Продукція > AMPHENOL ICC (FCI) > Всі товари виробника AMPHENOL ICC (FCI) (43198) > Сторінка 671 з 720
| Фото | Назва | Виробник | Інформація |
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| HM1L43ADP394H6P | Amphenol ICC (FCI) |
 Description: METRAL HDR RA PF 4X24Packaging: Tray Connector Type: Header, Male Pins Mounting Type: Board Edge, Through Hole, Right Angle Number of Positions: 96 Pitch: 0.079" (2.00mm) Number of Rows: 4 Termination: Press-Fit Connector Style: High Speed |
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| HM1L43ZBP099H6PLF | Amphenol ICC (FCI) |
Description: METRAL HDR RA STB 4X24 Packaging: Tray Features: Board Guide Connector Type: Header, Male Pins Contact Finish: Gold Color: Natural Mounting Type: Board Edge, Through Hole, Right Angle Number of Positions: 96 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Solder Connector Style: High Speed Contact Finish Thickness: 30.0µin (0.76µm) |
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| HM1L43ZBP099H6P | Amphenol ICC (FCI) |
Description: METRAL HDR RA STB 4X24 Packaging: Tray Features: Board Guide Connector Type: Header, Male Pins Contact Finish: Gold Color: Natural Mounting Type: Board Edge, Through Hole, Right Angle Number of Positions: 96 Pitch: 0.079" (2.00mm) Number of Rows: 4 Number of Positions Loaded: All Termination: Solder Connector Style: High Speed Contact Finish Thickness: 30.0µin (0.76µm) |
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| 68443-436 | Amphenol ICC (FCI) |
Description: CONN HEADER VERT 36POS 2.54MM Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 36 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Shape: Square Contact Length - Post: 0.425" (10.80mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.755" (19.18mm) Contact Length - Mating: 0.230" (5.84mm) |
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| 58443-004 | Amphenol ICC (FCI) |
Description: PLUG SUB ASSY EYEMAX Packaging: Bulk Connector Type: Multi-Standard Pluggable 12x Contact Finish: Gold Mounting Type: Free Hanging (In-Line) Number of Positions: 24 Signal Pairs Termination: Solder Cup Connector Style: Plug |
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| 95159-240 | Amphenol ICC (FCI) |
Description: CONN HEADER SMD 40POS 2.54MM Packaging: Bulk Connector Type: Header Mounting Type: Surface Mount Number of Positions: 40 Number of Rows: 2 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
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| 10044078-B0503LF | Amphenol ICC (FCI) |
Description: CONN HEADER RECEPTACLE Packaging: Bulk |
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F33X-1AAJ1-E8951 | Amphenol ICC (FCI) |
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M Packaging: Tape & Reel (TR) Features: Board Guide, Zero Insertion Force (ZIF) Contact Finish: Gold Voltage Rating: 50V Mounting Type: Surface Mount, Right Angle Number of Positions: 51 Pitch: 0.020" (0.50mm) Operating Temperature: -55°C ~ 85°C Termination: Solder Height Above Board: 0.083" (2.10mm) Locking Feature: Flip Lock Material Flammability Rating: UL94 V-0 Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled Contact Material: Phosphor Bronze FFC, FCB Thickness: 0.30mm Housing Material: Liquid Crystal Polymer (LCP), Glass Filled Cable End Type: Notched, Tapered Flat Flex Type: FFC, FPC Connector/Contact Type: Contacts, Bottom |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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F33X-1AAJ1-E8951 | Amphenol ICC (FCI) |
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M Packaging: Cut Tape (CT) Features: Board Guide, Zero Insertion Force (ZIF) Contact Finish: Gold Voltage Rating: 50V Mounting Type: Surface Mount, Right Angle Number of Positions: 51 Pitch: 0.020" (0.50mm) Operating Temperature: -55°C ~ 85°C Termination: Solder Height Above Board: 0.083" (2.10mm) Locking Feature: Flip Lock Material Flammability Rating: UL94 V-0 Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled Contact Material: Phosphor Bronze FFC, FCB Thickness: 0.30mm Housing Material: Liquid Crystal Polymer (LCP), Glass Filled Cable End Type: Notched, Tapered Flat Flex Type: FFC, FPC Connector/Contact Type: Contacts, Bottom |
на замовлення 9997 шт: термін постачання 21-31 дні (днів) |
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| 69190-517 | Amphenol ICC (FCI) |
Description: CONN HEADER VERT 17POS 2.54MM Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 17 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit, Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold or Gold, GXT™ Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Shape: Square Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.450" (11.43mm) Contact Length - Mating: 0.230" (5.84mm) |
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| 68779-404HLF | Amphenol ICC (FCI) |
Description: BERGSTIK II .100CC DR ST RAIGHT Packaging: Bag Connector Type: Header Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 4 Number of Rows: 2 Style: Board to Board Operating Temperature: -65°C ~ 130°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.318" (8.08mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Overall Contact Length: 0.736" (18.69mm) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
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| 68459-404HLF | Amphenol ICC (FCI) |
Description: BERGSTIK II .100CC DR ST RAIGHT Packaging: Bulk Connector Type: Header Voltage Rating: 110V Current Rating (Amps): 5A Mounting Type: Through Hole, Right Angle Number of Positions: 4 Number of Rows: 2 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin Contact Shape: Square Contact Length - Post: 0.150" (3.81mm) Insulation Height: 0.190" (4.83mm) Shrouding: Unshrouded Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
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| SIP050-1X02-157B | Amphenol ICC (FCI) |
Description: 1X02-157B-SIP SOCKET 2 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X02-160B | Amphenol ICC (FCI) |
