Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2488) > Сторінка 41 з 42
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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SMDSWLF.031 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMDSWLF.031 1oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ. Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMDSWLF.031 2oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ. Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 100 шт: термін постачання 21-31 дні (днів) |
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SMDSWLF.031 4oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ. Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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SMDSWLF.031 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMDSWLF.059 3.3 1LB | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5 Packaging: Bulk Diameter: 0.059" (1.50mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (453.59g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMDSWLT.047 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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SMDSWLTLFP16 | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Form: Tube Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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SMDSWLTLFP32 | Chip Quik Inc. |
Description: SOLDER WIRE LOW TEMP 42/57/1 32' Packaging: Bulk Diameter: 0.030" (0.76mm) Wire Gauge: 21 AWG, 22 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 281°F (138°C) Process: Lead Free |
на замовлення 126 шт: термін постачання 21-31 дні (днів) |
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SMDTA200 | Chip Quik Inc. |
Description: INDUSTRIAL DISP TIP KIT Packaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Needle Tip Number of Pieces: 200 Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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SMDTA30 | Chip Quik Inc. |
Description: DISPENSING NEEDLES / SYRINGE TIP Packaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Assorted Number of Pieces: 30 |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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SMDTCLF | Chip Quik Inc. |
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G Packaging: Bulk For Use With/Related Products: Soldering Irons, Workstands Type: Tip Tinner (Activator) Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm) Specifications: Lead Free Part Status: Active |
на замовлення 410 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK1.5 | Chip Quik Inc. |
Description: 1.5MM SOLDER WICK NO CLEAN Packaging: Bulk Color: Yellow Length: 5' (1.524m) Type: No Clean Width: 0.059" (1.50mm) Product Type: Braid/Wick Part Status: Active |
на замовлення 424 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK2.0 | Chip Quik Inc. |
Description: 2.0MM SOLDER WICK NO CLEAN Packaging: Bulk Color: Green Length: 5' (1.524m) Type: No Clean Width: 0.080" (2.03mm) Product Type: Braid/Wick Part Status: Active |
на замовлення 409 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK2.5 | Chip Quik Inc. |
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE Packaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.098" (2.50mm) Product Type: Braid/Wick |
на замовлення 464 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK2.8 | Chip Quik Inc. |
Description: 2.8MM SOLDER WICK NO CLEAN Packaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.110" (2.79mm) Product Type: Braid/Wick Part Status: Active |
на замовлення 430 шт: термін постачання 21-31 дні (днів) |
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SS-METAL-0.2-136X48 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQU Packaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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SS-METAL-0.2-68X36 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQU Packaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
на замовлення 98 шт: термін постачання 21-31 дні (днів) |
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ST0001 | Chip Quik Inc. |
Description: SOLDER PRACTICE KIT Packaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
на замовлення 91 шт: термін постачання 21-31 дні (днів) |
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ST0001-S | Chip Quik Inc. |
Description: SMD SOLDERING PRACTICE KIT STENC Packaging: Bulk Material: Stainless Steel Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) |
товар відсутній |
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ST0002 | Chip Quik Inc. |
Description: PRACTICE KIT (WITH 135 SMD PARTS Packaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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ST0002-S | Chip Quik Inc. |
Description: PRACTICE KIT STENCIL FOR ST0002 Packaging: Bulk Material: Stainless Steel Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm) Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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STENCIL-WIPES | Chip Quik Inc. |
Description: STENCIL WIPES (IPA/WATER LINT-FR Packaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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STENCIL-WIPES-ANTISTATIC | Chip Quik Inc. |
Description: STENCIL WIPES ANTI-STATIC (IPA/W Packaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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TC1-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSIT Packaging: Bulk Color: White Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
на замовлення 120 шт: термін постачання 21-31 дні (днів) |
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TC1-200G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSIT Packaging: Bulk Color: White Size / Dimension: 200 gram Jar Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
товар відсутній |
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TC1-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSIT Packaging: Bulk Color: White Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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TC2-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRA Packaging: Bulk Color: Gray Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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TC2-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRA Packaging: Bulk Color: Gray Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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TC2-50G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRA Packaging: Bulk Color: Gray Size / Dimension: 50 gram Jar Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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TC3-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND Packaging: Bulk Color: Gray Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 243 шт: термін постачання 21-31 дні (днів) |
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TC3-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND Packaging: Bulk Color: Gray Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 422 шт: термін постачання 21-31 дні (днів) |
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TC3-3.5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND Packaging: Bulk Color: Gray Size / Dimension: 3.5 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 102 шт: термін постачання 21-31 дні (днів) |
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TC4-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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TC4-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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TC4-20G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 20 gram Syringe Type: Thermal Compound, Liquid Metal Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 65 шт: термін постачання 21-31 дні (днів) |
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TC4-2G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 2 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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TC4-5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 5 gram Syringe Type: Thermal Compound, Liquid Metal Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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TS391AX | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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TS391AX10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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TS391AX250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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TS391AX50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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TS391AX500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
