Продукція > ARIES ELECTRONICS > Всі товари виробника ARIES ELECTRONICS (15933) > Сторінка 123 з 266
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
---|---|---|---|---|---|
36-81250-610C | Aries Electronics |
![]() |
товар відсутній |
||
36-8580-610C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товар відсутній |
||
36-8750-310C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товар відсутній |
||
36-8970-610C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товар відсутній |
||
38-81000-610C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 38 (2 x 19) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товар відсутній |
||
38-81250-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-81000-310C | Aries Electronics |
![]() |
товар відсутній |
||
40-81000-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-81150-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-81250-310C | Aries Electronics |
![]() |
товар відсутній |
||
40-81250-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8260-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8300-310C | Aries Electronics |
![]() |
товар відсутній |
||
40-8320-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8350-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8370-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8435-310C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товар відсутній |
||
40-8460-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8500-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8530-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8600-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8620-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8625-610C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товар відсутній |
||
40-8650-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8700-310C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товар відсутній |
||
40-8700-610C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товар відсутній |
||
40-8750-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8770-610C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Part Status: Active |
товар відсутній |
||
40-8785-310C | Aries Electronics |
![]() |
товар відсутній |
||
40-8785-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8800-610C | Aries Electronics |
![]() |
товар відсутній |
||
40-8810-610C | Aries Electronics |
![]() |
товар відсутній |
||
48-81000-610C | Aries Electronics |
![]() Features: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
товар відсутній |
||
48-81250-610C | Aries Electronics |
![]() |
товар відсутній |
||
1108883-05 | Aries Electronics |
![]() |
товар відсутній |
||
01-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
02-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
03-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
04-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||
05-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||
06-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
07-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
08-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
09-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
10-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
11-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
12-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
13-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
14-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||
15-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||
16-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
17-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 17 (1 x 17) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||
18-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
19-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
товар відсутній |
||
20-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
21-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
22-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
23-0517-90C | Aries Electronics |
![]() |
товар відсутній |
||
24-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
||
25-0517-90C | Aries Electronics |
![]() Packaging: Bulk Mounting Type: Through Hole, Right Angle Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
36-8580-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
36-8750-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
36-8970-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 36POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
38-81000-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 38POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 38POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
40-8435-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
40-8625-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
40-8700-310C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
40-8700-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
40-8770-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
48-81000-610C |
![]() |
Виробник: Aries Electronics
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 48POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
товар відсутній
04-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
05-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 5POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
14-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 14POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 14POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
15-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
17-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 17POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 17 (1 x 17)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
19-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
товар відсутній
24-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 24POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 24POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
25-0517-90C |
![]() |
Виробник: Aries Electronics
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: CONN SOCKET SIP 25POS GOLD
Packaging: Bulk
Mounting Type: Through Hole, Right Angle
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній