Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (39583) > Сторінка 273 з 660
| Фото | Назва | Виробник | Інформація |
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499-43-204-10-003000 | Mill-Max Manufacturing Corp. |
 Description: CONN RCPT 4POS 0.1 GOLD PCB R/APackaging: Tube Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 4 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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| 499-43-206-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 6POS 0.1 GOLD PCB R/A |
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| 499-43-208-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 8POS 0.1 GOLD PCB R/A |
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| 499-43-210-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 10POS 0.1 GOLD PCB R/A |
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| 499-43-212-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 GOLD PCB R/A |
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| 499-43-214-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.1 GOLD PCB R/A Packaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 14 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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| 499-43-216-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 16POS 0.1 GOLD PCB R/A |
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| 499-43-218-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 18POS 0.1 GOLD PCB R/A |
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| 499-43-220-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 20POS 0.1 GOLD PCB R/A Packaging: Tube Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 20 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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| 499-43-222-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 22POS 0.1 GOLD PCB R/A |
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| 499-43-224-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 24POS 0.1 GOLD PCB R/A Packaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 24 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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| 499-43-226-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 26POS 0.1 GOLD PCB R/A Packaging: Tube Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 26 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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| 499-43-228-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 28POS 0.1 GOLD PCB R/A Packaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 28 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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| 499-43-236-10-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 36POS 0.1 GOLD PCB R/A Packaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole, Right Angle Number of Positions: 36 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.200" (5.08mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
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| 5011-0-00-15-00-00-03-4 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC |
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| 5016-0-00-80-00-00-03-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC |
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| 5016-0-00-80-00-00-03-4 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC |
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5059-0-15-15-34-14-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.102" (2.59mm) Length - Overall: 0.655" (16.64mm) Termination: Press-Fit Mounting Hole Diameter: 0.090" (2.29mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.032" ~ 0.046" (0.81mm ~ 1.17mm) Pin Hole Diameter: 0.064" (1.63mm) Tail Diameter: 0.030" (0.76mm) Socket Depth: 0.132" (3.35mm) |
на замовлення 999 шт: термін постачання 21-31 дні (днів) |
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| 5059-0-15-80-34-14-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT |
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| 5059-0-15-80-34-27-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT |
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| 5059-0-15-80-34-80-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT |
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| 510-11-068-11-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 68 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-012-05-001001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (5 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-022-05-001001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-032-09-041001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-032-09-041002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-032-09-041003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-036-06-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-036-06-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-036-06-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-045-08-005001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-045-08-005002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-045-08-005003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-064-08-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (8 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-064-08-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (8 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-064-08-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (8 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-072-09-001001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-072-09-001002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-072-09-001003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
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| 510-13-072-11-042001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 72 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-072-11-042002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 72 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-072-11-042003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 72 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-072-11-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 72 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-072-11-061002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 72 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-072-11-061003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 72 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-073-11-042001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 73 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-073-11-042002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 73 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-073-11-042003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 73 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-073-11-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 73 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-073-11-061002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 73 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-073-11-061003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 73 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-081-12-071001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 81 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-081-12-071002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 81 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-081-12-071003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 81 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 510-13-085-13-042001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товар відсутній |
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| 510-13-085-13-042002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товар відсутній |
||||||||||
| 510-13-085-13-042003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товар відсутній |
||||||||||
| 510-13-088-13-062001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товар відсутній |
||||||||||
| 510-13-088-13-062002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товар відсутній |
||||||||||
