| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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|---|---|---|---|---|---|---|---|
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XCVM1302-1LSENSVF1369 | AMD |
 Description: IC VERSALPRIME ACAP FPGA 1369BGAPackaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XCVM1802-2MSEVSVD1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
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XCVM1402-1LSIVSVD1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
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XCZU43DR-1FFVE1156I | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCVC1802-1MLIVSVA2197 | AMD |
Description: IC VERSAL AICORE FPGA 2197BGA Packaging: Tray Package / Case: 2197-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 2197-FCBGA (45x45) Architecture: MPU, FPGA Part Status: Active |
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XCZU42DR-2FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCVM1402-2MSINSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.4GHz Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA Part Status: Active |
товар відсутній |
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XCZU42DR-1FFVE1156E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1156BGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
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XCZU46DR-1FFVH1760E | AMD |
Description: IC ZUP RFSOC A53 FPGA 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (42.5x42.5) Architecture: MCU, FPGA |
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XC6SLX16-N3CPG196I | AMD |
Description: IC FPGA 106 I/O 196CSBGA Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 14579 Supplier Device Package: 196-CSPBGA (8x8) Number of LABs/CLBs: 1139 Total RAM Bits: 589824 Part Status: Active Number of I/O: 106 DigiKey Programmable: Not Verified |
товар відсутній |
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HW-ADK-2-0-G | AMD |
Description: DEBUG KIT ALVEO ADK2 CARD Packaging: Box Type: Debugger Contents: Board(s) Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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XC6SLX75-2FG484I | AMD |
Description: IC FPGA 280 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74637 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 5831 Total RAM Bits: 3170304 Number of I/O: 280 DigiKey Programmable: Not Verified |
товар відсутній |
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XC4028XLA-09HQ160C | AMD |
Description: FPGA, 1024 CLBS, 18000 GATES Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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| XC4028XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 106 шт: термін постачання 21-31 дні (днів) |
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| XC4036XL-2HQ160C | AMD |
Description: IC FPGA 129 I/O 160QFP Packaging: Bulk Package / Case: 160-BQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 36000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 3078 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 1296 Total RAM Bits: 41472 Number of I/O: 129 DigiKey Programmable: Not Verified |
на замовлення 172 шт: термін постачання 21-31 дні (днів) |
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A-U55C-P00G-PQ-G | AMD |
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE Packaging: Box Power (Watts): 150W Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 55°C Bandwidth: 460GB/s Cooling Type: Heat Sink LUTs: 1304k |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-2UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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XCZU1CG-1UBVA494I | AMD |
Description: IC ZUP MPSOC CG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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XCZU1EG-2UBVA494I | AMD |
Description: IC ZUP MPSOC EG A53 FPGA 494BGA Packaging: Tray Package / Case: 494-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells Peripherals: DMA, WDT Supplier Device Package: 494-FCBGA (14x14) Architecture: MPU, FPGA Part Status: Active |
на замовлення 126 шт: термін постачання 21-31 дні (днів) |
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XA7A15T-1CSG325Q | AMD |
Description: IC FPGA 150 I/O 324CSBGA Packaging: Bulk Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Grade: Automotive Number of I/O: 150 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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XC3142-TQ144IPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Logic Elements/Cells: 144 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 96 DigiKey Programmable: Not Verified |
на замовлення 440 шт: термін постачання 21-31 дні (днів) |
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XC3142-PQ100CPH | AMD |
Description: XC3142 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 100-BQFP Mounting Type: Surface Mount Number of Gates: 3000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 144 Supplier Device Package: 100-PQFP (20x14) Number of LABs/CLBs: 144 Total RAM Bits: 30784 Number of I/O: 82 DigiKey Programmable: Not Verified |
на замовлення 1941 шт: термін постачання 21-31 дні (днів) |
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XC3130-PG84CPH | AMD |
Description: XC3130 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 84-BCPGA Mounting Type: Through Hole Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 84-CPGA (28x28) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 74 DigiKey Programmable: Not Verified |
на замовлення 213 шт: термін постачання 21-31 дні (днів) |
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| XC95144XV-7TQ144C | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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| XC95144-10PQ160I4307 | AMD |