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TS391LT | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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TS391LT10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
TS391LT250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
TS391LT50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
TS391LT500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
TS391SNL | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
TS391SNL10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товар відсутній |
||||||||||
TS391SNL250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
TS391SNL50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
|
SMDSWLF.031 1LB |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7380.52 грн |
SMDSWLF.031 1oz |
Виробник: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 817.81 грн |
SMDSWLF.031 2oz |
Виробник: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1290.13 грн |
SMDSWLF.031 4oz |
Виробник: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2248.78 грн |
SMDSWLF.031 8OZ |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4145.85 грн |
SMDSWLF.059 3.3 1LB |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Packaging: Bulk
Diameter: 0.059" (1.50mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Packaging: Bulk
Diameter: 0.059" (1.50mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 7673.09 грн |
SMDSWLT.040 100G |
Виробник: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 65 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 8602.17 грн |
SMDSWLT.040 10G |
Виробник: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 28 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1447.31 грн |
SMDSWLT.040 200G |
Виробник: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 65 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 13768.92 грн |
SMDSWLT.040 20G |
Виробник: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 35 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2500.12 грн |
SMDSWLT.040 50G |
Виробник: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5306.03 грн |
SMDSWLT.047 1OZ |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1183.53 грн |
SMDSWLT.047 2OZ |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1983.44 грн |
5+ | 1871.62 грн |
SMDSWLT.047 4OZ |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3282.13 грн |
SMDSWLT.047 8OZ |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5018.13 грн |
10+ | 3933.48 грн |
SMDSWLTLFP16 |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1737.55 грн |
SMDSWLTLFP32 |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 281°F (138°C)
Process: Lead Free
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 281°F (138°C)
Process: Lead Free
на замовлення 126 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2779.46 грн |
SMDTA200 |
Виробник: Chip Quik Inc.
Description: INDUSTRIAL DISP TIP KIT
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Needle Tip
Number of Pieces: 200
Part Status: Active
Description: INDUSTRIAL DISP TIP KIT
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Needle Tip
Number of Pieces: 200
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3260.34 грн |
SMDTA30 |
Виробник: Chip Quik Inc.
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Assorted
Number of Pieces: 30
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Assorted
Number of Pieces: 30
на замовлення 45 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 708.09 грн |
SMDTCLF |
Виробник: Chip Quik Inc.
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
на замовлення 410 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 534.57 грн |
SOLDERWICK1.5 |
Виробник: Chip Quik Inc.
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
на замовлення 424 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 142.4 грн |
SOLDERWICK2.0 |
Виробник: Chip Quik Inc.
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
на замовлення 409 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 142.4 грн |
SOLDERWICK2.5 |
Виробник: Chip Quik Inc.
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
на замовлення 464 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 355.6 грн |
10+ | 322.13 грн |
100+ | 241.55 грн |
SOLDERWICK2.8 |
Виробник: Chip Quik Inc.
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
на замовлення 430 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
3+ | 142.4 грн |
SS-METAL-0.2-136X48 |
Виробник: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1394.4 грн |
SS-METAL-0.2-68X36 |
Виробник: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
на замовлення 98 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 695.64 грн |
ST0001 |
Виробник: Chip Quik Inc.
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
на замовлення 91 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2284.58 грн |
ST0001-S |
Виробник: Chip Quik Inc.
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
товар відсутній
ST0002 |
Виробник: Chip Quik Inc.
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5800.92 грн |
ST0002-S |
Виробник: Chip Quik Inc.
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3491.45 грн |
STENCIL-WIPES |
Виробник: Chip Quik Inc.
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 834.93 грн |
STENCIL-WIPES-ANTISTATIC |
Виробник: Chip Quik Inc.
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1045.02 грн |
TC1-10G |
Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
на замовлення 120 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 625.61 грн |
TC1-200G |
Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
товар відсутній
TC1-20G |
Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 930.64 грн |
TC2-10G |
Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 24 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1577.26 грн |
TC2-20G |
Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 34 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2942.09 грн |
TC2-50G |
Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 6986.01 грн |
TC3-10G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 243 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2652.63 грн |
TC3-1G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 422 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 415.52 грн |
TC3-3.5G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 102 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1089.38 грн |
TC4-10G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 22 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2370.17 грн |
10+ | 2148.26 грн |
TC4-1G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 832.59 грн |
10+ | 757.77 грн |
25+ | 713.16 грн |
TC4-20G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 65 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 3895.29 грн |
10+ | 3530.35 грн |
25+ | 3309.74 грн |
50+ | 2898.99 грн |
TC4-2G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1302.58 грн |
TC4-5G |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1692.42 грн |
10+ | 1539.3 грн |
TS391AX |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1174.97 грн |
TS391AX10 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1988.89 грн |
TS391AX250 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 16 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4055.59 грн |
TS391AX50 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1027.12 грн |
TS391AX500C |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
TS391LT |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 59 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1184.31 грн |
TS391LT10 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 2023.12 грн |
TS391LT250 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 5937.09 грн |
TS391LT50 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1534.46 грн |
TS391LT500C |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 10805.82 грн |
TS391SNL |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1184.31 грн |
TS391SNL10 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товар відсутній
TS391SNL250 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 4888.96 грн |
TS391SNL50 |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1254.34 грн |