Description: 1X02-160B-SIP SOCKET 2 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 2 (1 x 2) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X03-157B | Amphenol ICC (FCI) |
Description: 1X03-157B-SIP SOCKET 3 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X03-160B | Amphenol ICC (FCI) |
Description: 1X03-160B-SIP SOCKET 3 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 3 (1 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X04-157B | Amphenol ICC (FCI) |
Description: 1X04-157B-SIP SOCKET 4 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X04-160B | Amphenol ICC (FCI) |
Description: 1X04-160B-SIP SOCKET 4 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 4 (1 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X05-157B | Amphenol ICC (FCI) |
Description: 1X05-157B-SIP SOCKET 5 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X06-157B | Amphenol ICC (FCI) |
Description: 1X06-157B-SIP SOCKET 6 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X05-160B | Amphenol ICC (FCI) |
Description: 1X05-160B-SIP SOCKET 5 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 5 (1 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X07-157B | Amphenol ICC (FCI) |
Description: 1X07-157B-SIP SOCKET 7 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X06-160B | Amphenol ICC (FCI) |
Description: 1X06-160B-SIP SOCKET 6 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 6 (1 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X08-157B | Amphenol ICC (FCI) |
Description: 1X08-157B-SIP SOCKET 8 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X07-160B | Amphenol ICC (FCI) |
Description: 1X07-160B-SIP SOCKET 7 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 7 (1 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X09-157B | Amphenol ICC (FCI) |
Description: 1X09-157B-SIP SOCKET 9 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X08-160B | Amphenol ICC (FCI) |
Description: 1X08-160B-SIP SOCKET 8 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X10-157B | Amphenol ICC (FCI) |
Description: 1X10-157B-SIP SOCKET 10 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X09-160B | Amphenol ICC (FCI) |
Description: 1X09-160B-SIP SOCKET 9 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X11-157B | Amphenol ICC (FCI) |
Description: 1X11-157B-SIP SOCKET 11 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X12-157B | Amphenol ICC (FCI) |
Description: 1X12-157B-SIP SOCKET 12 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X10-160B | Amphenol ICC (FCI) |
Description: 1X10-160B-SIP SOCKET 10 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X11-160B | Amphenol ICC (FCI) |
Description: 1X11-160B-SIP SOCKET 11 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 11 (1 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X13-157B | Amphenol ICC (FCI) |
Description: 1X13-157B-SIP SOCKET 13 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X14-157B | Amphenol ICC (FCI) |
Description: 1X14-157B-SIP SOCKET 14 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
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| SIP050-1X12-160B | Amphenol ICC (FCI) |
Description: 1X12-160B-SIP SOCKET 12 CTS Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 12 (1 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X15-157B | Amphenol ICC (FCI) |
Description: 1X15-157B-SIP SOCKET 15 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X13-160B | Amphenol ICC (FCI) |
Description: 1X13-160B-SIP SOCKET 13 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 13 (1 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X16-157B | Amphenol ICC (FCI) |
Description: 1X16-157B-SIP SOCKET 16 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X14-160B | Amphenol ICC (FCI) |
Description: 1X14-160B-SIP SOCKET 14 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 14 (1 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X15-160B | Amphenol ICC (FCI) |
Description: 1X15-160B-SIP SOCKET 15 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 15 (1 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X20-157B | Amphenol ICC (FCI) |
Description: 1X20-157B-SIP SOCKET 20 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X18-157B | Amphenol ICC (FCI) |
Description: 1X18-157B-SIP SOCKET 18 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 18 (1 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X16-160B | Amphenol ICC (FCI) |
Description: 1X16-160B-SIP SOCKET 16 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 16 (1 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X19-157B | Amphenol ICC (FCI) |
Description: 1X19-157B-SIP SOCKET 19 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X21-157B | Amphenol ICC (FCI) |
Description: 1X21-157B-SIP SOCKET 21 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 21 (1 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X18-160B | Amphenol ICC (FCI) |
Description: 1X18-160B-SIP SOCKET 18 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 18 (1 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X22-157B | Amphenol ICC (FCI) |
Description: 1X22-157B-SIP SOCKET 22 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 22 (1 x 22) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X19-160B | Amphenol ICC (FCI) |
Description: 1X19-160B-SIP SOCKET 19 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 19 (1 x 19) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X20-160B | Amphenol ICC (FCI) |
Description: 1X20-160B-SIP SOCKET 20 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X23-157B | Amphenol ICC (FCI) |
Description: 1X23-157B-SIP SOCKET 23 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 23 (1 x 23) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X24-157B | Amphenol ICC (FCI) |
Description: 1X24-157B-SIP SOCKET 24 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X25-157B | Amphenol ICC (FCI) |
Description: 1X25-157B-SIP SOCKET 25 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 25 (1 x 25) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X21-160B | Amphenol ICC (FCI) |
Description: 1X21-160B-SIP SOCKET 21 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 21 (1 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X22-160B | Amphenol ICC (FCI) |
Description: 1X22-160B-SIP SOCKET 22 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 22 (1 x 22) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X26-157B | Amphenol ICC (FCI) |
Description: 1X26-157B-SIP SOCKET 26 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 26 (1 x 26) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X23-160B | Amphenol ICC (FCI) |
Description: 1X23-160B-SIP SOCKET 23 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 23 (1 x 23) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X28-157B | Amphenol ICC (FCI) |
Description: 1X28-157B-SIP SOCKET 28 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 28 (1 x 28) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X24-160B | Amphenol ICC (FCI) |
Description: 1X24-160B-SIP SOCKET 24 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
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| SIP050-1X29-157B | Amphenol ICC (FCI) |
Description: 1X29-157B-SIP SOCKET 29 CTS Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 29 (1 x 29) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
товар відсутній |
| HM1L43ADP394H6P |
|
Виробник: Amphenol ICC (FCI)
Description: METRAL HDR RA PF 4X24
Packaging: Tray
Connector Type: Header, Male Pins
Mounting Type: Board Edge, Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Termination: Press-Fit
Connector Style: High Speed
Description: METRAL HDR RA PF 4X24
Packaging: Tray
Connector Type: Header, Male Pins
Mounting Type: Board Edge, Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Termination: Press-Fit
Connector Style: High Speed
товар відсутній
| HM1L43ZBP099H6PLF |
|
Виробник: Amphenol ICC (FCI)
Description: METRAL HDR RA STB 4X24
Packaging: Tray
Features: Board Guide
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Natural
Mounting Type: Board Edge, Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Style: High Speed
Contact Finish Thickness: 30.0µin (0.76µm)
Description: METRAL HDR RA STB 4X24
Packaging: Tray
Features: Board Guide
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Natural
Mounting Type: Board Edge, Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Style: High Speed
Contact Finish Thickness: 30.0µin (0.76µm)
товар відсутній
| HM1L43ZBP099H6P |
|
Виробник: Amphenol ICC (FCI)
Description: METRAL HDR RA STB 4X24
Packaging: Tray
Features: Board Guide
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Natural
Mounting Type: Board Edge, Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Style: High Speed
Contact Finish Thickness: 30.0µin (0.76µm)
Description: METRAL HDR RA STB 4X24
Packaging: Tray
Features: Board Guide
Connector Type: Header, Male Pins
Contact Finish: Gold
Color: Natural
Mounting Type: Board Edge, Through Hole, Right Angle
Number of Positions: 96
Pitch: 0.079" (2.00mm)
Number of Rows: 4
Number of Positions Loaded: All
Termination: Solder
Connector Style: High Speed
Contact Finish Thickness: 30.0µin (0.76µm)
товар відсутній
| 68443-436 |
|
Виробник: Amphenol ICC (FCI)
Description: CONN HEADER VERT 36POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 36
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Shape: Square
Contact Length - Post: 0.425" (10.80mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.755" (19.18mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER VERT 36POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 36
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Shape: Square
Contact Length - Post: 0.425" (10.80mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.755" (19.18mm)
Contact Length - Mating: 0.230" (5.84mm)
товар відсутній
| 58443-004 |
Виробник: Amphenol ICC (FCI)
Description: PLUG SUB ASSY EYEMAX
Packaging: Bulk
Connector Type: Multi-Standard Pluggable 12x
Contact Finish: Gold
Mounting Type: Free Hanging (In-Line)
Number of Positions: 24 Signal Pairs
Termination: Solder Cup
Connector Style: Plug
Description: PLUG SUB ASSY EYEMAX
Packaging: Bulk
Connector Type: Multi-Standard Pluggable 12x
Contact Finish: Gold
Mounting Type: Free Hanging (In-Line)
Number of Positions: 24 Signal Pairs
Termination: Solder Cup
Connector Style: Plug
товар відсутній
| 95159-240 |
|
Виробник: Amphenol ICC (FCI)
Description: CONN HEADER SMD 40POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 40
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: CONN HEADER SMD 40POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 40
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
товар відсутній
| 10044078-B0503LF |
товар відсутній
| F33X-1AAJ1-E8951 |
|
Виробник: Amphenol ICC (FCI)
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Packaging: Tape & Reel (TR)
Features: Board Guide, Zero Insertion Force (ZIF)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Packaging: Tape & Reel (TR)
Features: Board Guide, Zero Insertion Force (ZIF)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2000+ | 33.73 грн |
| 4000+ | 31.4 грн |
| 6000+ | 30.31 грн |
| F33X-1AAJ1-E8951 |
|
Виробник: Amphenol ICC (FCI)
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Packaging: Cut Tape (CT)
Features: Board Guide, Zero Insertion Force (ZIF)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
Description: FLEX CONNECTOR, P=0.50MM, H=2.1M
Packaging: Cut Tape (CT)
Features: Board Guide, Zero Insertion Force (ZIF)
Contact Finish: Gold
Voltage Rating: 50V
Mounting Type: Surface Mount, Right Angle
Number of Positions: 51
Pitch: 0.020" (0.50mm)
Operating Temperature: -55°C ~ 85°C
Termination: Solder
Height Above Board: 0.083" (2.10mm)
Locking Feature: Flip Lock
Material Flammability Rating: UL94 V-0
Actuator Material: Liquid Crystal Polymer (LCP), Glass Filled
Contact Material: Phosphor Bronze
FFC, FCB Thickness: 0.30mm
Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
Cable End Type: Notched, Tapered
Flat Flex Type: FFC, FPC
Connector/Contact Type: Contacts, Bottom
на замовлення 9997 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 65.59 грн |
| 10+ | 53.07 грн |
| 25+ | 50.87 грн |
| 50+ | 46.74 грн |
| 100+ | 44.71 грн |
| 250+ | 40.64 грн |
| 500+ | 35.98 грн |
| 1000+ | 31.98 грн |
