Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (39392) > Сторінка 152 з 657
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480-10-242-00-001000 | Mill-Max Manufacturing Corp. |
 Description: CONN HDR SOLDER 42POS GOLDPackaging: Tube Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 42 Pitch: 0.100" (2.54mm) Contact Type: Solder Cup Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
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480-10-244-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 44POS GOLD |
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480-10-246-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 46POS GOLD |
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480-10-248-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 48POS GOLD Packaging: Bulk Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 48 Pitch: 0.100" (2.54mm) Contact Type: Solder Cup Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
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480-10-250-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 50POS GOLD |
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480-10-252-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 52POS GOLD Packaging: Bulk Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 52 Pitch: 0.100" (2.54mm) Contact Type: Solder Cup Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
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480-10-254-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 54POS GOLD Packaging: Bulk Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 54 Pitch: 0.100" (2.54mm) Contact Type: Solder Cup Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
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480-10-256-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 56POS GOLD Packaging: Bulk Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 56 Pitch: 0.100" (2.54mm) Contact Type: Solder Cup Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 |
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480-10-258-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 58POS GOLD |
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480-10-260-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 60POS GOLD |
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480-10-262-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDER 62POS GOLD Packaging: Bulk Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 62 Pitch: 0.100" (2.54mm) Contact Type: Solder Cup Row Spacing: 0.100" (2.54mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Number of Rows: 2 |
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714-43-101-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 1POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 1 (1 x 1) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 1063 шт: термін постачання 21-31 дні (днів) |
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714-43-102-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 2POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 2016 шт: термін постачання 21-31 дні (днів) |
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714-43-103-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 3POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-104-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 4POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-106-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 6POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-107-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 7POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 7 (1 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-109-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 9POS GOLD Features: Carrier Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-112-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 12POS GOLD Features: Carrier Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-113-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 13POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-115-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 15POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-116-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 16POS GOLD |
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714-43-117-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 17POS GOLD |
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714-43-118-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 18POS GOLD |
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714-43-119-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 19POS GOLD |
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714-43-131-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 31POS GOLD |
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714-43-132-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 32POS GOLD |
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714-43-134-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 34POS GOLD |
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714-43-135-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 35POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 35 (1 x 35) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-136-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 36POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 36 (1 x 36) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-137-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 37POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 37 (1 x 37) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-138-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 38POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 38 (1 x 38) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-139-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 39POS GOLD |
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714-43-141-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 41POS GOLD |
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714-43-142-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 42POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (1 x 42) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-143-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 43POS GOLD |
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714-43-144-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 44POS GOLD |
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714-43-146-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 46POS GOLD |
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714-43-155-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 55POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 55 (1 x 55) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-157-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 57POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 57 (1 x 57) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-160-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 60POS GOLD Features: Carrier Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 60 (1 x 60) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-204-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 4POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 4 (2 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 320 шт: термін постачання 21-31 дні (днів) |
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714-43-206-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 6POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-208-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
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714-43-210-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-212-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 12POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
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714-43-214-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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714-43-216-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-218-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-220-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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714-43-222-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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714-43-224-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Carrier, Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-226-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 26POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 26 (2 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-228-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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714-43-230-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 30POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
товар відсутній |
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714-43-232-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-234-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 34POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 34 (2 x 17) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-236-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-238-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 38POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 38 (2 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Active |
товар відсутній |
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714-43-240-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLD Features: Carrier, Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.1" (2.54mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy |
товар відсутній |
| 480-10-242-00-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 42POS GOLD
Packaging: Tube
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 42
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR SOLDER 42POS GOLD
Packaging: Tube
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 42
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товар відсутній
| 480-10-244-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 44POS GOLD
Description: CONN HDR SOLDER 44POS GOLD
товар відсутній
