Продукція > LAIRD TECHNOLOGIES EMI > Всі товари виробника LAIRD TECHNOLOGIES EMI (3818) > Сторінка 13 з 64
Фото | Назва | Виробник | Інформація |
Доступність |
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0228031200 | Laird Technologies EMI |
Description: AP,STR,SNB,RA,CM Packaging: Bulk |
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0228031300 | Laird Technologies EMI |
Description: AP,STR,SNB,RA,CM Packaging: Bulk |
товар відсутній |
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0228032000 | Laird Technologies EMI |
Description: AP,STR,SNB,RA,CM Packaging: Bulk |
товар відсутній |
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0228032100 | Laird Technologies EMI |
Description: AP,STR,SNB,RA,CM Packaging: Bulk |
товар відсутній |
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0228032200 | Laird Technologies EMI |
Description: AP,STR,SNB,RA,CM Packaging: Bulk |
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0379005300 | Laird Technologies EMI | Description: TWT,STR,BF,PSA,CM |
товар відсутній |
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0379005400 | Laird Technologies EMI | Description: TWT,STR,BF,PSA,CM |
товар відсутній |
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0493013400 | Laird Technologies EMI | Description: RFI EMI GROUNDING MATERIAL |
товар відсутній |
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0493014400 | Laird Technologies EMI |
Description: PCLIP,STR,NIE,CLO,CTL .198X.250X Packaging: Bulk |
товар відсутній |
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0507022902 | Laird Technologies EMI | Description: TWT,STR,BF,PSA,CTL .070X.500X.16 |
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0786018500 | Laird Technologies EMI | Description: S3,STR,SNB,RIV,CTL |
товар відсутній |
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0786031800 | Laird Technologies EMI | Description: TWT,STR,SNB,CLO,CM |
товар відсутній |
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0786054100 | Laird Technologies EMI |
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0786056700 | Laird Technologies EMI |
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0786057100 | Laird Technologies EMI | Description: S3,STR,NIB,PSA,CTL |
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0786057200 | Laird Technologies EMI | Description: S3,STR,NIB,PSA,CTL |
товар відсутній |
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0869003307 | Laird Technologies EMI | Description: CSTR,STR,SNSAT,CTL |
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0869004109 | Laird Technologies EMI | Description: CSTR,STR,SNSAT,CM |
товар відсутній |
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0C77001017 | Laird Technologies EMI | Description: GASKET BECU 8.1MMX7.6M |
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0C78001002 | Laird Technologies EMI | Description: GASKET ULTRASOFT 8.1MMX7.6M |
товар відсутній |
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0C78001017 | Laird Technologies EMI | Description: GASKET ULTRASOFT 8.1MMX7.6M |
товар відсутній |
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0C78001019 | Laird Technologies EMI | Description: GASKET ULTRASOFT 8.1MMX7.6M |
товар відсутній |
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0c97043602 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 0.375" (9.53mm) Type: Fingerstock Width: 0.940" (23.88mm) Operating Temperature: 121°C Height: 0.250" (6.35mm) Attachment Method: Clip Plating: Unplated Part Status: Active |
на замовлення 425 шт: термін постачання 21-31 дні (днів) |
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0C97043802 | Laird Technologies EMI |
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на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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0C97043816 | Laird Technologies EMI | Description: CSTR COIL ZNY |
товар відсутній |
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0C97043817 | Laird Technologies EMI |
Description: RFI FINGERSTOCK BECU TIN HARDWR Packaging: Bulk Material: Beryllium Copper Length: 25.00' (7.60m) Type: Fingerstock Width: 1.090" (27.69mm) Operating Temperature: 121°C Height: 0.250" (6.35mm) Attachment Method: Hardware, Rivet, Solder Plating: Tin Plating - Thickness: 299.99µin (7.62µm) |
товар відсутній |
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0C97043818 | Laird Technologies EMI | Description: CSTR COIL NIE |
товар відсутній |
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0C97043819 | Laird Technologies EMI |
Description: RFI FINGERSTOCK BECU NICK HARDWR Packaging: Bulk Material: Beryllium Copper Length: 25.00' (7.60m) Type: Fingerstock Width: 1.090" (27.69mm) Operating Temperature: 121°C Height: 0.250" (6.35mm) Attachment Method: Hardware, Rivet, Solder Plating: Nickel Plating - Thickness: 299.99µin (7.62µm) |