| 69190-517 |
|
Виробник: Amphenol ICC (FCI)
Description: CONN HEADER VERT 17POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 17
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Shape: Square
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.450" (11.43mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER VERT 17POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 17
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold or Gold, GXT™
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Shape: Square
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.450" (11.43mm)
Contact Length - Mating: 0.230" (5.84mm)
товар відсутній
| 68779-404HLF |
Виробник: Amphenol ICC (FCI)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bag
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Operating Temperature: -65°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.318" (8.08mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.736" (18.69mm)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bag
Connector Type: Header
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Operating Temperature: -65°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.318" (8.08mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Overall Contact Length: 0.736" (18.69mm)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
товар відсутній
| 68459-404HLF |
Виробник: Amphenol ICC (FCI)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bulk
Connector Type: Header
Voltage Rating: 110V
Current Rating (Amps): 5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.150" (3.81mm)
Insulation Height: 0.190" (4.83mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: BERGSTIK II .100CC DR ST RAIGHT
Packaging: Bulk
Connector Type: Header
Voltage Rating: 110V
Current Rating (Amps): 5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 4
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin
Contact Shape: Square
Contact Length - Post: 0.150" (3.81mm)
Insulation Height: 0.190" (4.83mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
товар відсутній
| SIP050-1X02-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X02-157B-SIP SOCKET 2 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X02-157B-SIP SOCKET 2 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X02-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X02-160B-SIP SOCKET 2 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X02-160B-SIP SOCKET 2 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X03-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X03-157B-SIP SOCKET 3 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X03-157B-SIP SOCKET 3 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X03-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X03-160B-SIP SOCKET 3 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X03-160B-SIP SOCKET 3 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X04-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X04-157B-SIP SOCKET 4 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X04-157B-SIP SOCKET 4 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X04-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X04-160B-SIP SOCKET 4 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X04-160B-SIP SOCKET 4 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X05-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X05-157B-SIP SOCKET 5 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X05-157B-SIP SOCKET 5 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X06-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X06-157B-SIP SOCKET 6 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X06-157B-SIP SOCKET 6 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X05-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X05-160B-SIP SOCKET 5 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X05-160B-SIP SOCKET 5 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X07-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X07-157B-SIP SOCKET 7 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X07-157B-SIP SOCKET 7 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X06-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X06-160B-SIP SOCKET 6 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X06-160B-SIP SOCKET 6 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X08-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X08-157B-SIP SOCKET 8 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X08-157B-SIP SOCKET 8 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X07-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X07-160B-SIP SOCKET 7 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X07-160B-SIP SOCKET 7 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X09-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X09-157B-SIP SOCKET 9 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X09-157B-SIP SOCKET 9 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X08-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X08-160B-SIP SOCKET 8 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X08-160B-SIP SOCKET 8 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X10-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X10-157B-SIP SOCKET 10 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X10-157B-SIP SOCKET 10 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X09-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X09-160B-SIP SOCKET 9 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X09-160B-SIP SOCKET 9 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X11-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X11-157B-SIP SOCKET 11 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X11-157B-SIP SOCKET 11 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X12-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X12-157B-SIP SOCKET 12 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X12-157B-SIP SOCKET 12 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X10-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X10-160B-SIP SOCKET 10 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X10-160B-SIP