Description: FLASH PLD, 10NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
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| HW-IMX547M-SK-G | AMD |
Description: SONY IMX547 MONO CAMERA KRIA BD Packaging: Box For Use With/Related Products: KR260 Accessory Type: Camera Part Status: Active |
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| HW-IMX547C-SK-G | AMD |
Description: SONY IMX547 COLOR CAMERA KRIA BD Packaging: Box For Use With/Related Products: KR260 Accessory Type: Camera Part Status: Active |
товар відсутній |
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| XC3195-PG175IPH | AMD |
Description: XC3195 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BCPGA Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 175-CPGA (42.16x42.16) Number of LABs/CLBs: 484 Total RAM Bits: 94944 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 329 шт: термін постачання 21-31 дні (днів) |
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XCKU035-3FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
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XCKU035-2FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
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XCKU035-L1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.880V ~ 0.979V Number of Logic Elements/Cells: 444343 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 25391 Total RAM Bits: 19456000 Number of I/O: 312 DigiKey Programmable: Not Verified |
товар відсутній |
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| XC4020E-2HQ240C | AMD |
Description: IC FPGA 193 I/O 240QFP |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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XCAU15P-2SBVB484I | AMD |
Description: IC FPGA ARTIXUP 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 170100 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 9720 Total RAM Bits: 5347738 Part Status: Active Number of I/O: 204 DigiKey Programmable: Not Verified |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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XCAU15P-1SBVB484I | AMD |
Description: IC FPGA ARTIXUP 484BGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 170100 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 9720 Total RAM Bits: 5347738 Part Status: Active Number of I/O: 204 DigiKey Programmable: Not Verified |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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XC5204-5PQ160C | AMD |
Description: FPGA, 120 CLBS, 4000 GATES Packaging: Bulk Part Status: Active Package / Case: 160-BQFP Mounting Type: Surface Mount Number of Gates: 6000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 480 Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 120 Number of I/O: 124 DigiKey Programmable: Not Verified |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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XC3130-4PC68C | AMD |
Description: FPGA, 100 CLBS, 2K GATES Packaging: Bulk Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Number of Gates: 2000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 100 Supplier Device Package: 68-PLCC (24.23x24.23) Number of LABs/CLBs: 100 Total RAM Bits: 22176 Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 481 шт: термін постачання 21-31 дні (днів) |
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XC3195-5PQ208C | AMD |
Description: FPGA, 484 CLBS, 6500 GATES Packaging: Bulk Part Status: Active |
на замовлення 100 шт: термін постачання 21-31 дні (днів) |
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XC3195-4PQ208C | AMD |
Description: FPGA, 484 CLBS, 6500 GATES Packaging: Bulk Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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| EF-DI-50G-RS-FEC-SITE | AMD |
Description: LOGICORE 50G IEEE 802.3 REED-SOL Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered Part Status: Active |
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| EF-DI-32G-FC-FEC-SITE | AMD |
Description: LOGICORE, 32G FIBRE CHANNEL REED Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered Part Status: Active |
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XC4005XL-2TQ144C | AMD |
Description: IC FPGA 112 I/O 144TQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 5000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 466 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 196 Total RAM Bits: 6272 Number of I/O: 112 DigiKey Programmable: Not Verified |
на замовлення 129 шт: термін постачання 21-31 дні (днів) |
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XC3195-3PQ208C | AMD |
Description: FPGA, 484 CLBS, 6500 GATES Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 484 Total RAM Bits: 94944 Number of I/O: 176 |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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XC3195-PQ208CPH | AMD |
Description: XC3195 - XC3000 SERIES FIELD PRO Packaging: Bulk Part Status: Active |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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XCZU2EG-2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
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XCZU2EG-L2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
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XCZU2EG-1UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
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XCZU3EG-L2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
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XCZU3EG-L1UBVA530I | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
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XCZU2EG-L1UBVA530I | AMD |
Description: IC ZUP MPSOC A53 FPGA LP 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
