Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (354673) > Сторінка 1439 з 5912
Фото | Назва | Виробник | Інформація |
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SPNY801037 | Microchip Technology |
Description: IC ETHERNET CONTROLLER SMD Packaging: Tray DigiKey Programmable: Not Verified |
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SPNY801039 | Microchip Technology | Description: IC ETHERNET CONTROLLER SMD |
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SPNY801049 | Microchip Technology | Description: IC ETHERNET CONTROLLER SMD |
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SPNY801068 | Microchip Technology | Description: IC ETHERNET SWITCH SMD |
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MX574EBH20M0000 | Microchip Technology | Description: OSC 20MHZ LVCMOS |
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MX574EBH20M0000-TR | Microchip Technology | Description: 20MHZ LVCMOS |
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MXRT100KP260CA | Microchip Technology | Description: TVS DIODE 260VWM 512VC CASE 5A |
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ATSAMD51J20A-AU-EFP | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 64TQFP |
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ATSAMD51J20A-AUT-EFP | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 64TQFP |
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ATSAMD51J20A-AUT-EFP | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 64TQFP |
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ATSAME53J20A-AU-EFP | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 64TQFP |
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PIC32MZ1025W104132-I/NX | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 132VQFN Packaging: Tray Package / Case: 132-VFQFN Dual Rows, Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® M-Class Data Converters: A/D 20x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 132-VQFN (10x10) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
на замовлення 149 шт: термін постачання 21-31 дні (днів) |
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ATSAM4C16CA-AUR | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 100LQFP |
на замовлення 2939 шт: термін постачання 21-31 дні (днів) |
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ATSAM4CMS32CA-AUR | Microchip Technology | Description: IC MCU 32BIT 2MB FLASH 100LQFP |
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ATSAM4CMS32CA-AUR | Microchip Technology | Description: IC MCU 32BIT 2MB FLASH 100LQFP |
на замовлення 3950 шт: термін постачання 21-31 дні (днів) |
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1N5811E3 | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B AXIAL Packaging: Bulk Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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1N5811E3/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B AXIAL Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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1N5811USE3/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A |
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JAN1N5811/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 6A Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 6A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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JAN1N5811US/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 6A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 6A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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JANHCE1N5811 | Microchip Technology |
Description: DIODE GEN PURP 150V 3A DIE Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: Die Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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JANKCE1N5811 | Microchip Technology |
Description: DIODE GEN PURP 150V 3A DIE Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: Die Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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JANS1N5811/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 6A B AXIAL Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Current - Average Rectified (Io): 6A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A |
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JANS1N5811US/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Current - Average Rectified (Io): 3A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A |
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JANTX1N5811US/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A B SQ-MELF Packaging: Tape & Reel (TR) Package / Case: SQ-MELF, B Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, SQ-MELF Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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JANTXV1N5811/TR | Microchip Technology |
Description: DIODE GEN PURP 150V 3A Packaging: Tape & Reel (TR) Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 65pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 150 V |
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DM240017 | Microchip Technology |
Description: PIC24F LCD CURIOSITY DEV BOARD Packaging: Bulk Function: LCD Controller Type: Display Utilized IC / Part: PIC24F Supplied Contents: Board(s) Embedded: Yes, MCU, 16-Bit Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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DM240415-2 | Microchip Technology | Description: ACCESSORY DEVELOPMENT START KIT |
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MA240040 | Microchip Technology |
Description: PIC24FJ128GL306 GP PIM Packaging: Bulk For Use With/Related Products: PIC24FJ128GL306 Accessory Type: Plug-In Module (PIM) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PIC24FJ1024GA610-E/BG | Microchip Technology |
Description: IC MCU 16BIT 1MB FLASH 121TFBGA Packaging: Tray Package / Case: 121-TFBGA Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 1MB (341.5K x 24) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 24x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT Supplier Device Package: 121-TFBGA (10x10) Number of I/O: 85 DigiKey Programmable: Not Verified |
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PIC24FJ1024GA610-E/PT | Microchip Technology |
Description: IC MCU 16BIT 1MB FLASH 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 1MB (341.5K x 24) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: PIC Data Converters: A/D 24x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT Supplier Device Package: 100-TQFP (12x12) Number of I/O: 85 DigiKey Programmable: Not Verified |