SOCKET 10 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X11-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X11-160B-SIP SOCKET 11 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X11-160B-SIP SOCKET 11 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 11 (1 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X13-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X13-157B-SIP SOCKET 13 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X13-157B-SIP SOCKET 13 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X14-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X14-157B-SIP SOCKET 14 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X14-157B-SIP SOCKET 14 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X12-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X12-160B-SIP SOCKET 12 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X12-160B-SIP SOCKET 12 CTS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X15-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X15-157B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X15-157B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X13-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X13-160B-SIP SOCKET 13 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X13-160B-SIP SOCKET 13 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X16-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X16-157B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X16-157B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X14-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X14-160B-SIP SOCKET 14 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X14-160B-SIP SOCKET 14 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X15-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X15-160B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X15-160B-SIP SOCKET 15 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X20-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X20-157B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X20-157B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X18-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X18-157B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X18-157B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X16-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X16-160B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X16-160B-SIP SOCKET 16 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X19-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X19-157B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X19-157B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X21-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X21-157B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X21-157B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X18-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X18-160B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X18-160B-SIP SOCKET 18 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X22-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X22-157B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X22-157B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X19-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X19-160B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X19-160B-SIP SOCKET 19 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X20-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X20-160B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X20-160B-SIP SOCKET 20 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X23-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X23-157B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X23-157B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X24-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X24-157B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X24-157B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X25-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X25-157B-SIP SOCKET 25 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X25-157B-SIP SOCKET 25 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X21-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X21-160B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X21-160B-SIP SOCKET 21 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 21 (1 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X22-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X22-160B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X22-160B-SIP SOCKET 22 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 22 (1 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X26-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X26-157B-SIP SOCKET 26 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 26 (1 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X26-157B-SIP SOCKET 26 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 26 (1 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X23-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X23-160B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X23-160B-SIP SOCKET 23 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 23 (1 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X28-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X28-157B-SIP SOCKET 28 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 28 (1 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X28-157B-SIP SOCKET 28 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 28 (1 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X24-160B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X24-160B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X24-160B-SIP SOCKET 24 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній
| SIP050-1X29-157B |
|
Виробник: Amphenol ICC (FCI)
Description: 1X29-157B-SIP SOCKET 29 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Description: 1X29-157B-SIP SOCKET 29 CTS
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 29 (1 x 29)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
товар відсутній