Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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10M40DCF484C8G | Intel |
Description: IC FPGA 360 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 40000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 166 шт: термін постачання 21-31 дні (днів) |
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10M40DCF672C8G | Intel |
Description: IC FPGA 500 I/O 672FBGA Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 40000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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10M40SAE144C8G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 100 шт: термін постачання 21-31 дні (днів) |
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10M40SCE144C8G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 101 DigiKey Programmable: Not Verified |
товар відсутній |
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10M50DAF256C8G | Intel |
Description: IC FPGA 178 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 50000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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10M50DAF484C8G | Intel |
Description: IC FPGA 360 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 50000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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10M50DCF256C8G | Intel |
Description: IC FPGA 178 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 50000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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10M50DCF484C8G | Intel |
Description: IC FPGA 360 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 50000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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10M50DCF484I7G | Intel |
Description: IC FPGA 360 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 50000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 360 DigiKey Programmable: Not Verified |
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10M50DCF672C8G | Intel |
Description: IC FPGA 500 I/O 672FBGA Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 50000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 75 шт: термін постачання 21-31 дні (днів) |
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10M50SAE144C8G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 50000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Part Status: Active Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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10M50SCE144C8G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 50000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 101 шт: термін постачання 21-31 дні (днів) |
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10M50SCE144I7G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 50000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 181 шт: термін постачання 21-31 дні (днів) |
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10M08SAE144C8G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 8000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 500 Total RAM Bits: 387072 Part Status: Active Number of I/O: 101 DigiKey Programmable: Not Verified |
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10M02DCV36C8G | Intel |
Description: IC FPGA 27 I/O 36WLCSP Packaging: Tape & Reel (TR) Package / Case: 36-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 2000 Supplier Device Package: 36-VBGA (3.47x3.4) Number of LABs/CLBs: 125 Total RAM Bits: 110592 Part Status: Active Number of I/O: 27 DigiKey Programmable: Not Verified |
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DK-SOC-10AS066S-ES | Intel |
Description: DEV KIT ARRIA 10 SX SOC ES Packaging: Box For Use With/Related Products: 10AS066 Type: FPGA + MCU/MPU SoC Contents: Board(s) Platform: Arria 10 SX SoC |
товар відсутній |
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10M02SCU169C8G | Intel |
Description: IC FPGA 130 I/O 169UBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 2000 Supplier Device Package: 169-UBGA (11x11) Number of LABs/CLBs: 125 Total RAM Bits: 110592 Part Status: Active Number of I/O: 130 DigiKey Programmable: Not Verified |
на замовлення 548 шт: термін постачання 21-31 дні (днів) |
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10M08SAE144I7G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 8000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 500 Total RAM Bits: 387072 Part Status: Active Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 265 шт: термін постачання 21-31 дні (днів) |
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10M16DAF256C8G | Intel |
Description: IC FPGA 178 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 16000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 1000 Total RAM Bits: 562176 Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 218 шт: термін постачання 21-31 дні (днів) |
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10M16SAE144C8G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 16000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 1000 Total RAM Bits: 562176 Part Status: Active Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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10M16SAU169I7G | Intel |
Description: IC FPGA 130 I/O 169UBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 16000 Supplier Device Package: 169-UBGA (11x11) Number of LABs/CLBs: 1000 Total RAM Bits: 562176 Part Status: Active Number of I/O: 130 DigiKey Programmable: Not Verified |
на замовлення 224 шт: термін постачання 21-31 дні (днів) |
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10M16SCU169A7G | Intel |
Description: IC FPGA 130 I/O 169UBGA Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 16000 Supplier Device Package: 169-UBGA (11x11) Number of LABs/CLBs: 1000 Total RAM Bits: 562176 Part Status: Active Number of I/O: 130 DigiKey Programmable: Not Verified |
на замовлення 161 шт: термін постачання 21-31 дні (днів) |
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10M25DAF256C8G | Intel |
Description: IC FPGA 178 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 25000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 1563 Total RAM Bits: 691200 Number of I/O: 178 DigiKey Programmable: Not Verified |
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10M25DAF484I7G | Intel |