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PIC24FJ1024GB610-E/BG | Microchip Technology | Description: IC MCU 16BIT 1MB FLASH 121TFBGA |
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PIC24FJ1024GB610-E/PT | Microchip Technology | Description: IC MCU 16BIT 1MB FLASH 100TQFP |
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PIC24FJ128GA610-E/BG | Microchip Technology | Description: IC MCU 16BIT 128KB FLSH 121TFBGA |
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MXPLAD15KP60Ae3 | Microchip Technology | Description: TVS DIODE 60VWM 96.8VC PLAD |
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ATTINY261-15MD | Microchip Technology |
Description: IC MCU 8BIT 2KB FLASH 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (1K x 16) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 11x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Grade: Automotive Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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ATTINY261-15MD | Microchip Technology |
Description: IC MCU 8BIT 2KB FLASH 32QFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (1K x 16) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 11x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Grade: Automotive Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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AC244049 | Microchip Technology | Description: PIC12F752 PROCESSOR EXT PAK |
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AC244050 | Microchip Technology | Description: PIC12HV752 PROCESSOR EXT PAK |
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SW500024 | Microchip Technology | Description: CCS C COMPILER IDE |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PIC32MZ1025DAK169-V/HF | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
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PIC32MZ1025DAK169T-V/HF | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
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PIC32MZ1025DAK176-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Part Status: Active Number of I/O: 120 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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PIC32MZ1025DAK176T-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Number of I/O: 120 DigiKey Programmable: Not Verified |
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PIC32MZ1025DAL169-V/HF | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
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PIC32MZ1025DAL169T-V/HF | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 169LFBGA |
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PIC32MZ1025DAL176-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Number of I/O: 120 DigiKey Programmable: Not Verified |
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PIC32MZ1025DAL176T-V/2J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Number of I/O: 120 DigiKey Programmable: Not Verified |
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PIC32MZ1025DAR169-V/6J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 + 32MB DDR2 SDRAM Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT Supplier Device Package: 169-LFBGA (11x11) Number of I/O: 120 DigiKey Programmable: Not Verified |
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PIC32MZ1025DAR169T-V/6J | Microchip Technology |
Description: IC MCU 32BIT 1MB FLASH 169LFBGA Packaging: Tape & Reel (TR) Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 + 32MB DDR2 SDRAM Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: MIPS32® microAptiv™ Data Converters: A/D 45x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Supplier Device Package: 169-LFBGA (11x11) Number of I/O: 120 DigiKey Programmable: Not Verified |
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PIC32MZ1025DAR176-V/2J | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 176LQFP |
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PIC32MZ1025DAR176T-V/2J | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 176LQFP |
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PIC32MZ1025DAS176-V/2J | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 176LQFP |
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PIC32MZ1025DAS176T-V/2J | Microchip Technology | Description: IC MCU 32BIT 1MB FLASH 176LQFP |
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CDLL5250/TR | Microchip Technology | Description: VOLTAGE REGULATOR |
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CDLL5250A/TR | Microchip Technology | Description: VOLTAGE REGULATOR |
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CDLL5250B/TR | Microchip Technology |
Description: DIODE ZENER 20V DO-213AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: DO-213AB, MELF Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 20 V Impedance (Max) (Zzt): 25 Ohms Supplier Device Package: DO-213AB Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 15 V |
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CDLL5250BE3 | Microchip Technology | Description: VOLTAGE REGULATOR |
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CDLL5250BE3/TR | Microchip Technology | Description: VOLTAGE REGULATOR |
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2N1701 | Microchip Technology | Description: NPN TRANSISTOR |
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SPNY801037 |
Виробник: Microchip Technology
Description: IC ETHERNET CONTROLLER SMD
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC ETHERNET CONTROLLER SMD
Packaging: Tray
DigiKey Programmable: Not Verified
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MXRT100KP260CA |
Виробник: Microchip Technology
Description: TVS DIODE 260VWM 512VC CASE 5A
Description: TVS DIODE 260VWM 512VC CASE 5A
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ATSAMD51J20A-AU-EFP |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Description: IC MCU 32BIT 1MB FLASH 64TQFP
товар відсутній
ATSAMD51J20A-AUT-EFP |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Description: IC MCU 32BIT 1MB FLASH 64TQFP
товар відсутній
ATSAMD51J20A-AUT-EFP |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Description: IC MCU 32BIT 1MB FLASH 64TQFP
товар відсутній
ATSAME53J20A-AU-EFP |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 64TQFP
Description: IC MCU 32BIT 1MB FLASH 64TQFP
товар відсутній
PIC32MZ1025W104132-I/NX |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 132VQFN
Packaging: Tray
Package / Case: 132-VFQFN Dual Rows, Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 20x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 132-VQFN (10x10)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