товар відсутній |
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0C97044002 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 25.00' (7.60m) Type: Fingerstock Width: 1.630" (41.40mm) Operating Temperature: 121°C Height: 0.410" (10.41mm) Attachment Method: Hardware, Rivet, Solder Plating: Nickel, Tin Plating - Thickness: 299.99µin (7.62µm) |
товар відсутній |
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0C97044017 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 25.00' (7.60m) Type: Fingerstock Width: 1.630" (41.40mm) Operating Temperature: 121°C Height: 0.410" (10.41mm) Attachment Method: Hardware, Rivet, Solder Plating: Tin Plating - Thickness: 299.99µin (7.62µm) |
товар відсутній |
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0C97044018 | Laird Technologies EMI | Description: CSTR COIL NIE |
товар відсутній |
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0C97050002 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 25.00' (7.60m) Type: Fingerstock Width: 0.600" (15.24mm) Operating Temperature: 121°C Height: 0.230" (5.84mm) Attachment Method: Adhesive |
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0C97050017 | Laird Technologies EMI | Description: AP COIL SNB PSA |
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0C97051502 | Laird Technologies EMI |
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0C97052002 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 16.000" (406.40mm) Type: Fingerstock Width: 0.370" (9.40mm) Operating Temperature: 121°C Height: 0.140" (3.56mm) Attachment Method: Adhesive |
товар відсутній |
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0C97052019 | Laird Technologies EMI |
Description: AP COIL NIB PSA Packaging: Bulk Material: Beryllium Copper Length: 16.000" (406.40mm) Type: Fingerstock Width: 0.370" (9.40mm) Operating Temperature: 121°C Height: 0.140" (3.56mm) Attachment Method: Adhesive Plating: Nickel Plating - Thickness: 299.21µin (7.60µm) |
товар відсутній |
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0C97052117 | Laird Technologies EMI | Description: NOSG COIL SNB PSA |
товар відсутній |
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0C97053802 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 24.000" (609.60mm) Type: Fingerstock Width: 0.780" (19.81mm) Operating Temperature: 121°C Height: 0.250" (6.35mm) Attachment Method: Adhesive Plating: Unplated Part Status: Active |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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0C97054001 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 16.000" (406.40mm) Type: Fingerstock Width: 0.280" (7.11mm) Operating Temperature: 121°C Height: 0.110" (2.79mm) Attachment Method: Adhesive Part Status: Active |
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0C97054002 | Laird Technologies EMI |
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0C97054017 | Laird Technologies EMI |
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0C97054019 | Laird Technologies EMI |
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0C97054102 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 16.000" (406.40mm) Type: Fingerstock Width: 0.380" (9.65mm) Operating Temperature: 121°C Height: 0.120" (3.05mm) Attachment Method: Adhesive Plating: Unplated |
товар відсутній |
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0C97054117 | Laird Technologies EMI | Description: NOSG COIL SNB PSA |
товар відсутній |
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0C97054202 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 12.000" (304.80mm) Type: Fingerstock Width: 0.250" (6.35mm) Operating Temperature: 121°C Height: 0.080" (2.03mm) Attachment Method: Adhesive Plating: Unplated Part Status: Active |
на замовлення 473 шт: термін постачання 21-31 дні (днів) |
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0C97054216 | Laird Technologies EMI | Description: NOSG COIL ZNY PSA |
товар відсутній |
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0C97054217 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 25.00' (7.60m) Type: Fingerstock Width: 0.250" (6.35mm) Operating Temperature: 121°C Height: 0.080" (2.03mm) Attachment Method: Adhesive Plating: Tin Plating - Thickness: 299.21µin (7.60µm) |
товар відсутній |
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0C97054219 | Laird Technologies EMI |
Description: NOSG COIL NIB PSA Packaging: Bulk Material: Beryllium Copper Length: 16.000" (406.40mm) Type: Fingerstock Width: 0.250" (6.35mm) Operating Temperature: 121°C Height: 0.080" (2.03mm) Attachment Method: Adhesive Plating: Nickel Plating - Thickness: 299.21µin (7.60µm) |
товар відсутній |
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0c97055002 | Laird Technologies EMI |