Description: IC FPGA 360 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 25000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1563 Total RAM Bits: 691200 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 129 шт: термін постачання 21-31 дні (днів) |
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10M25SAE144C8G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 25000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 1563 Total RAM Bits: 691200 Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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10M25SAE144I7G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 25000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 1563 Total RAM Bits: 691200 Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 157 шт: термін постачання 21-31 дні (днів) |
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10M40DCF256C8G | Intel |
Description: IC FPGA 178 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 40000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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10M40SAE144I7G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 101 DigiKey Programmable: Not Verified |
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10M50SAE144I7G | Intel |
Description: IC FPGA 101 I/O 144EQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.465V Number of Logic Elements/Cells: 50000 Supplier Device Package: 144-EQFP (20x20) Number of LABs/CLBs: 3125 Total RAM Bits: 1677312 Number of I/O: 101 DigiKey Programmable: Not Verified |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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10AS057H2F34E2SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057H3F34E2SG | Intel | Description: IC SOC FPGA 492 I/O 1152FBGA |
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10AS057H4F34E3LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057H4F34E3SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057H4F34I3SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057K2F40E2LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS057K2F40I2SG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 570K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
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10AS057K3F35E2LG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 570K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
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10AS057K3F35I2LG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 570K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA |
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10AS057K3F35I2SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057K3F40I2LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS057K4F35E3LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057K4F35E3SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057K4F35I3LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS057K4F40E3SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS057N2F40E2LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS057N2F40E2SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS057N2F40I2LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS057N3F40E2LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS057N3F40I2LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
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10AS066H2F34I2SG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
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10AS066H3F34E2SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS066H3F34I2SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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10AS066H4F34I3SG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA |
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10AS066K2F35I2SG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
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10AS066K2F40E2SG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
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10AS066K2F40I2LG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
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10AS066K2F40I2SG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA |
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10AS066K3F35I2SG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA |
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10AS066K4F35I3SG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA |
товар відсутній |
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10AS066N2F40I2LG | Intel | Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA |
товар відсутній |
10M40DCF484C8G |
Виробник: Intel
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 166 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7298.53 грн |
25+ | 5902.98 грн |
100+ | 5762.41 грн |
10M40DCF672C8G |
Виробник: Intel
Description: IC FPGA 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8074.63 грн |
25+ | 6531.25 грн |
10M40SAE144C8G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5567.34 грн |
25+ | 4502.81 грн |
100+ | 4395.83 грн |
10M40SCE144C8G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 101
DigiKey Programmable: Not Verified
товар відсутній
10M50DAF256C8G |
Виробник: Intel
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 52 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 11414.43 грн |
25+ | 9232.98 грн |
10M50DAF484C8G |
Виробник: Intel
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12437.21 грн |
25+ | 10060.64 грн |
10M50DCF256C8G |
Виробник: Intel
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 74 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 10581.18 грн |
25+ | 8558.36 грн |
10M50DCF484C8G |
Виробник: Intel
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 48 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 11451.28 грн |
25+ | 9262.53 грн |
10M50DCF484I7G |
Виробник: Intel
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
товар відсутній
10M50DCF672C8G |
Виробник: Intel
Description: IC FPGA 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 75 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 12495.86 грн |
25+ | 10106.75 грн |
10M50SAE144C8G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6127.61 грн |
25+ | 4956.76 грн |
10M50SCE144C8G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 101 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5339.47 грн |