на замовлення 149 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 424.08 грн |
25+ | 370.85 грн |
100+ | 337.19 грн |
ATSAM4C16CA-AUR |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Description: IC MCU 32BIT 1MB FLASH 100LQFP
на замовлення 2939 шт:
термін постачання 21-31 дні (днів)ATSAM4CMS32CA-AUR |
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Description: IC MCU 32BIT 2MB FLASH 100LQFP
товар відсутній
ATSAM4CMS32CA-AUR |
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Description: IC MCU 32BIT 2MB FLASH 100LQFP
на замовлення 3950 шт:
термін постачання 21-31 дні (днів)1N5811E3 |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
1N5811E3/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
1N5811USE3/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
товар відсутній
JAN1N5811/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 6A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
JAN1N5811US/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 6A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 6A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
JANHCE1N5811 |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
JANKCE1N5811 |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: Die
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
JANS1N5811/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Description: DIODE GEN PURP 150V 6A B AXIAL
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 6A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
товар відсутній
JANS1N5811US/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
товар відсутній
JANTX1N5811US/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A B SQ-MELF
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
JANTXV1N5811/TR |
Виробник: Microchip Technology
Description: DIODE GEN PURP 150V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
Description: DIODE GEN PURP 150V 3A
Packaging: Tape & Reel (TR)
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 65pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 150 V
товар відсутній
DM240017 |
Виробник: Microchip Technology
Description: PIC24F LCD CURIOSITY DEV BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PIC24F
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
Description: PIC24F LCD CURIOSITY DEV BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PIC24F
Supplied Contents: Board(s)
Embedded: Yes, MCU, 16-Bit
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5520.02 грн |
DM240415-2 |
Виробник: Microchip Technology
Description: ACCESSORY DEVELOPMENT START KIT
Description: ACCESSORY DEVELOPMENT START KIT
товар відсутній
MA240040 |
Виробник: Microchip Technology
Description: PIC24FJ128GL306 GP PIM
Packaging: Bulk
For Use With/Related Products: PIC24FJ128GL306
Accessory Type: Plug-In Module (PIM)
Part Status: Active
Description: PIC24FJ128GL306 GP PIM
Packaging: Bulk
For Use With/Related Products: PIC24FJ128GL306
Accessory Type: Plug-In Module (PIM)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2872.84 грн |
PIC24FJ1024GA610-E/BG |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Number of I/O: 85
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Packaging: Tray
Package / Case: 121-TFBGA
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 121-TFBGA (10x10)
Number of I/O: 85
DigiKey Programmable: Not Verified
товар відсутній
PIC24FJ1024GA610-E/PT |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 1MB (341.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 24x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (12x12)
Number of I/O: 85
DigiKey Programmable: Not Verified
товар відсутній
PIC24FJ1024GB610-E/BG |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
Description: IC MCU 16BIT 1MB FLASH 121TFBGA
товар відсутній
PIC24FJ1024GB610-E/PT |
Виробник: Microchip Technology
Description: IC MCU 16BIT 1MB FLASH 100TQFP
Description: IC MCU 16BIT 1MB FLASH 100TQFP
товар відсутній
PIC24FJ128GA610-E/BG |
Виробник: Microchip Technology
Description: IC MCU 16BIT 128KB FLSH 121TFBGA
Description: IC MCU 16BIT 128KB FLSH 121TFBGA
товар відсутній
MXPLAD15KP60Ae3 |
Виробник: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC PLAD
Description: TVS DIODE 60VWM 96.8VC PLAD
товар відсутній
ATTINY261-15MD |
Виробник: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товар відсутній
ATTINY261-15MD |
Виробник: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 8BIT 2KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Grade: Automotive
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товар відсутній
SW500024 |
Виробник: Microchip Technology
Description: CCS C COMPILER IDE
Description: CCS C COMPILER IDE
на замовлення 1 шт:
термін постачання 21-31 дні (днів)PIC32MZ1025DAK169-V/HF |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
товар відсутній
PIC32MZ1025DAK169T-V/HF |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
товар відсутній
PIC32MZ1025DAK176-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Active
Number of I/O: 120
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1251.22 грн |
25+ | 1105.74 грн |
PIC32MZ1025DAK176T-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
товар відсутній
PIC32MZ1025DAL169-V/HF |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
товар відсутній
PIC32MZ1025DAL169T-V/HF |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
товар відсутній
PIC32MZ1025DAL176-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
товар відсутній
PIC32MZ1025DAL176T-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
товар відсутній
PIC32MZ1025DAR169-V/6J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
товар відсутній
PIC32MZ1025DAR169T-V/6J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8 + 32MB DDR2 SDRAM
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® microAptiv™
Data Converters: A/D 45x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (11x11)
Number of I/O: 120
DigiKey Programmable: Not Verified
товар відсутній
PIC32MZ1025DAR176-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
товар відсутній
PIC32MZ1025DAR176T-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
товар відсутній
PIC32MZ1025DAS176-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
товар відсутній
PIC32MZ1025DAS176T-V/2J |
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Description: IC MCU 32BIT 1MB FLASH 176LQFP
товар відсутній
CDLL5250B/TR |
Виробник: Microchip Technology
Description: DIODE ZENER 20V DO-213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 15 V
Description: DIODE ZENER 20V DO-213AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 20 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 15 V
товар відсутній