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XCZU3EG-2UBVA530E | AMD |
Description: IC ZUP MPSOC A53 FPGA 530BGA Packaging: Tray Package / Case: 530-WFBGA, FCBGA Speed: 533MHz, 600MHz, 1.333GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 530-FCBGA (16x9.5) Architecture: MPU, FPGA |
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XA7S6-1CSGA225I | AMD |
Description: IC FPGA 100 I/O 225CSGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 225-CSGA (13x13) Number of LABs/CLBs: 469 Total RAM Bits: 184320 Grade: Automotive Number of I/O: 100 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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XA7S6-1CPGA196Q | AMD |
Description: IC FPGA 100 I/O 196CSPBGA Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSPBGA (8x8) Number of LABs/CLBs: 469 Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
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XA7S6-2CPGA196I | AMD |
Description: IC FPGA 100 I/O 196CSPBGA Packaging: Tray Package / Case: 196-TFBGA, CSBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 196-CSPBGA (8x8) Number of LABs/CLBs: 469 Total RAM Bits: 184320 Grade: Automotive Number of I/O: 100 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
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| XA7S6-1CSGA225Q | AMD |
Description: IC FPGA 100 I/O 225CSBGA Packaging: Tray Package / Case: 225-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 6000 Supplier Device Package: 225-CSPBGA (13x13) Number of LABs/CLBs: 469 Total RAM Bits: 184320 Number of I/O: 100 DigiKey Programmable: Not Verified |
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XC4020XL-1HT144I | AMD |
Description: IC FPGA 113 I/O 144TQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 20000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 1862 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 784 Total RAM Bits: 25088 Number of I/O: 113 DigiKey Programmable: Not Verified |
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| XC4020E-4HQ240C | AMD |
Description: IC FPGA 193 I/O 240QFP Packaging: Bulk Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 20000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1862 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 784 Total RAM Bits: 25088 Part Status: Obsolete Number of I/O: 193 DigiKey Programmable: Not Verified |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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XC1701LPC20I | AMD |
Description: CONFIG MEMORY, 1MX1, SERIAL |
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XC1765ELPC20C | AMD |
Description: IC PROM SER C-TEMP 3.3V 20-PLCC Packaging: Tube Package / Case: 20-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-PLCC (9x9) DigiKey Programmable: Not Verified |
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XC17256ELPC20C | AMD |
Description: IC PROM SER C-TEMP 256K 20-PLCC |
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XC3195-3PQ160C | AMD |
Description: FPGA, 484 CLBS, 6500 GATES Packaging: Bulk Package / Case: 160-BQFP Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 484 Total RAM Bits: 94944 Number of I/O: 138 DigiKey Programmable: Not Verified |
на замовлення 201 шт: термін постачання 21-31 дні (днів) |
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| XCVM1302-1LSENSVF1369 |
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Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 312682.52 грн |
| XCVM1802-2MSEVSVD1760 |
|
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
товар відсутній
| XCVM1402-1LSIVSVD1760 |
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Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
товар відсутній
| XCZU43DR-1FFVE1156I |
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Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCVC1802-1MLIVSVA2197 |
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Виробник: AMD
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSAL AICORE FPGA 2197BGA
Packaging: Tray
Package / Case: 2197-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 2197-FCBGA (45x45)
Architecture: MPU, FPGA
Part Status: Active
товар відсутній
| XCZU42DR-2FFVE1156E |
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Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCVM1402-2MSINSVF1369 |
|
Виробник: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Part Status: Active
товар відсутній
| XCZU42DR-1FFVE1156E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1156BGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 489K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
товар відсутній
| XCZU46DR-1FFVH1760E |
|
Виробник: AMD
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Description: IC ZUP RFSOC A53 FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
товар відсутній
| XC6SLX16-N3CPG196I |
|
Виробник: AMD
Description: IC FPGA 106 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 14579
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 1139
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 196CSBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 14579
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 1139
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
товар відсутній
| HW-ADK-2-0-G |
|
Виробник: AMD
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
Description: DEBUG KIT ALVEO ADK2 CARD
Packaging: Box
Type: Debugger
Contents: Board(s)
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 35303.53 грн |
| XC6SLX75-2FG484I |
|
Виробник: AMD
Description: IC FPGA 280 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA 280 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74637
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5831
Total RAM Bits: 3170304