![]() Packaging: Strip Material: Beryllium Copper Length: 24.000" (609.60mm) Type: Fingerstock Width: 0.230" (5.84mm) Operating Temperature: 121°C Height: 0.030" (0.76mm) Attachment Method: Adhesive Plating: Unplated Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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0C97055008 | Laird Technologies EMI |
Description: RFI FINGERSTOCK BECU TIN ADH Packaging: Bulk Material: Beryllium Copper Length: 24.000" (609.60mm) Type: Fingerstock Width: 0.230" (5.84mm) Operating Temperature: 121°C Height: 0.030" (0.76mm) Attachment Method: Adhesive Plating: Tin Plating - Thickness: 299.21µin (7.60µm) |
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0C97055016 | Laird Technologies EMI |
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0C97055017 | Laird Technologies EMI |
Description: RFI FINGERSTOCK BECU TIN ADH Packaging: Bulk Material: Beryllium Copper Length: 24.000" (609.60mm) Type: Fingerstock Width: 0.230" (5.84mm) Operating Temperature: 121°C Height: 0.030" (0.76mm) Attachment Method: Adhesive Plating: Tin Plating - Thickness: 299.21µin (7.60µm) |
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0C97055502 | Laird Technologies EMI |
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0C97055508 | Laird Technologies EMI | Description: TWT COIL SNSAT PSA |
товар відсутній |
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0C97055517 | Laird Technologies EMI |
Description: RFI FINGERSTOCK BECU TIN ADH Packaging: Bulk Material: Beryllium Copper Length: 24.000" (609.60mm) Type: Fingerstock Width: 0.340" (8.64mm) Operating Temperature: 121°C Height: 0.070" (1.78mm) Attachment Method: Adhesive Plating: Tin Plating - Thickness: 299.21µin (7.60µm) |
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0C97055518 | Laird Technologies EMI | Description: TWT COIL NIE PSA |
товар відсутній |
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0C97055902 | Laird Technologies EMI |
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0C97055917 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 24.000" (609.60mm) Type: Fingerstock Width: 0.300" (7.62mm) Operating Temperature: 121°C Height: 0.070" (1.78mm) Attachment Method: Adhesive Plating: Tin Plating - Thickness: 299.21µin (7.60µm) Part Status: Active |
товар відсутній |
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0C97056002 | Laird Technologies EMI |
![]() Packaging: Bulk Material: Beryllium Copper Length: 24.000" (609.60mm) Type: Fingerstock Width: 0.500" (12.70mm) Operating Temperature: 121°C Height: 0.120" (3.05mm) Attachment Method: Adhesive Plating: Unplated |
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0C97056915 | Laird Technologies EMI |
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товар відсутній |
0228031200 |
товар відсутній
0228031300 |
товар відсутній
0228032000 |
товар відсутній
0228032100 |
товар відсутній
0228032200 |
товар відсутній
0493014400 |
товар відсутній
0507022902 |
Виробник: Laird Technologies EMI
Description: TWT,STR,BF,PSA,CTL .070X.500X.16
Description: TWT,STR,BF,PSA,CTL .070X.500X.16
товар відсутній
0c97043602 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU UNPLAT CLIP
Packaging: Bulk
Material: Beryllium Copper
Length: 0.375" (9.53mm)
Type: Fingerstock
Width: 0.940" (23.88mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Clip
Plating: Unplated
Part Status: Active
Description: RFI FINGERSTOCK BECU UNPLAT CLIP
Packaging: Bulk
Material: Beryllium Copper
Length: 0.375" (9.53mm)
Type: Fingerstock
Width: 0.940" (23.88mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Clip
Plating: Unplated
Part Status: Active
на замовлення 425 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 1325.31 грн |
10+ | 1172.92 грн |
25+ | 1124.27 грн |
100+ | 929.63 грн |
250+ | 884 грн |
0C97043802 |
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Виробник: Laird Technologies EMI
Description: RFI EMI GROUNDING MATERIAL 25FT
Description: RFI EMI GROUNDING MATERIAL 25FT
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 14592.71 грн |
0C97043817 |
Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN HARDWR
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.090" (27.69mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
Description: RFI FINGERSTOCK BECU TIN HARDWR
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.090" (27.69mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
товар відсутній
0C97043819 |
Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU NICK HARDWR
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.090" (27.69mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Nickel
Plating - Thickness: 299.99µin (7.62µm)
Description: RFI FINGERSTOCK BECU NICK HARDWR
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.090" (27.69mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Nickel
