-41-013000 304,346%20Series%20(in.).pdf
346-43-117-41-013000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Press-Fit
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
346-43-118-41-013000 073.pdf
346-43-118-41-013000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 18POS GOLD
товар відсутній
346-43-119-41-013000 073.pdf
346-43-119-41-013000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 19POS GOLD
товар відсутній
346-43-116-41-012000 073.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 16POS 0.1 GOLD PCB
товар відсутній
346-43-117-41-012000 073.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 17POS 0.1 GOLD PCB
товар відсутній
346-43-119-41-012000 073.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 GOLD PCB
товар відсутній
614-43-422-31-012000 139.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
товар відсутній
3301-1-14-80-00-00-08-0 2017-11%3A219.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole, Right Angle
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass
Terminal Style: Single End
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.051" (1.30mm)
товар відсутній
3360-1-14-80-00-00-08-0 3360-1-14-80-00-00-08-0.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CIRCUIT PIN JUMPER
товар відсутній
330-10-101-00-240000 020.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 1POS SLD PCB
товар відсутній
324-91-155-41-002000 069.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 55POS 0.1 GOLD PCB
товар відсутній
329-43-158-41-540000 2017-11%3A048.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 58
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
329-43-159-41-540000 2017-11%3A048.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
329-43-161-41-540000 2017-11%3A048.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 61POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 61
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товар відсутній
3140-1-00-80-00-00-08-0 2020-01%3A221.pdf
3140-1-00-80-00-00-08-0
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.851" (21.62mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Wire
Pin Size - Above Flange: 0.039" (0.99mm) Dia
Pin Size - Below Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.780" (19.81mm)
Length - Above Flange: 0.051" (1.30mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
5+65.57 грн
10+ 53.11 грн
25+ 50.96 грн
50+ 46.83 грн
100+ 44.79 грн
250+ 40.72 грн
500+ 36.05 грн
1000+ 32.04 грн
Мінімальне замовлення: 5
2316-2-00-80-00-00-07-0 2017-11%3A231.pdf
2316-2-00-80-00-00-07-0
Виробник: Mill-Max Manufacturing Corp.
Description: TERM TURRET SINGLE L=3.84MM TIN
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: Single End
Flange Diameter: 0.094" (2.39mm)
Length - Overall: 0.245" (6.22mm)
Termination: Swage
Length - Above Board: 0.151" (3.84mm)
Mounting Hole Diameter: 0.064" (1.63mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.060" (1.52mm)
Number of Turrets: Single
Length - Below Flange: 0.094" (2.39mm)
Staking Side OD: 0.060" (1.52mm)
Staking Side ID: 0.042" (1.07mm)
Part Status: Active
на замовлення 3091 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
9+37.8 грн
10+ 30.98 грн
25+ 29.71 грн
50+ 27.27 грн
100+ 26.09 грн
250+ 23.73 грн
500+ 21 грн
1000+ 20.54 грн
Мінімальне замовлення: 9
399-10-109-10-008000 CONN%20SPRING%20TARGET%2010POS%20SMD?s_term=CONN+SPRING+TARGET+10POS+SMD&s_type=Quick%2FProduct%2FPart+Number+Search#319-XX-XXX-00-006000
399-10-109-10-008000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 9POS R/A PCB
Packaging: Tube
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Contacts: 9
Number of Rows: 1
на замовлення 770 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+240.69 грн
10+ 210.6 грн
100+ 185.58 грн
500+ 148.03 грн
Мінімальне замовлення: 2
511-13-076-11-041002 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
товар відсутній
511-13-076-11-041003 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
товар відсутній
511-13-081-09-000001 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
товар відсутній
511-13-081-09-000002 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
товар відсутній
511-13-081-09-000003 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
товар відсутній
116-91-310-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-310-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-310-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-310-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-314-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-316-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-304-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-006000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-003000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-007000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-008000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
116-91-308-41-001000 2017-11%3A111.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-169-13-000001 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
515-91-169-13-000002 2017-11%3A138.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 169 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товар відсутній
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