Number of I/O: 280
DigiKey Programmable: Not Verified
товар відсутній
| XC4028XLA-09HQ160C |
|
Виробник: AMD
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 72 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 3048.69 грн |
| XC4028XL-2HQ160C |
|
Виробник: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 106 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6139.21 грн |
| XC4036XL-2HQ160C |
|
Виробник: AMD
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC FPGA 129 I/O 160QFP
Packaging: Bulk
Package / Case: 160-BQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 36000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3078
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 1296
Total RAM Bits: 41472
Number of I/O: 129
DigiKey Programmable: Not Verified
на замовлення 172 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7267.69 грн |
| A-U55C-P00G-PQ-G |
|
Виробник: AMD
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
Packaging: Box
Power (Watts): 150W
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Description: BD U55C DCAB ALVEO QSFP28/2 PCIE
Packaging: Box
Power (Watts): 150W
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 405034.28 грн |
| XCZU1CG-2UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 26802.52 грн |
| XCZU1CG-1UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC CG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 21542.39 грн |
| XCZU1EG-2UBVA494I |
|
Виробник: AMD
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
Description: IC ZUP MPSOC EG A53 FPGA 494BGA
Packaging: Tray
Package / Case: 494-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 81K+ Logic Cells
Peripherals: DMA, WDT
Supplier Device Package: 494-FCBGA (14x14)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 126 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 32292.97 грн |
| XA7A15T-1CSG325Q |
|
Виробник: AMD
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 150 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Grade: Automotive
Number of I/O: 150
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товар відсутній
| XC3142-TQ144IPH |
|
Виробник: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 144
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 144
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 440 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 23+ | 981.01 грн |
| XC3142-PQ100CPH |
|
Виробник: AMD
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
Description: XC3142 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Number of Gates: 3000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 144
Supplier Device Package: 100-PQFP (20x14)
Number of LABs/CLBs: 144
Total RAM Bits: 30784
Number of I/O: 82
DigiKey Programmable: Not Verified
на замовлення 1941 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 18+ | 1226.28 грн |
| XC3130-PG84CPH |
|
Виробник: AMD
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-BCPGA
Mounting Type: Through Hole
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-CPGA (28x28)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: XC3130 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 84-BCPGA
Mounting Type: Through Hole
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 84-CPGA (28x28)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 74
DigiKey Programmable: Not Verified
на замовлення 213 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 17+ | 1307.52 грн |
| XC95144XV-7TQ144C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| XC95144-10PQ160I4307 |
|
Виробник: AMD
Description: FLASH PLD, 10NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 10NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товар відсутній
| HW-IMX547M-SK-G |
|
Виробник: AMD
Description: SONY IMX547 MONO CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Part Status: Active
Description: SONY IMX547 MONO CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Part Status: Active
товар відсутній
| HW-IMX547C-SK-G |
|
Виробник: AMD
Description: SONY IMX547 COLOR CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Part Status: Active
Description: SONY IMX547 COLOR CAMERA KRIA BD
Packaging: Box
For Use With/Related Products: KR260
Accessory Type: Camera
Part Status: Active
товар відсутній
| XC3195-PG175IPH |
|
Виробник: AMD
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 329 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 8+ | 2779.75 грн |
| XCKU035-3FBVA676E |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товар відсутній
| XCKU035-2FBVA676E |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товар відсутній
| XCKU035-L1FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 444343
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 25391
Total RAM Bits: 19456000
Number of I/O: 312
DigiKey Programmable: Not Verified
товар відсутній
| XC4020E-2HQ240C |
|
Виробник: AMD
Description: IC FPGA 193 I/O 240QFP
Description: IC FPGA 193 I/O 240QFP
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 36837.22 грн |
| XCAU15P-2SBVB484I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
на замовлення 70 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 27257.72 грн |
| XCAU15P-1SBVB484I |
|
Виробник: AMD
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIXUP 484BGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 170100
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 9720
Total RAM Bits: 5347738
Part Status: Active
Number of I/O: 204
DigiKey Programmable: Not Verified
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 21351.75 грн |
| XC5204-5PQ160C |
|
Виробник: AMD
Description: FPGA, 120 CLBS, 4000 GATES
Packaging: Bulk
Part Status: Active
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 120
Number of I/O: 124
DigiKey Programmable: Not Verified