Plating - Thickness: 299.99µin (7.62µm)
товар відсутній
0C97044002 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU NICK HARDWR
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.630" (41.40mm)
Operating Temperature: 121°C
Height: 0.410" (10.41mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Nickel, Tin
Plating - Thickness: 299.99µin (7.62µm)
Description: RFI FINGERSTOCK BECU NICK HARDWR
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.630" (41.40mm)
Operating Temperature: 121°C
Height: 0.410" (10.41mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Nickel, Tin
Plating - Thickness: 299.99µin (7.62µm)
товар відсутній
0C97044017 |
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Виробник: Laird Technologies EMI
Description: CSTR COIL SNB
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.630" (41.40mm)
Operating Temperature: 121°C
Height: 0.410" (10.41mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
Description: CSTR COIL SNB
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 1.630" (41.40mm)
Operating Temperature: 121°C
Height: 0.410" (10.41mm)
Attachment Method: Hardware, Rivet, Solder
Plating: Tin
Plating - Thickness: 299.99µin (7.62µm)
товар відсутній
0C97050002 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 0.600" (15.24mm)
Operating Temperature: 121°C
Height: 0.230" (5.84mm)
Attachment Method: Adhesive
Description: RFI FINGERSTOCK BECU ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 0.600" (15.24mm)
Operating Temperature: 121°C
Height: 0.230" (5.84mm)
Attachment Method: Adhesive
товар відсутній
0C97052002 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.370" (9.40mm)
Operating Temperature: 121°C
Height: 0.140" (3.56mm)
Attachment Method: Adhesive
Description: RFI FINGERSTOCK BECU ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.370" (9.40mm)
Operating Temperature: 121°C
Height: 0.140" (3.56mm)
Attachment Method: Adhesive
товар відсутній
0C97052019 |
Виробник: Laird Technologies EMI
Description: AP COIL NIB PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.370" (9.40mm)
Operating Temperature: 121°C
Height: 0.140" (3.56mm)
Attachment Method: Adhesive
Plating: Nickel
Plating - Thickness: 299.21µin (7.60µm)
Description: AP COIL NIB PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.370" (9.40mm)
Operating Temperature: 121°C
Height: 0.140" (3.56mm)
Attachment Method: Adhesive
Plating: Nickel
Plating - Thickness: 299.21µin (7.60µm)
товар відсутній
0C97053802 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU UNPLAT ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.780" (19.81mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Adhesive
Plating: Unplated
Part Status: Active
Description: RFI FINGERSTOCK BECU UNPLAT ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.780" (19.81mm)
Operating Temperature: 121°C
Height: 0.250" (6.35mm)
Attachment Method: Adhesive
Plating: Unplated
Part Status: Active
на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1846.23 грн |
10+ | 1639.71 грн |
25+ | 1566.05 грн |
100+ | 1314.05 грн |
250+ | 1253.53 грн |
0C97054001 |
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Виробник: Laird Technologies EMI
Description: AP COIL BF
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.280" (7.11mm)
Operating Temperature: 121°C
Height: 0.110" (2.79mm)
Attachment Method: Adhesive
Part Status: Active
Description: AP COIL BF
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.280" (7.11mm)
Operating Temperature: 121°C
Height: 0.110" (2.79mm)
Attachment Method: Adhesive
Part Status: Active
товар відсутній
0C97054002 |
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Виробник: Laird Technologies EMI
Description: RFI EMI GROUNDING MATERIAL 25FT
Description: RFI EMI GROUNDING MATERIAL 25FT
товар відсутній
0C97054017 |
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Виробник: Laird Technologies EMI
Description: RFI EMI GROUNDING MATERIAL 25FT
Description: RFI EMI GROUNDING MATERIAL 25FT
товар відсутній
0C97054019 |
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Виробник: Laird Technologies EMI
Description: RFI EMI GROUNDING MATERIAL 25FT
Description: RFI EMI GROUNDING MATERIAL 25FT
товар відсутній
0C97054102 |
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Виробник: Laird Technologies EMI
Description: NOSG COIL BF PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.380" (9.65mm)
Operating Temperature: 121°C
Height: 0.120" (3.05mm)
Attachment Method: Adhesive
Plating: Unplated
Description: NOSG COIL BF PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.380" (9.65mm)
Operating Temperature: 121°C
Height: 0.120" (3.05mm)
Attachment Method: Adhesive
Plating: Unplated
товар відсутній