25+ | 4319.27 грн |
100+ | 4216.61 грн |
10M50SCE144I7G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 181 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7120.3 грн |
25+ | 5758.98 грн |
100+ | 5621.22 грн |
10M08SAE144C8G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
товар відсутній
10M02DCV36C8G |
Виробник: Intel
Description: IC FPGA 27 I/O 36WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 36-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 2000
Supplier Device Package: 36-VBGA (3.47x3.4)
Number of LABs/CLBs: 125
Total RAM Bits: 110592
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC FPGA 27 I/O 36WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 36-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 2000
Supplier Device Package: 36-VBGA (3.47x3.4)
Number of LABs/CLBs: 125
Total RAM Bits: 110592
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
товар відсутній
DK-SOC-10AS066S-ES |
Виробник: Intel
Description: DEV KIT ARRIA 10 SX SOC ES
Packaging: Box
For Use With/Related Products: 10AS066
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Arria 10 SX SoC
Description: DEV KIT ARRIA 10 SX SOC ES
Packaging: Box
For Use With/Related Products: 10AS066
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Arria 10 SX SoC
товар відсутній
10M02SCU169C8G |
Виробник: Intel
Description: IC FPGA 130 I/O 169UBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 2000
Supplier Device Package: 169-UBGA (11x11)
Number of LABs/CLBs: 125
Total RAM Bits: 110592
Part Status: Active
Number of I/O: 130
DigiKey Programmable: Not Verified
Description: IC FPGA 130 I/O 169UBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 2000
Supplier Device Package: 169-UBGA (11x11)
Number of LABs/CLBs: 125
Total RAM Bits: 110592
Part Status: Active
Number of I/O: 130
DigiKey Programmable: Not Verified
на замовлення 548 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 649.01 грн |
25+ | 499.69 грн |
100+ | 487.7 грн |
500+ | 438.93 грн |
10M08SAE144I7G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 8000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 500
Total RAM Bits: 387072
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 265 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2660.71 грн |
25+ | 2049.15 грн |
100+ | 1998.36 грн |
10M16DAF256C8G |
Виробник: Intel
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 218 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4027.16 грн |
25+ | 3102.06 грн |
100+ | 3024.79 грн |
10M16SAE144C8G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3654.15 грн |
25+ | 2815.31 грн |
10M16SAU169I7G |
Виробник: Intel
Description: IC FPGA 130 I/O 169UBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 169-UBGA (11x11)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 130
DigiKey Programmable: Not Verified
Description: IC FPGA 130 I/O 169UBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 169-UBGA (11x11)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 130
DigiKey Programmable: Not Verified
на замовлення 224 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4103.87 грн |
25+ | 3161.1 грн |
100+ | 3081.76 грн |
10M16SCU169A7G |
Виробник: Intel
Description: IC FPGA 130 I/O 169UBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 169-UBGA (11x11)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 130
DigiKey Programmable: Not Verified
Description: IC FPGA 130 I/O 169UBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 169-UBGA (11x11)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Part Status: Active
Number of I/O: 130
DigiKey Programmable: Not Verified
на замовлення 161 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3851.19 грн |
25+ | 2967.1 грн |
100+ | 2893.19 грн |
10M25DAF256C8G |
Виробник: Intel
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
10M25DAF484I7G |
Виробник: Intel
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 129 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6408.12 грн |
25+ | 4936.94 грн |
100+ | 4813 грн |
10M25SAE144C8G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 61 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4455.07 грн |
25+ | 3431.19 грн |
10M25SAE144I7G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 25000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 1563
Total RAM Bits: 691200
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 157 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6022.32 грн |
25+ | 4639.27 грн |
100+ | 4522.65 грн |
10M40DCF256C8G |
Виробник: Intel
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 52 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6499.11 грн |
25+ | 5256.28 грн |
10M40SAE144I7G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 101
DigiKey Programmable: Not Verified
товар відсутній
10M50SAE144I7G |
Виробник: Intel
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 101
DigiKey Programmable: Not Verified
Description: IC FPGA 101 I/O 144EQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 144-EQFP (20x20)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 101
DigiKey Programmable: Not Verified
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8068.62 грн |
25+ | 6525.8 грн |
10AS057K2F40I2SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 570K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 570K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
товар відсутній
10AS057K3F35E2LG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 570K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 570K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
10AS057K3F35I2LG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 570K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 570K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
товар відсутній
10AS066H2F34I2SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
10AS066H3F34I2SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 339973.08 грн |
10AS066K2F35I2SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
10AS066K2F40E2SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
товар відсутній
10AS066K2F40I2LG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товар відсутній
10AS066K2F40I2SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
товар відсутній
10AS066K3F35I2SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
товар відсутній
10AS066K4F35I3SG |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
товар відсутній