Description: FPGA, 120 CLBS, 4000 GATES
Packaging: Bulk
Part Status: Active
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Number of Gates: 6000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 480
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 120
Number of I/O: 124
DigiKey Programmable: Not Verified
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 11+ | 2144.8 грн |
| XC3130-4PC68C |
|
Виробник: AMD
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: FPGA, 100 CLBS, 2K GATES
Packaging: Bulk
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Number of Gates: 2000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 100
Supplier Device Package: 68-PLCC (24.23x24.23)
Number of LABs/CLBs: 100
Total RAM Bits: 22176
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 481 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 37+ | 595.73 грн |
| XC3195-5PQ208C |
|
на замовлення 100 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 3395.07 грн |
| XC3195-4PQ208C |
|
на замовлення 18 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 4073.74 грн |
| EF-DI-50G-RS-FEC-SITE |
Виробник: AMD
Description: LOGICORE 50G IEEE 802.3 REED-SOL
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE 50G IEEE 802.3 REED-SOL
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| EF-DI-32G-FC-FEC-SITE |
Виробник: AMD
Description: LOGICORE, 32G FIBRE CHANNEL REED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: LOGICORE, 32G FIBRE CHANNEL REED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Part Status: Active
товар відсутній
| XC4005XL-2TQ144C |
Виробник: AMD
Description: IC FPGA 112 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 466
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Total RAM Bits: 6272
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC FPGA 112 I/O 144TQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 466
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Total RAM Bits: 6272
Number of I/O: 112
DigiKey Programmable: Not Verified
на замовлення 129 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 17+ | 1234.29 грн |
| XC3195-3PQ208C |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 176
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 176
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 4705.63 грн |
| XC3195-PQ208CPH |
|
на замовлення 56 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2580.61 грн |
| XCZU2EG-2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товар відсутній
| XCZU2EG-L2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товар відсутній
| XCZU2EG-1UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товар відсутній
| XCZU3EG-L2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товар відсутній
| XCZU3EG-L1UBVA530I |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товар відсутній
| XCZU2EG-L1UBVA530I |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA LP 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товар відсутній
| XCZU3EG-2UBVA530E |
|
Виробник: AMD
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
товар відсутній
| XA7S6-1CSGA225I |
|
Виробник: AMD
Description: IC FPGA 100 I/O 225CSGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 225-CSGA (13x13)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Grade: Automotive
Number of I/O: 100
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 100 I/O 225CSGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 225-CSGA (13x13)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Grade: Automotive
Number of I/O: 100
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товар відсутній
| XA7S6-1CPGA196Q |
|
Виробник: AMD
Description: IC FPGA 100 I/O 196CSPBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 196CSPBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
| XA7S6-2CPGA196I |
|
Виробник: AMD
Description: IC FPGA 100 I/O 196CSPBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Grade: Automotive
Number of I/O: 100
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 100 I/O 196CSPBGA
Packaging: Tray
Package / Case: 196-TFBGA, CSBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 196-CSPBGA (8x8)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Grade: Automotive
Number of I/O: 100
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товар відсутній
| XA7S6-1CSGA225Q |
|
Виробник: AMD
Description: IC FPGA 100 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC FPGA 100 I/O 225CSBGA
Packaging: Tray
Package / Case: 225-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 6000
Supplier Device Package: 225-CSPBGA (13x13)
Number of LABs/CLBs: 469
Total RAM Bits: 184320
Number of I/O: 100
DigiKey Programmable: Not Verified
товар відсутній
| XC4020XL-1HT144I |
|
Виробник: AMD
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Number of I/O: 113
DigiKey Programmable: Not Verified
Description: IC FPGA 113 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Number of I/O: 113
DigiKey Programmable: Not Verified
товар відсутній
| XC4020E-4HQ240C |
|
Виробник: AMD
Description: IC FPGA 193 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 193
DigiKey Programmable: Not Verified
Description: IC FPGA 193 I/O 240QFP
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 20000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 193
DigiKey Programmable: Not Verified
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 22927.45 грн |
| XC1765ELPC20C |
|
Виробник: AMD
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
товар відсутній
| XC3195-3PQ160C |
|
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 138
DigiKey Programmable: Not Verified
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 138
DigiKey Programmable: Not Verified
на замовлення 201 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 12+ | 1841.56 грн |