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PC815 PC815 Capital Advanced Technologies PC815%20Brochure.pdf Description: MEASUREMENT TOOL PITCH CHECKER
Packaging: Bulk
For Use With/Related Products: Integrated Circuits
Tool Type: Pitch Comparator
Part Status: Active
товар відсутній
PIN SP-1A PIN SP-1A Capital Advanced Technologies PIN_SP-1A_Dwg.pdf Description: SIP PIN FOR EDGE OF PCB TIN
на замовлення 88000 шт:
термін постачання 21-31 дні (днів)
US-1006 US-1006 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 6PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.600" W (12.70mm x 15.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1007 US-1007 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 7PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.700" W (12.70mm x 17.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1008 US-1008 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.800" W (12.70mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1009 US-1009 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 9PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.900" W (12.70mm x 22.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1010 US-1010 Capital Advanced Technologies unsp1pg.pdf Description: REPCO AB MOVABLE CONTACT X-33553
Packaging: Bag
Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2006 US-2006 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 6PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 0.598" W (15.20mm x 15.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2007 US-2007 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 7PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 0.701" W (15.20mm x 17.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2008 US-2008 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 0.800" W (15.20mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2010 US-2010 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 1.000" W (12.70mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2012 US-2012 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 1.201" W (15.20mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3008 US-3008 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 0.799" W (25.40mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3010 US-3010 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3012 US-3012 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.201" W (25.40mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3014 US-3014 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 14PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.402" W (25.40mm x 35.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4007 US-4007 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 7PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 0.701" W (25.40mm x 17.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
US-4008 US-4008 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4010 US-4010 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4012 US-4012 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.201" W (25.40mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4014 US-4014 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 14PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.402" W (25.40mm x 35.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4016 US-4016 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 16PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.598" W (25.40mm x 40.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5008 US-5008 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.299" L x 0.800" W (33.00mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5010 US-5010 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
товар відсутній
US-5012 US-5012 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.201" W (25.40mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5014 US-5014 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 14PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.402" W (25.40mm x 35.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5016 US-5016 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 16PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.598" W (25.40mm x 40.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5020 US-5020 Capital Advanced Technologies unsp1pg.pdf Description: PROTO BOARD 20PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 2.000" W (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
PC815 PC815%20Brochure.pdf
PC815
Виробник: Capital Advanced Technologies
Description: MEASUREMENT TOOL PITCH CHECKER
Packaging: Bulk
For Use With/Related Products: Integrated Circuits
Tool Type: Pitch Comparator
Part Status: Active
товар відсутній
PIN SP-1A PIN_SP-1A_Dwg.pdf
PIN SP-1A
Виробник: Capital Advanced Technologies
Description: SIP PIN FOR EDGE OF PCB TIN
на замовлення 88000 шт:
термін постачання 21-31 дні (днів)
US-1006 unsp1pg.pdf
US-1006
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 6PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.600" W (12.70mm x 15.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1007 unsp1pg.pdf
US-1007
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 7PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.700" W (12.70mm x 17.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1008 unsp1pg.pdf
US-1008
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.800" W (12.70mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1009 unsp1pg.pdf
US-1009
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 9PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.500" L x 0.900" W (12.70mm x 22.90mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-1010 unsp1pg.pdf
US-1010
Виробник: Capital Advanced Technologies
Description: REPCO AB MOVABLE CONTACT X-33553
Packaging: Bag
Size / Dimension: 0.500" L x 1.000" W (12.70mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2006 unsp1pg.pdf
US-2006
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 6PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 0.598" W (15.20mm x 15.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2007 unsp1pg.pdf
US-2007
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 7PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 0.701" W (15.20mm x 17.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2008 unsp1pg.pdf
US-2008
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 0.800" W (15.20mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2010 unsp1pg.pdf
US-2010
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 1.000" W (12.70mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-2012 unsp1pg.pdf
US-2012
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 0.598" L x 1.201" W (15.20mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3008 unsp1pg.pdf
US-3008
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 0.799" W (25.40mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3010 unsp1pg.pdf
US-3010
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3012 unsp1pg.pdf
US-3012
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.201" W (25.40mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-3014 unsp1pg.pdf
US-3014
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 14PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.402" W (25.40mm x 35.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4007 unsp1pg.pdf
US-4007
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 7PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 0.701" W (25.40mm x 17.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
US-4008 unsp1pg.pdf
US-4008
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4010 unsp1pg.pdf
US-4010
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4012 unsp1pg.pdf
US-4012
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.201" W (25.40mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4014 unsp1pg.pdf
US-4014
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 14PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.402" W (25.40mm x 35.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-4016 unsp1pg.pdf
US-4016
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 16PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.598" W (25.40mm x 40.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5008 unsp1pg.pdf
US-5008
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 8PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.299" L x 0.800" W (33.00mm x 20.30mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5010 unsp1pg.pdf
US-5010
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 10PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
товар відсутній
US-5012 unsp1pg.pdf
US-5012
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 12PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.201" W (25.40mm x 30.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5014 unsp1pg.pdf
US-5014
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 14PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.402" W (25.40mm x 35.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5016 unsp1pg.pdf
US-5016
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 16PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 1.598" W (25.40mm x 40.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
US-5020 unsp1pg.pdf
US-5020
Виробник: Capital Advanced Technologies
Description: PROTO BOARD 20PIN THRU-HOLE SIP
Packaging: Bag
Size / Dimension: 1.000" L x 2.000" W (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Board Thickness: 0.031" (0.79mm) 1/32"
Proto Board Type: Through Hole to SIP
Package Accepted: Non Specific
Part Status: Active
товар відсутній
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