| 480-10-246-00-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 46POS GOLD
Description: CONN HDR SOLDER 46POS GOLD
товар відсутній
| 480-10-248-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 48POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR SOLDER 48POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товар відсутній
| 480-10-250-00-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 50POS GOLD
Description: CONN HDR SOLDER 50POS GOLD
товар відсутній
| 480-10-252-00-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 52POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 52
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR SOLDER 52POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 52
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товар відсутній
| 480-10-254-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 54POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 54
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR SOLDER 54POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 54
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товар відсутній
| 480-10-256-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 56POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 56
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Description: CONN HDR SOLDER 56POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 56
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товар відсутній
| 480-10-258-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 58POS GOLD
Description: CONN HDR SOLDER 58POS GOLD
товар відсутній
| 480-10-260-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 60POS GOLD
Description: CONN HDR SOLDER 60POS GOLD
товар відсутній
| 480-10-262-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 62POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 62
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
Description: CONN HDR SOLDER 62POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 62
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
товар відсутній
| 714-43-101-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 1POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 1 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 1POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 1 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1063 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 33.17 грн |
| 11+ | 27.26 грн |
| 25+ | 24.07 грн |
| 50+ | 20.75 грн |
| 100+ | 19.95 грн |
| 250+ | 17.91 грн |
| 500+ | 16.81 грн |
| 1000+ | 14.01 грн |
| 714-43-102-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 2POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 2POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2016 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 57.86 грн |
| 10+ | 48.43 грн |
| 25+ | 44.21 грн |
| 50+ | 39.07 грн |
| 100+ | 37.44 грн |
| 250+ | 34.19 грн |
| 500+ | 32.03 грн |
| 1000+ | 26.42 грн |
| 714-43-103-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 3POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 3POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-104-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 4POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 4POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-106-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 6POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 6POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-107-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 7POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN SOCKET SIP 7POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-109-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 9POS GOLD
Features: Carrier
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN SOCKET SIP 9POS GOLD
Features: Carrier
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-112-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 12POS GOLD
Features: Carrier
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN SOCKET SIP 12POS GOLD
Features: Carrier
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-113-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 13POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 13POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-115-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 15POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN SOCKET SIP 15POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-116-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 16POS GOLD
Description: CONN SOCKET SIP 16POS GOLD
товар відсутній
| 714-43-117-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 17POS GOLD
Description: CONN SOCKET SIP 17POS GOLD
товар відсутній
| 714-43-118-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 18POS GOLD
Description: CONN SOCKET SIP 18POS GOLD
товар відсутній
| 714-43-119-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 19POS GOLD
Description: CONN SOCKET SIP 19POS GOLD
товар відсутній
| 714-43-131-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 31POS GOLD
Description: CONN SOCKET SIP 31POS GOLD
товар відсутній
| 714-43-132-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 32POS GOLD
Description: CONN SOCKET SIP 32POS GOLD
товар відсутній
| 714-43-134-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 34POS GOLD
Description: CONN SOCKET SIP 34POS GOLD
товар відсутній
| 714-43-135-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 35POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 35POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-136-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 36POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (1 x 36)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 36POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (1 x 36)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-137-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 37POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 37 (1 x 37)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 37POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 37 (1 x 37)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-138-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 38POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (1 x 38)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN SOCKET SIP 38POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (1 x 38)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-139-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 39POS GOLD
Description: CONN SOCKET SIP 39POS GOLD
товар відсутній
| 714-43-141-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 41POS GOLD
Description: CONN SOCKET SIP 41POS GOLD
товар відсутній
| 714-43-142-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 42POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (1 x 42)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 42POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (1 x 42)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-143-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 43POS GOLD
Description: CONN SOCKET SIP 43POS GOLD
товар відсутній
| 714-43-144-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 44POS GOLD
Description: CONN SOCKET SIP 44POS GOLD
товар відсутній
| 714-43-146-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 46POS GOLD
Description: CONN SOCKET SIP 46POS GOLD
товар відсутній
| 714-43-155-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 55POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 55 (1 x 55)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN SOCKET SIP 55POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 55 (1 x 55)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-157-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 57POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 57 (1 x 57)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SOCKET SIP 57POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 57 (1 x 57)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-160-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 60POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 60 (1 x 60)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN SOCKET SIP 60POS GOLD
Features: Carrier
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 60 (1 x 60)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-204-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 4POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 320 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 45+ | 6.94 грн |
| 714-43-206-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-208-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 8POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-210-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-212-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 12POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-214-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-216-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-218-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-220-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-222-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 22POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-224-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Carrier, Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-226-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 26POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-228-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-230-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 30POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній
| 714-43-232-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-234-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 34POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-236-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-238-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 38POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 38POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товар відсутній
| 714-43-240-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Carrier, Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товар відсутній