0C97054202 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU UNPLAT ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 12.000" (304.80mm)
Type: Fingerstock
Width: 0.250" (6.35mm)
Operating Temperature: 121°C
Height: 0.080" (2.03mm)
Attachment Method: Adhesive
Plating: Unplated
Part Status: Active
Description: RFI FINGERSTOCK BECU UNPLAT ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 12.000" (304.80mm)
Type: Fingerstock
Width: 0.250" (6.35mm)
Operating Temperature: 121°C
Height: 0.080" (2.03mm)
Attachment Method: Adhesive
Plating: Unplated
Part Status: Active
на замовлення 473 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1160.21 грн |
10+ | 1026.71 грн |
25+ | 984.16 грн |
100+ | 813.76 грн |
250+ | 773.82 грн |
0C97054217 |
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Виробник: Laird Technologies EMI
Description: NOSG COIL SNB PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 0.250" (6.35mm)
Operating Temperature: 121°C
Height: 0.080" (2.03mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Description: NOSG COIL SNB PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 25.00' (7.60m)
Type: Fingerstock
Width: 0.250" (6.35mm)
Operating Temperature: 121°C
Height: 0.080" (2.03mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
товар відсутній
0C97054219 |
Виробник: Laird Technologies EMI
Description: NOSG COIL NIB PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.250" (6.35mm)
Operating Temperature: 121°C
Height: 0.080" (2.03mm)
Attachment Method: Adhesive
Plating: Nickel
Plating - Thickness: 299.21µin (7.60µm)
Description: NOSG COIL NIB PSA
Packaging: Bulk
Material: Beryllium Copper
Length: 16.000" (406.40mm)
Type: Fingerstock
Width: 0.250" (6.35mm)
Operating Temperature: 121°C
Height: 0.080" (2.03mm)
Attachment Method: Adhesive
Plating: Nickel
Plating - Thickness: 299.21µin (7.60µm)
товар відсутній
0c97055002 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU ADH 25FT
Packaging: Strip
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.230" (5.84mm)
Operating Temperature: 121°C
Height: 0.030" (0.76mm)
Attachment Method: Adhesive
Plating: Unplated
Part Status: Active
Description: RFI FINGERSTOCK BECU ADH 25FT
Packaging: Strip
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.230" (5.84mm)
Operating Temperature: 121°C
Height: 0.030" (0.76mm)
Attachment Method: Adhesive
Plating: Unplated
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 9495.78 грн |
10+ | 8711.56 грн |
0C97055008 |
Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.230" (5.84mm)
Operating Temperature: 121°C
Height: 0.030" (0.76mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.230" (5.84mm)
Operating Temperature: 121°C
Height: 0.030" (0.76mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
товар відсутній
0C97055017 |
Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.230" (5.84mm)
Operating Temperature: 121°C
Height: 0.030" (0.76mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.230" (5.84mm)
Operating Temperature: 121°C
Height: 0.030" (0.76mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
товар відсутній
0C97055502 |
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Виробник: Laird Technologies EMI
Description: RFI EMI GROUNDING MATERIAL 25FT
Description: RFI EMI GROUNDING MATERIAL 25FT
товар відсутній
0C97055517 |
Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.340" (8.64mm)
Operating Temperature: 121°C
Height: 0.070" (1.78mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.340" (8.64mm)
Operating Temperature: 121°C
Height: 0.070" (1.78mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
товар відсутній
0C97055902 |
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Виробник: Laird Technologies EMI
Description: RFI EMI GROUNDING MATERIAL 25FT
Description: RFI EMI GROUNDING MATERIAL 25FT
товар відсутній
0C97055917 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.300" (7.62mm)
Operating Temperature: 121°C
Height: 0.070" (1.78mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Part Status: Active
Description: RFI FINGERSTOCK BECU TIN ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.300" (7.62mm)
Operating Temperature: 121°C
Height: 0.070" (1.78mm)
Attachment Method: Adhesive
Plating: Tin
Plating - Thickness: 299.21µin (7.60µm)
Part Status: Active
товар відсутній
0C97056002 |
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Виробник: Laird Technologies EMI
Description: RFI FINGERSTOCK BECU UNPLAT ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.500" (12.70mm)
Operating Temperature: 121°C
Height: 0.120" (3.05mm)
Attachment Method: Adhesive
Plating: Unplated
Description: RFI FINGERSTOCK BECU UNPLAT ADH
Packaging: Bulk
Material: Beryllium Copper
Length: 24.000" (609.60mm)
Type: Fingerstock
Width: 0.500" (12.70mm)
Operating Temperature: 121°C
Height: 0.120" (3.05mm)
Attachment Method: Adhesive
Plating: Unplated
товар відсутній