| 510-13-088-13-062003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товар відсутній |
| 499-43-204-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 4POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 4
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 4POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 4
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1236.68 грн |
| 10+ | 1032.34 грн |
| 25+ | 978.5 грн |
| 50+ | 904.97 грн |
| 499-43-206-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 6POS 0.1 GOLD PCB R/A
Description: CONN RCPT 6POS 0.1 GOLD PCB R/A
товар відсутній
| 499-43-208-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 8POS 0.1 GOLD PCB R/A
Description: CONN RCPT 8POS 0.1 GOLD PCB R/A
товар відсутній
| 499-43-210-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 10POS 0.1 GOLD PCB R/A
Description: CONN RCPT 10POS 0.1 GOLD PCB R/A
товар відсутній
| 499-43-212-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 GOLD PCB R/A
Description: CONN RCPT 12POS 0.1 GOLD PCB R/A
товар відсутній
| 499-43-214-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 14
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 14POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 14
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
| 499-43-216-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 16POS 0.1 GOLD PCB R/A
Description: CONN RCPT 16POS 0.1 GOLD PCB R/A
товар відсутній
| 499-43-218-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 18POS 0.1 GOLD PCB R/A
Description: CONN RCPT 18POS 0.1 GOLD PCB R/A
товар відсутній
| 499-43-220-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 20POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 20
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 20POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 20
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
| 499-43-222-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 22POS 0.1 GOLD PCB R/A
Description: CONN RCPT 22POS 0.1 GOLD PCB R/A
товар відсутній
| 499-43-224-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 24POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 24
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 24POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 24
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
| 499-43-226-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 26POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 26
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 26POS 0.1 GOLD PCB R/A
Packaging: Tube
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 26
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
| 499-43-228-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 28
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 28POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 28
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
| 499-43-236-10-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 36POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 36
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
Description: CONN RCPT 36POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Through Hole, Right Angle
Number of Positions: 36
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.200" (5.08mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 2
товар відсутній
| 5011-0-00-15-00-00-03-4 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Description: CONN PC PIN CIRC
товар відсутній
| 5016-0-00-80-00-00-03-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Description: CONN PC PIN CIRC
товар відсутній
| 5016-0-00-80-00-00-03-4 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Description: CONN PC PIN CIRC
товар відсутній
| 5059-0-15-15-34-14-04-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.102" (2.59mm)
Length - Overall: 0.655" (16.64mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.090" (2.29mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.032" ~ 0.046" (0.81mm ~ 1.17mm)
Pin Hole Diameter: 0.064" (1.63mm)
Tail Diameter: 0.030" (0.76mm)
Socket Depth: 0.132" (3.35mm)
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.102" (2.59mm)
Length - Overall: 0.655" (16.64mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.090" (2.29mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.032" ~ 0.046" (0.81mm ~ 1.17mm)
Pin Hole Diameter: 0.064" (1.63mm)
Tail Diameter: 0.030" (0.76mm)
Socket Depth: 0.132" (3.35mm)
на замовлення 999 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 168.81 грн |
| 10+ | 141.46 грн |
| 100+ | 126.37 грн |
| 5059-0-15-80-34-14-04-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Description: CONN PIN RCPT
товар відсутній
| 5059-0-15-80-34-27-04-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Description: CONN PIN RCPT
товар відсутній
| 5059-0-15-80-34-80-04-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Description: CONN PIN RCPT
товар відсутній
| 510-11-068-11-061001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-012-05-001001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-022-05-001001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-032-09-041001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-032-09-041002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-032-09-041003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-036-06-000001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-036-06-000002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-036-06-000003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-045-08-005001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-045-08-005002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-045-08-005003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-064-08-000001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (8 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (8 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-064-08-000002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (8 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (8 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-064-08-000003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (8 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (8 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 510-13-072-09-001001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-072-09-001002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-072-09-001003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-072-11-042001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-072-11-042002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-072-11-042003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-072-11-061001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-072-11-061002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-072-11-061003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 72 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-073-11-042001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-073-11-042002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-073-11-042003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-073-11-061001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-073-11-061002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-073-11-061003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 73 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-081-12-071001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 81 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 81 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-081-12-071002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 81 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 81 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-081-12-071003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 81 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 81 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 510-13-085-13-042001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-085-13-042002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-085-13-042003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-088-13-062001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-088-13-062002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній
| 510-13-088-13-062003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товар відсутній